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Fingerprint sensing device with heterogeneous coating structure comprising an adhesive

  • US 9,507,992 B1
  • Filed: 01/18/2016
  • Issued: 11/29/2016
  • Est. Priority Date: 06/08/2015
  • Status: Active Grant
First Claim
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1. A fingerprint sensing device comprising:

  • a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;

    a coating material arranged in a layer on top of said array of sensing elements, said coating material comprising a plurality of cavities filled with an adhesive;

    wherein locations of said cavities correspond to locations of said sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and

    wherein a dielectric constant of said adhesive is higher than a dielectric constant of said coating material and a dielectric constant of said coating material is in the range of 2-5; and

    a protective plate attached to said sensing chip by means of said adhesive.

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