Thermoelectric-enhanced, inlet air-cooled thermal conductors
First Claim
1. A cooling apparatus comprising:
- a thermal conductor to facilitate cooling a heat-dissipating component(s) within an electronics enclosure, the electronics enclosure comprising an air inlet side through which an airflow ingresses into the electronics enclosure, the thermal conductor comprising;
a first conductor portion to couple to the heat-dissipating component(s) to conduct heat therefrom; and
a second conductor portion to position along the air inlet side of the enclosure, wherein when operational, the first conductor portion transfers heat, at least in part, from the heat-dissipating component(s) to the second conductor portion;
at least one air-cooled heat sink coupled to the second conductor portion of the thermal conductor to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the electronics enclosure through the air inlet side;
at least one thermoelectric device coupled to at least one of the first conductor portion or the second conductor portion of the thermal conductor to selectively provide active auxiliary cooling to the thermal conductor; and
a controller controlling operation of the at least one thermoelectric device and selectively switching operation of the cooling apparatus between an active cooling mode, where the at least one thermoelectric device is active, and a passive cooling mode, where the at least one thermoelectric device is inactive.
1 Assignment
0 Petitions
Accused Products
Abstract
A cooling apparatus is provided, which includes: a thermal conductor to cool a heat-dissipating component(s) of an electronics enclosure, the enclosure including an air inlet side through which airflow ingresses. The thermal conductor includes a first conductor portion coupled to the heat-dissipating component(s), and a second conductor portion positioned along the enclosure'"'"'s air inlet side. The apparatus further includes one or more air-cooled heat sinks coupled to the second conductor portion to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the enclosure, and one or more thermoelectric devices coupled to at least one of the first or second conductor portions to selectively provide auxiliary cooling. A controller controls operation of the thermoelectric device(s) and selectively switches operation of the cooling apparatus between an active cooling mode, where the thermoelectric device(s) is active, and a passive cooling mode, where the thermoelectric device is inactive.
37 Citations
19 Claims
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1. A cooling apparatus comprising:
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a thermal conductor to facilitate cooling a heat-dissipating component(s) within an electronics enclosure, the electronics enclosure comprising an air inlet side through which an airflow ingresses into the electronics enclosure, the thermal conductor comprising; a first conductor portion to couple to the heat-dissipating component(s) to conduct heat therefrom; and a second conductor portion to position along the air inlet side of the enclosure, wherein when operational, the first conductor portion transfers heat, at least in part, from the heat-dissipating component(s) to the second conductor portion; at least one air-cooled heat sink coupled to the second conductor portion of the thermal conductor to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the electronics enclosure through the air inlet side; at least one thermoelectric device coupled to at least one of the first conductor portion or the second conductor portion of the thermal conductor to selectively provide active auxiliary cooling to the thermal conductor; and a controller controlling operation of the at least one thermoelectric device and selectively switching operation of the cooling apparatus between an active cooling mode, where the at least one thermoelectric device is active, and a passive cooling mode, where the at least one thermoelectric device is inactive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A cooled electronic system comprising:
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an electronics enclosure, the electronics enclosure including an air inlet side through which an airflow ingresses into the electronics enclosure; multiple heat-dissipating components disposed within the electronics enclosure; and a cooling apparatus, the cooling apparatus comprising; a thermal conductor coupled to one or more heat-dissipating components of the multiple heat-dissipating components, the thermal conductor comprising; a first conductor portion coupled to the one or more heat-dissipating components to conduct heat therefrom; and a second conductor portion positioned along the air inlet side of the electronics enclosure, wherein the first conductor portion transfers heat, at least in part, from the one or more heat-dissipating components to the second conductor portion; at least one air-cooled heat sink coupled to the second conductor portion of the thermal conductor along the air inlet side of the electronics enclosure to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the electronics enclosure; at least one thermoelectric device coupled to at least one of the first conductor portion or the second conductor portion of the thermal conductor to selectively provide active auxiliary cooling to the thermal conductor; and a controller controlling operation of the at least one thermoelectric device and selectively switching operation of the cooling apparatus between an active cooling mode, where the at least one thermoelectric device is active, and a passive cooling mode, where the at least one thermoelectric device is inactive. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification