Capacitors in integrated circuits and methods of fabrication thereof

• US 9,508,788 B2
• Filed: 03/13/2013
• Issued: 11/29/2016
• Est. Priority Date: 03/13/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Roehner, Michael, Aresu, Stefano
• Primary Examiner(s): Payen, Marvin
• Application Number:
  US13/798,898
• Publication Number:
  US 20140273394A1
• Time in Patent Office: 1,357 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/707 of thin-film circuits or parts thereof
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5228 Resistive arrangements or effects of, or between, wiring layers other resistive arrangements H01L23/647
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01L 28/20 Resistors
• CPC Class Codes: H01L 28/40 Capacitors
• CPC Class Codes: H01L 28/60 Electrodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In one embodiment, a capacitor includes a first row including a first capacitor element and a second capacitor element coupled in parallel, and a second row including a third capacitor element and a fourth capacitor element coupled in parallel. The first row is coupled in series with the second row. In a metallization level over a workpiece, the second capacitor element is disposed between the first capacitor element and the third capacitor element. In the metallization level, the third capacitor element is disposed between the second capacitor element and the fourth capacitor element. The first, the second, the third, and the fourth capacitor elements are disposed in the metallization level.

Claims

1. A method of making a capacitor array, the method comprising:

forming a first column comprising a first capacitor element and a second capacitor element coupled in series; and

forming a second column comprising a third capacitor element and a fourth capacitor element coupled in series, wherein the first column is coupled in parallel with the second column, wherein the second capacitor element is disposed between the first capacitor element and the fourth capacitor element within a metallization level, wherein the fourth capacitor element is disposed between the second capacitor element and the third capacitor element within the metallization level, wherein the first capacitor element comprises a first plate and a second plate, wherein the second capacitor element comprises a third plate and a fourth plate, wherein the first plate is coupled to the second plate through a first resistor, and wherein the third plate is coupled to the fourth plate through a second resistor.

2. The method of claim 1, wherein the second plate and the third plate comprise a common metal line.

3. The method of claim 1, wherein the capacitor array comprises a poly silicon line disposed below the first and the second capacitor elements over a workpiece, wherein the first resistor comprises a first portion of the poly silicon line, and wherein the second resistor comprises a second portion of the poly silicon line.

4. The method of claim 1, wherein the capacitor array is disposed over a semiconductor body that includes active components or circuits.

5. The method of claim 1, wherein the first column comprises a fifth capacitor element in series with the first and the second capacitor elements, and wherein the second column comprises a sixth capacitor element in series with the third and the fourth capacitor elements.

6. The method of claim 5, wherein the fifth capacitor element is disposed between the first capacitor element and the second capacitor element, wherein the sixth capacitor element is disposed between the third capacitor element and the fourth capacitor element.

7. A capacitor comprising:

a first conductive line oriented along a first direction disposed over a substrate in a first metal level;

a second conductive line oriented along the first direction disposed over the substrate in the first metal level, and capacitively coupled to the first conductive line;

a third conductive line oriented along the first direction disposed over the substrate in the first metal level, the second conductive line disposed between the first and the third conductive lines;

a first perpendicular conductive line oriented along a second direction disposed in a second metal level over the first metal level, wherein the first conductive line is coupled to the first perpendicular conductive line, wherein the first direction is perpendicular to the second direction;

a second perpendicular conductive line oriented along the second direction disposed in the second metal level, wherein the second perpendicular conductive line is coupled to the third conductive line, wherein the first perpendicular conductive line is coupled to a first potential node, wherein the second perpendicular conductive line is coupled to a second potential node that is electrically insulated from the first potential node so that the first potential node can carry a first potential and the second potential node can carry a second potential different than the first potential; and

a first resistor and a second resistor, wherein the second conductive line is coupled to the first potential node through the first resistor and to the second potential node through the second resistor.

