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Advanced transistors with punch through suppression

  • US 9,508,800 B2
  • Filed: 12/22/2015
  • Issued: 11/29/2016
  • Est. Priority Date: 09/30/2009
  • Status: Active Grant
First Claim
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1. A die, comprising:

  • a substrate that is a single crystal of semiconductor material;

    a first field effect transistor structure and a second field effect transistor structure, each supported by the substrate;

    wherein the first field effect transistor structure has a first gate, a first source, a first drain, and a first plurality of distinct doped regions underlying the first gate and extending between the first source and the first drain, the first plurality of doped regions implanted to define a first dopant profile of p-type, the first dopant profile having a p-type peak dopant concentration at a first depth from the first gate, a first p-type intermediate dopant concentration at a second depth from the first gate, the first p-type intermediate dopant concentration being lower than the p-type peak dopant concentration;

    wherein the first field effect transistor structure includes a first channel region formed by an undoped blanket epitaxial growth, the first channel region being directly on a first threshold voltage control region formed in the single crystal of the single semiconductor material, the first threshold voltage control region associated with the first intermediate dopant concentration,wherein the second field effect transistor structure has a second gate, a second source, a second drain, and a second plurality of distinct doped regions underlying the second gate and extending between the second source and the second drain, the second plurality of doped regions implanted to define a second dopant profile of n-type, the second dopant profile having a n-type peak dopant concentration at a third depth from the second gate, a first n-type intermediate dopant concentration at a fourth depth from the second gate, the first n-type intermediate dopant concentration being lower than the n-type peak dopant concentration;

    wherein the second field effect transistor structure includes a second channel region commonly formed by the undoped blanket epitaxial growth, the second channel region being directly on a second threshold voltage control region formed in the single crystal of the single semiconductor material, the second threshold voltage control region associated with the first n-type intermediate dopant concentration.

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