Solid state lighting apparatus and methods of forming

• US 9,510,413 B2
• Filed: 01/27/2012
• Issued: 11/29/2016
• Est. Priority Date: 07/28/2011
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Underwood, Robert D., Athalye, Praneet Jayant, Ni, Liqin, van de Ven, Antony P.
• Primary Examiner(s): Cole, Brandon S
• Application Number:
  US13/360,145
• Publication Number:
  US 20130026923A1
• Time in Patent Office: 1,768 Days
• Field of Search: 315112-118
• US Class Current: 1/1
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H05B 45/48 having LEDs organised in strings and incorporating parallel shunting devices

Abstract

A solid state lighting apparatus can include a substrate having first and second opposing surfaces, where at least one of the opposing surfaces is configured to mount devices thereon. A string of chip-on-board light emitting diode (LED) sets, can be on the first surface of the substrate and coupled in series with one another. An ac voltage source input, from outside the solid state lighting apparatus, can be coupled to the first or second surface of the substrate.

Claims

1. A solid state lighting apparatus comprising:

a rectifier circuit mounted on a surface of a substrate housed in the solid state lighting apparatus, coupled to an ac voltage source configured to provide a rectified ac voltage to the substrate;

a current source circuit mounted on the surface of the substrate, coupled to the rectifier circuit;

a string of light emitting diode (LED) sets, mounted on the surface of the substrate, coupled in series with one another and to the current source circuit; and

a plurality of current diversion circuits mounted on the surface of the substrate, respective ones of which are coupled to respective nodes of the string and configured to operate responsive to bias state transitions of respective ones of the LED sets.

2. The apparatus of claim 1, wherein at least the plurality of current diversion circuits comprise discrete electronic component packages mounted on the substrate.

3. The apparatus of claim 1, wherein the LEDs in the string comprise chip-on-board LEDs mounted on the surface of the substrate.

4. The apparatus of claim 1, wherein the substrate comprises a flexible circuit substrate, the apparatus further comprising:

a heat sink mounted on an opposing surface of the substrate, thermally coupled to the string of LED sets.

5. The apparatus of claim 1, wherein the substrate comprises a metal core printed circuit board (MCPCB).

6. The apparatus of claim 5 wherein the MCPCB comprises a metal layer separated from the surface of the substrate by a dielectric layer and configured to conduct heat away from the string of LED sets.

7. The apparatus of claim 5 wherein the MCPCB comprises a dielectric material between first and second metal layers.

8. The apparatus of claim 7 wherein the first metal layer comprises a circuit layer and the second metal layer is configured to conduct heat away from the string of LED sets.

9. The apparatus of claim 1, further comprising:

a current limiter circuit, on the surface of the substrate, in series with the current source circuit and at least one of the LED sets; and

at least one capacitor, on the surface of the substrate, coupled across the at least one LED set and the current limiter circuit.

10. The apparatus of claim 9 wherein the current limiter circuit is configured to selectively provide current from the current source circuit to the at least one LED set and to the at least one capacitor.

11. The apparatus of claim 9 wherein the rectifier circuit, the current source circuit, the plurality of current diversion circuits, and the current limiter circuit are integrated in an application specific integrated circuit.

12. The apparatus of claim 1 further comprising:

an encapsulant layer, on the surface of the substrate, encapsulating the string of LED sets.

13. The apparatus of claim 12 wherein the encapsulant layer comprises silicone.

14. The apparatus of claim 1 further comprising:

separate encapsulant layers encapsulating LEDs in the string of LED sets, separately.

15. The apparatus of claim 1 wherein the rectifier circuit, the current source circuit, and the plurality of current diversion circuits are included in a single integrated circuit device package.

16. The apparatus of claim 1, wherein the substrate comprises a silicon substrate, a gallium nitride substrate, a silicon carbide substrate or a graphene substrate.

17. The apparatus of claim 1 further comprising:

an encapsulant barrier, on the substrate, at least partially surrounding LEDs in the sets, configured to reduce a flow of an encapsulant material away from the LEDs during application of the encapsulant material to promote formation of lenses on the string of LED sets.

18. The apparatus of claim 17 wherein a height of the encapsulant barrier above the substrate is less than a height of an upper surface of the LEDs.

19. The apparatus of claim 1 wherein the string of LED sets includes at least three sets coupled in series with one another, each of the three sets including at least two high voltage LEDs coupled in parallel with one another.

20. The apparatus of claim 1, wherein the ac voltage source comprises at least about 110 volts ac.

21. The apparatus of claim 1 wherein the string of LED sets includes at least three sets coupled in series with one another, each of the three sets including at least two high voltage LEDs coupled in series with one another.

