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Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus

  • US 9,508,772 B2
  • Filed: 01/13/2016
  • Issued: 11/29/2016
  • Est. Priority Date: 03/25/2010
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a first material layer including a two-dimensional array area having a plurality of units arranged in a two-dimensional array and a first wiring layer;

    a second material layer including a second wiring layer; and

    a via passing through the first material layer and reaching a second interconnect provided in the second wiring layer,wherein, the via has a first conductive portion and a second conductive portion, the first conductive portion is connected with a first interconnect provided in the first wiring layer and the second conductive portion is connected with the second interconnect,wherein, a size of the second conductive portion is different from that of the first conductive portion.

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