8. The capacitor of claim 7, wherein the third conductive line is capacitively coupled to the second conductive line.

9. The capacitor of claim 7, wherein the first resistor is a first portion of a poly silicon line, wherein the second resistor is a second portion of the poly silicon line.

10. The capacitor of claim 7, wherein the first and the second resistors comprise a resistive device comprising a poly silicon line, a diffusion area, or an active device.

11. The capacitor of claim 7, further comprising:

a fourth conductive line oriented along the first direction disposed over the substrate in the first metal level, wherein the fourth conductive line is capacitively coupled to the third conductive line; and

a fifth conductive line oriented along the first direction disposed over the substrate in the first metal level, wherein the fifth conductive line is capacitively coupled to the fourth conductive line, wherein the fourth conductive line is disposed between the third and the fifth conductive lines, wherein the fifth conductive line is coupled to the second perpendicular conductive line.

12. The capacitor of claim 11, further comprising a third perpendicular conductive line oriented along the second direction disposed in the second metal level, and wherein the second and the fourth conductive lines are coupled to the third perpendicular conductive line.

13. The capacitor of claim 12, further comprising:

a sixth conductive line oriented along the first direction disposed over the substrate in the first metal level, wherein the sixth conductive line is capacitively coupled to the fifth conductive line; and

a seventh conductive line oriented along the first direction disposed over the substrate in the first metal level, wherein the seventh conductive line is capacitively coupled to the sixth conductive line, wherein the sixth conductive line is disposed between the fifth and the seventh conductive lines.

14. The capacitor of claim 13, wherein the sixth conductive line is coupled to a fourth perpendicular conductive line, and wherein the seventh conductive line is coupled to the second perpendicular conductive line.

15. The capacitor of claim 13, wherein the sixth conductive line is coupled to the third perpendicular conductive line, and wherein the seventh conductive line is coupled to the second perpendicular conductive line.

16. The capacitor of claim 7, further comprising:

a fourth conductive line oriented along the first direction disposed over the substrate in the first metal level, wherein the fourth conductive line is disposed between the second conductive line and the third conductive line, wherein the fourth conductive line is capacitively coupled to the second conductive line and the third conductive line.

17. A capacitor array comprising:

a first column comprising a first capacitor element and a second capacitor element coupled in series;

a second column comprising a third capacitor element and a fourth capacitor element coupled in series, wherein the second column being coupled in parallel with the first column;

a first resistor; and

a second resistor;

wherein the second capacitor element is disposed between the first capacitor element and the fourth capacitor element within a metallization level;

wherein the fourth capacitor element is disposed between the second capacitor element and the third capacitor element within the metallization level;

wherein the first capacitor element comprises a first plate and a second plate;

wherein the second capacitor element comprises a third plate and a fourth plate;

wherein the first plate is coupled to the second plate through a first resistor; and

wherein the third plate is coupled to the fourth plate through a second resistor.

18. The capacitor array of claim 17 wherein the second plate and the third plate comprise a common metal line.

19. The capacitor array of claim 17, wherein the capacitor array comprises a poly silicon line disposed below the first and the second capacitor elements over a workpiece, wherein the first resistor comprises a first portion of the poly silicon line, and wherein the second resistor comprises a second portion of the poly silicon line.

20. The capacitor array of claim 17, wherein the first and the second resistors each comprise a resistive device comprising a diffusion area.

21. The capacitor array of claim 17, wherein the capacitor array is a vertical parallel plate capacitor array.

22. The capacitor array of claim 17, wherein the capacitor array is disposed over a semiconductor body that includes active components or circuits.

23. The capacitor array of claim 17, wherein the first column comprises a fifth capacitor element in series with the first and the second capacitor elements, and wherein the second column comprises a sixth capacitor element in series with the third and the fourth capacitor elements.

24. The capacitor array of claim 23, wherein the fifth capacitor element is disposed between the first capacitor element and the second capacitor element, wherein the sixth capacitor element is disposed between the third capacitor element and the fourth capacitor element.