Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof
First Claim
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1. A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, comprising:
- providing a silicon-on-insulator (SOI) substrate comprising a silicon substrate layer, an insulator layer and a silicon layer;
forming a MEMS device in the silicon layer of the SOI substrate;
forming one or more etching channels adjacent to the MEMS device;
then providing one or more cavities below the MEMS device; and
then forming one or more cavities above the MEMS device,wherein forming the one or more etching channels comprises forming one or more sidewall etching channels in the substrate by partially etching the silicon layer at a periphery of the MEMS device.
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Abstract
A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, including providing a substrate; forming a MEMS device on the substrate; forming one or more etching channels adjacent to the MEMS device; providing one or more cavities below the MEMS device; and forming one or more cavities above the MEMS device.
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11 Claims
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1. A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, comprising:
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providing a silicon-on-insulator (SOI) substrate comprising a silicon substrate layer, an insulator layer and a silicon layer; forming a MEMS device in the silicon layer of the SOI substrate; forming one or more etching channels adjacent to the MEMS device; then providing one or more cavities below the MEMS device; and then forming one or more cavities above the MEMS device, wherein forming the one or more etching channels comprises forming one or more sidewall etching channels in the substrate by partially etching the silicon layer at a periphery of the MEMS device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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