Double diaphragm MEMS microphone without a backplate element

• US 9,510,107 B2
• Filed: 03/06/2014
• Issued: 11/29/2016
• Est. Priority Date: 03/06/2014
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Bastarous, Marina Fekry Megally, Dehe, Alfons
• Primary Examiner(s): Tran, Quoc D
• Assistant Examiner(s): KAUFMAN, JOSHUA A
• Application Number:
  US14/198,657
• Publication Number:
  US 20150256940A1
• Time in Patent Office: 999 Days
• Field of Search: 381/58, 381/59, 381/335, 381/174, 381/175, 381/113, 381/116, 381/191, 381/181, 381/355, 381/358, 381/369, 257414-416, 438/53, 438/48
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/00182 Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use

Abstract

A sensor structure may include a first suspended structure and a second suspended structure disposed from the first suspended structure to form a volume. The first suspended structure and the second suspended structure may be arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction and the displacement may generate a measurable signal.

Claims

1. A sensor structure, comprising:

a first carrier comprising a void;

a first suspended structure suspended laterally across the void of the first carrier;

a second suspended structure disposed from the first suspended structure;

at least one spacer structure formed on a surface of the first suspended structure, wherein the first suspended structure and the second suspended structure are connected by the at least one spacer structure so that the at least one spacer structure and the first and second suspended structures define boundaries enclosing an unoccupied volume between the first suspended structure and the second suspended structure, the unoccupied volume having a lateral extension at least as long as the void, wherein the unoccupied volume and the void are separated by the first suspended structure;

wherein the first suspended structure and the second suspended structure are arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction.

2. The sensor structure of claim 1,

wherein the first suspended structure comprises a first diaphragm.

3. The sensor structure of claim 1,

wherein the second suspended structure comprises a second diaphragm.

4. The sensor structure of claim 1,

wherein a surface of the first suspended structure is fixed to a surface of the first carrier.

5. The sensor structure of claim 1, further comprising:

at least one bump electrode structure formed on a surface of the first carrier.

6. The sensor structure of claim 5,

wherein the first suspended structure is electrically coupled to the at least one bump electrode structure.

7. The sensor structure of claim 1,

wherein the first carrier comprises a first micro-electro-mechanical system.

8. The sensor structure of claim 1, further comprising:

a second carrier carrying the second suspended structure.

9. The sensor structure of claim 8,

wherein a surface of the second suspended structure is fixed to a surface of the second carrier.

10. The sensor structure of claim 8, further comprising:

a void formed in the second carrier.

11. The sensor structure of claim 10,

wherein the second suspended structure is suspended across the void in the second carrier.

12. The sensor structure of claim 8, further comprising:

at least one contact pad formed on a surface of the second carrier.

13. The sensor structure of claim 12,

wherein the second suspended structure is electrically coupled to the at least one contact pad.

14. The sensor structure of claim 12, further comprising:

at least one bump electrode structure formed on a surface of the first carrier;

wherein the at least one bump electrode structure is electrically coupled to the at least one contact pad.

15. The sensor structure of claim 8,

wherein the second carrier comprises a second micro-electro-mechanical system.

16. A sensor structure arrangement, comprising:

a sensor structure, comprising;

a first carrier comprising a void;

a first suspended structure suspended laterally across the void of the first carrier;

a second suspended structure disposed from the first suspended structure;

a spacer structure formed on a surface of the first suspended structure, wherein the spacer structure and the first and second suspended structures define boundaries enclosing an unoccupied volume between the first suspended structure and the second suspended structure, the unoccupied volume having a lateral extension at least as long as the void, wherein the unoccupied volume and the void are separated from each other by at least the first suspended structure;

wherein the first suspended structure and the second suspended structure are arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction; and

a circuit coupled to the sensor structure and configured to capacitively measure the displacement.

17. A sensor structure arrangement, comprising:

a sensor structure, comprising;

a first carrier comprising a void;

a first suspended structure suspended laterally across the void of the first carrier;

a second suspended structure disposed from the first suspended structure;

a spacer structure formed on a surface of the first suspended structure, wherein the spacer structure and the first and second suspended structures define boundaries enclosing an unoccupied volume between the first suspended structure and the second suspended structure, the unoccupied volume having a lateral extension at least as long as the void, wherein the unoccupied volume and the void are separated from each other by at least the first suspended structure;

wherein the first suspended structure and the second suspended structure are arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction; and

an optical detector configured to optically detect the displacement.

18. A sensor structure arrangement, comprising:

a sensor structure, comprising;

a first carrier comprising a void;

a first suspended structure;

a second suspended structure disposed from the first suspended structure;

a spacer structure formed on a surface of the first suspended structure, wherein the spacer structure and the first and second suspended structures define boundaries enclosing an unoccupied volume between the first suspended structure and the second suspended structure, the unoccupied volume having a lateral extension at least as long as the void, wherein the unoccupied volume and the void are separated from each other by at least the first suspended structure;

wherein the first suspended structure and the second suspended structure are arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction;

a support structure attached to a surface of the sensor structure.

19. The sensor structure arrangement of claim 18,

wherein the support structure comprises a printed circuit board.

20. The sensor structure arrangement of claim 18,

wherein the support structure has at least one passage hole.

21. The sensor structure arrangement of claim 18, further comprising:

a covering layer attached to the support structure;

wherein the covering layer encloses the sensor structure.