Heatpipe imbedded coldplate enhancing IGBT heat spreading
First Claim
1. A cold plate for a power circuit, the power circuit including a plurality of transistors, each transistor of the plurality of transistors including a plurality of dies, the cold plate comprising:
- a liquid cooling system,the liquid cooling system including a plurality of cooling channels,each of the plurality of cooling channels being aligned with at least one die of the plurality of dies, anda heat sink associated with each of the plurality of cooling channels; and
a plurality of heat pipes,at least one of the plurality of heat pipes being aligned, substantially in parallel, with at least one of the plurality of cooling channels and at least one die of the plurality of dies,each of the plurality of heat pipes including a wick lining an interior of the heat pipe, a vapor flow area, and a fluid.
1 Assignment
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Accused Products
Abstract
A cold plate for a power circuit is disclosed. The power circuit includes a plurality of transistors and each of the plurality of transistors includes a plurality of dies. The cold plate includes a liquid cooling system that includes a plurality of cooling channels and each of the plurality of cooling channels is aligned with at least one die. The liquid cooling system includes a heat sink associated with each of the plurality of cooling channels. The cold plate further includes a plurality of heat pipes, wherein each of the plurality of heat pipes is aligned with at least one of the plurality of cooling channels and at least one die. Each heat pipe includes a wick lining an interior of the heat pipe, a vapor flow area, and a fluid.
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Citations
20 Claims
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1. A cold plate for a power circuit, the power circuit including a plurality of transistors, each transistor of the plurality of transistors including a plurality of dies, the cold plate comprising:
a liquid cooling system, the liquid cooling system including a plurality of cooling channels, each of the plurality of cooling channels being aligned with at least one die of the plurality of dies, and a heat sink associated with each of the plurality of cooling channels; and
a plurality of heat pipes,at least one of the plurality of heat pipes being aligned, substantially in parallel, with at least one of the plurality of cooling channels and at least one die of the plurality of dies, each of the plurality of heat pipes including a wick lining an interior of the heat pipe, a vapor flow area, and a fluid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for cooling a power circuit, the power circuit including at least one transistor, the at least one transistor including at least one die, the method comprising:
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transferring heat from the at least one die using at least one heat pipe, the at least one heat pipe being aligned, substantially in parallel, with the at least one die, the at least one heat pipe including a wick lining an interior of the at least one heat pipe, a vapor flow area, and a fluid; transferring heat from the at least one heat pipe to a cooling channel, the cooling channel being aligned with the at least one heat pipe and the at least one die; and transferring heat from the cooling channel to a heat sink associated with the cooling channel. - View Dependent Claims (11, 12, 13, 14)
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15. A power circuit, comprising:
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a plurality of transistors, each transistor, of the plurality of transistors, including a plurality of dies; and a cold plate in thermal connection with the plurality of transistors, the cold plate including; a liquid cooling system, the liquid cooling system including a plurality of cooling channels, each cooling channel, of the plurality of cooling channels, being aligned with a respective at least one die of the plurality of dies, and a heat sink associated with each cooling channel of the plurality of cooling channels; and a plurality of heat pipes, each heat pipe of the plurality of heat pipes being aligned, substantially in parallel, with at least one of the plurality of cooling channels and the respective at least one die of the plurality of dies, each heat pipe of the plurality of heat pipes including a wick lining an interior of the heat pipe, a vapor flow area, and a fluid. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification