Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
First Claim
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1. A semiconductor device, comprising:
- a first material layer including a two-dimensional array area having a plurality of units arranged in a two-dimensional array and a first wiring layer;
a second material layer including a second wiring layer; and
a via passing through the first material layer and reaching a second interconnect provided in the second wiring layer,wherein, the via has a first conductive portion and a second conductive portion, the first conductive portion is connected with a first interconnect provided in the first wiring layer and the second conductive portion is connected with the second interconnect,wherein, a size of the second conductive portion is different from that of the first conductive portion.
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Abstract
A semiconductor device including a first material layer adjacent to a second material layer, a first via passing through the first material layer and extending into the second material layer, and a second via extending into the first material layer, where along a common cross section parallel to an interface between the two material layers, the first via has a cross section larger than that of the second via.
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Citations
17 Claims
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1. A semiconductor device, comprising:
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a first material layer including a two-dimensional array area having a plurality of units arranged in a two-dimensional array and a first wiring layer; a second material layer including a second wiring layer; and a via passing through the first material layer and reaching a second interconnect provided in the second wiring layer, wherein, the via has a first conductive portion and a second conductive portion, the first conductive portion is connected with a first interconnect provided in the first wiring layer and the second conductive portion is connected with the second interconnect, wherein, a size of the second conductive portion is different from that of the first conductive portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification