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Double diaphragm MEMS microphone without a backplate element

  • US 9,510,107 B2
  • Filed: 03/06/2014
  • Issued: 11/29/2016
  • Est. Priority Date: 03/06/2014
  • Status: Active Grant
First Claim
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1. A sensor structure, comprising:

  • a first carrier comprising a void;

    a first suspended structure suspended laterally across the void of the first carrier;

    a second suspended structure disposed from the first suspended structure;

    at least one spacer structure formed on a surface of the first suspended structure, wherein the first suspended structure and the second suspended structure are connected by the at least one spacer structure so that the at least one spacer structure and the first and second suspended structures define boundaries enclosing an unoccupied volume between the first suspended structure and the second suspended structure, the unoccupied volume having a lateral extension at least as long as the void, wherein the unoccupied volume and the void are separated by the first suspended structure;

    wherein the first suspended structure and the second suspended structure are arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction.

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