Fingerprint sensing device with heterogeneous coating structure comprising an adhesive
First Claim
1. A fingerprint sensing device comprising:
- a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;
a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of cavities filled with an adhesive;
wherein locations of said cavities correspond to locations of said sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and
wherein a dielectric constant of said adhesive is higher than a dielectric constant of said coating material and a dielectric constant of said coating material is in the range of 2-5; and
a protective plate attached to said sensing chip by means of said adhesive.
3 Assignments
0 Petitions
Accused Products
Abstract
A fingerprint sensing device comprises a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with an adhesive; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the adhesive is higher than a dielectric constant of the coating material; and a protective plate attached to the sensing chip by means of the adhesive. Another sensing device is disclosed, where the coating layer comprises trenches filled with an adhesive, and where the coating has a higher dielectric constant than the adhesive. Associated methods of manufacturing are also disclosed.
25 Citations
28 Claims
-
1. A fingerprint sensing device comprising:
-
a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device; a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of cavities filled with an adhesive;
wherein locations of said cavities correspond to locations of said sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and
wherein a dielectric constant of said adhesive is higher than a dielectric constant of said coating material and a dielectric constant of said coating material is in the range of 2-5; anda protective plate attached to said sensing chip by means of said adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method for manufacturing a fingerprint sensing device, said fingerprint sensing device comprising:
- a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;
a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of cavities filled with an adhesive;
wherein locations of said cavities correspond to locations of said sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and
wherein a dielectric constant of said adhesive is higher than a dielectric constant of said coating material and a dielectric constant of said coating material is in the range of 2-5; and
a protective plate attached to said sensing chip by means of said adhesive, said method comprising;providing said sensing chip; depositing said layer of said coating material covering said array of conductive sensing elements; forming said plurality of cavities in said coating material; providing said adhesives to fill said cavities; and attaching said protective plate to said sensing device by means of said adhesive. - View Dependent Claims (10, 11, 12, 13)
- a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;
-
14. A fingerprint sensing device comprising:
-
a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device; a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of trenches filled with an adhesive;
wherein said trenches are aligned with areas between said sensing elements; and
wherein a dielectric constant of said adhesive is lower than a dielectric constant of said coating material; anda protective plate attached to said sensing chip by means of said adhesive.
-
-
15. A method for manufacturing a fingerprint sensing device, said fingerprint sensing device comprising:
- a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;
a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of trenches filled with an adhesive;
wherein said trenches are aligned with areas between said sensing elements; and
wherein a dielectric constant of said adhesive is lower than a dielectric constant of said coating material; and
a protective plate attached to said sensing chip by means of said adhesive, said method comprising;providing said sensing chip; depositing said layer of said coating material covering said array of sensing elements; forming said plurality of trenches in said coating material; providing said adhesive to fill said trenches; and attaching said protective plate to said sensing device by means of said adhesive.
- a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;
-
16. A fingerprint sensing device comprising:
-
a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device; a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of cavities filled with an adhesive;
wherein locations of said cavities correspond to locations of said sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and
wherein a dielectric constant of said adhesive is higher than a dielectric constant of said coating material and a ratio between said dielectric constant of said adhesive and said dielectric constant of said coating material is equal to or larger than 2;
1; anda protective plate attached to said sensing chip by means of said adhesive. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
-
-
24. A method for manufacturing a fingerprint sensing device, said fingerprint sensing device comprising:
- a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;
a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of cavities filled with an adhesive;
wherein locations of said cavities correspond to locations of said sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and
wherein a dielectric constant of said adhesive is higher than a dielectric constant of said coating material and a ratio between said dielectric constant of said adhesive and said dielectric constant of said coating material is equal to or larger than 2;
1; and
a protective plate attached to said sensing chip by means of said adhesive, said method comprising;providing said sensing chip; depositing said layer of said coating material covering said array of conductive sensing elements; forming said plurality of cavities in said coating material; providing an said adhesive to fill said cavities; and attaching said protective plate to said sensing device by means of said adhesive. - View Dependent Claims (25, 26, 27, 28)
- a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;
Specification