Dual chamber loop heat pipe structure with multiple wick layers

• US 9,504,185 B2
• Filed: 07/11/2011
• Issued: 11/22/2016
• Est. Priority Date: 03/29/2011
• Status: Active Grant

• Current Assignee: Asia Vital Components Company Limited
• Original Assignee: Asia Vital Components Company Limited
• Inventors: Chiang, Kuei-Feng, Xiang, Jun, Zhou, Xiao-Xiang
• Primary Examiner(s): Tran, Len
• Assistant Examiner(s): JONES, GORDON A
• Application Number:
  US13/179,567
• Publication Number:
  US 20120247736A1
• Time in Patent Office: 1,961 Days
• Field of Search: 165/104.26, 165/104.33, 361/700, 257/715
• US Class Current: 1/1
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.

Claims

1. A loop heat pipe structure, comprising:

a transport pipe having a first end and a second end, and internally defining a flow passage communicating with the first and the second end;

an evaporator having a first chamber and a second chamber adjoining the first chamber, the first chamber and the second chamber having a common bottom comprising a bottom plate, and having a working fluid filled therein;

the first chamber having a first coupling hole coupled with the first end of the transport pipe; and

the second chamber having a second coupling hole coupled with the second end of the transport pipe;

a first wick layer located substantially in the second chamber atop the bottom and extending minimally into the first chamber, the first chamber being generally wick-free;

a second wick layer being located atop and covering the first wick layer;

wherein the first wick layer has an effective capillary radius smaller and a thermal conductively higher than those of the second wick layer

a plurality of grooves being provided under the first wick layer; and

wherein the second wick layer does not extend beyond the first wick layer into the first chamber;

a partition extending from a top of the evaporator to the second wick layer and separating the first chamber and the second chamber to form two distinct chambers wherein the only direct passage for the working fluid between the second chamber and the adjoining first chamber in the evaporator is through the wick layers;

wherein the first coupling hole is an outlet to carry the working fluid away from the evaporator, and the second coupling hole is an inlet for returning the working fluid into the evaporator; and

wherein the evaporator includes a cover and said bottom plate correspondingly closed to each other to define the first and the second chamber therebetween;

the first and the second wick layer being provided on the bottom plate, and the grooves being selectively provided on any one of the first wick layer and the bottom plate of the evaporator.

2. The loop heat pipe structure as claimed in claim 1, wherein the transport pipe is selectively communicably provided on any one of the first and the second chamber.

3. The loop heat pipe structure as claimed in claim 1, wherein the first and the second wick layer are selected from the group consisting of sintered powder bodies, net-like bodies, carbon fibers, and graphite.

4. The loop heat pipe structure as claimed in claim 1, wherein the transport pipe is extended through a plurality of radiating fins.

5. The loop heat pipe structure as claimed in claim 1, wherein the cover and the bottom plate are selectively made of different materials or identical material.

6. The loop heat pipe structure as claimed in claim 1, wherein the cover is made of a material selected from the group consisting of a stainless steel material, a carbon steel material, and a polymeric material.

7. The loop heat pipe structure as claimed in claim 1, wherein the second wick layer has permeability larger than that of the first wick layer.

8. The loop heat pipe structure as claimed in claim 1, wherein the transport pipe is extended through a condensing device.

9. The loop heat pipe structure as claimed in claim 1, wherein the transport pipe is extended through a water-cooled device.