Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer

• US 9,504,840 B2
• Filed: 01/09/2015
• Issued: 11/29/2016
• Est. Priority Date: 01/31/2011
• Status: Active Grant

• Current Assignee: Heraeus Deutschland GmbH & Co. KG (Heraeus Holding GMBH)
• Original Assignee: Heraeus Deutschland GmbH & Co. KG (Heraeus Holding GMBH)
• Inventors: Pavlovic, Goran, Glynn, Jeremy
• Primary Examiner(s): Patel, Devang R
• Application Number:
  US14/593,637
• Publication Number:
  US 20150122875A1
• Time in Patent Office: 690 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: Y10T 29/49227 Insulator making

Abstract

One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.

Claims

1. A method for the manufacture of an electrical bushing for an implantable medical device, the method comprising:

a. generating at least one base body green compact for at least one base body from an insulating composition of materials;

b. forming at least one cermet-containing conducting element green compact for at least one conducting element;

c. introducing the at least one conducting element green compact into the base body green compact;

d. subjecting the at least one base body green compact and at least one conducting element green body compact to firing in order to obtain at least one base body having at least one conducting element;

e. applying a connecting layer onto the at least one conducting element, the connecting layer applied in a thickness range between 0.1 μ

m to 5 μ

m to provide good foundation for further contacts.

2. The method according to claim 1, whereby the connecting layer is made from a metal.

3. The method according to claim 2, whereby the metal is selected from a group consisting of gold, silver, and platinum.

4. The method according to claim 2, whereby the metal comprises two metals selected from a group consisting of gold, silver, and platinum.

5. The method according to claim 1, whereby step a) comprises a partial sintering of the base body green compact.

6. The method according to claim 1, whereby step b) comprises a partial sintering of the conducting element green compact.

7. The method according to claim 1, whereby the connecting layer is applied by printing, electroplating, micro-dosing or through a vaporization process or a combination thereof.

8. The method according to claim 1 further comprising forming a bonding agent layer between the conducting element and the connecting layer.

9. The method according to claim 8, wherein the bonding agent layer comprises at least one from a group comprising chromium, titanium, tantalum, and zirconium.

10. The method according to claim 1, further comprising forming an electrical bushing from the at least one base body having the at least one conducting element.

11. The method according to claim 1, further comprising attaching a wire-like structure adjacent to the at least one connecting layer.

12. The method according to claim 1, further comprising forming at least one base body brown compact from the at least one base body green compact.

13. The method according to claim 1, further comprising forming at least one cermet-containing conducting element brown compact from the at least one cermet-containing conducting element green compact.

14. The method according to claim 1, further comprising forming the electrical bushing using at least one of a base body brown compact and a cermet-containing conducting element brown compact.

15. A method for the manufacture of an electrical bushing for an implantable medical device, the method comprising:

generating at least one base body green compact for at least one base body from an insulating composition of materials;

forming at least one cermet-containing conducting element green compact for at least one conducting element;

introducing the at least one conducting element green compact into the base body green compact;

subjecting the at least one base body green compact to the at least one base body green compact and at least one conducting element green body compact to firing in order to obtain at least one base body having at least one conducting element;

applying a connecting layer onto the at least one conducting element; and

forming a bonding agent layer between the conducting element and the connecting layer.

16. The method of claim 15, wherein the connecting layer comprises gold and is applied to the conducting element through a cathode sputtering process.

17. The method of claim 16, wherein the cathode sputtering process proceeds in a pressure range from 1*10-3 hPa to 9*10-2 hPa and at a temperature between 25°

C. and 250°

C.