22. The apparatus of claim 1, wherein the ac voltage source comprises at least about 220 volts ac.

23. The apparatus of claim 1, wherein at least one set of the string of LED sets comprises at least two high voltage LEDs coupled in parallel or is series with one another and the ac voltage source comprises at least about 110 volts ac or about 220 volts ac.

24. A solid state lighting apparatus comprising:

a substrate having first and second opposing surfaces, at least one of which is configured to mount devices thereon;

a string of chip-on-board light emitting diode (LED) sets, on the first surface of the substrate, coupled in series with one another; and

an ac voltage source input, from outside the solid state lighting apparatus, coupled to the first or second surface of the substrate.

25. The apparatus of claim 24 further comprising:

a rectifier circuit on the first or second surface of the substrate, coupled to the ac voltage source input to provide a rectified ac voltage to the substrate;

a current source circuit on the first or second surface of the substrate, coupled to the rectifier circuit; and

a plurality of current diversion circuits on the first or second surface of the substrate, respective ones of which are coupled to respective nodes of the string and configured to operate responsive to bias state transitions of respective ones of the LED sets.

26. The apparatus of claim 25, wherein at least the plurality of current diversion circuits comprise discrete electronic component packages mounted on the first surface of the substrate.

27. The apparatus of claim 25 wherein the substrate comprises a flexible circuit substrate, the apparatus further comprising:

a thermally conductive slug in the substrate at a particular position opposite where the string of chip-on-board LED sets are to be mounted thereon.

28. The apparatus of claim 25, further comprising:

a current limiter circuit, on the first or second surface of the substrate, in series with the current source circuit and at least one of the LED sets; and

at least one capacitor, on the first or second surface of the substrate, coupled across the at least one LED set and the current limiter circuit.

29. The apparatus of claim 24, wherein the substrate comprises a flexible circuit substrate, the apparatus further comprising:

a heat sink on the second side of the substrate, thermally coupled to the string of chip-on-board LED sets.

30. The apparatus of claim 24, wherein the substrate comprises a metal core printed circuit board.

31. The apparatus of claim 24 wherein LEDs in the string of chip-on-board LED sets comprise unpackaged light emitting diodes mounted on the substrate.

32. The apparatus of claim 24 wherein the string of chip-on-board LED sets includes at least three sets coupled in series with one another, each of the three sets including at least two chip-on-board high voltage LEDs coupled in parallel with one another.

33. The apparatus of claim 24 wherein the ac voltage source input comprises at least about 110 volts ac.

34. The apparatus of claim 24 wherein the string of chip-on-board LED sets includes at least three sets coupled in series with one another, each of the three sets including at least two high voltage chip-on-board LEDs coupled in series with one another.

35. The apparatus of claim 24, wherein the ac voltage source input comprises at least about 220 volts ac.

36. The apparatus of claim 24, wherein at least one set of the string of chip-on-board LED sets comprises at least two high voltage chip-on-board LEDs coupled in parallel or is series with one another and the ac voltage source comprises at least about 110 volts ac or about 220 volts ac.

37. A solid state lighting apparatus comprising:

a rectifier circuit configured to be coupled to an ac voltage source to provide a rectified ac voltage;

a current source circuit coupled to the rectifier circuit;

a string of serially-connected LED sets coupled to an output of the current source circuit;

at least one capacitor coupled to the output of the current source circuit;

a current limiter circuit comprising a current mirror circuit configured to limit a current through at least one of the LED sets to less than a current produced by the current source circuit and to cause the at least one capacitor to be selectively charged via the current source circuit and discharged via the at least one of the LED sets responsive to the rectified ac voltage applied to an input of the current source circuit;

a plurality of current diversion circuits coupled to respective nodes between LEDs in the string and configured to be selectively enabled and disabled responsive to bias state transitions of the LED sets as a magnitude of the rectified ac voltage varies; and

a substrate having first and second opposing surfaces, wherein at least the string of serially-connected LED sets, the plurality of current diversion circuits, the rectifier circuit, and the current source circuit are mounted on the substrate.

38. The apparatus of claim 37 wherein the plurality of current diversion circuits each comprises:

a transistor providing a controllable current path between a first node of the string and a terminal of the rectifier circuit; and

a turn-off circuit coupled to a second node of the string and to a control terminal of the transistor and configured to control the current path responsive to a control input.

39. The apparatus of claim 37 wherein the LEDs in the string comprise chip-on-board LEDs mounted on the substrate.

40. The apparatus of claim 37, wherein the substrate comprises a flexible circuit board, the apparatus further comprising:

a heat sink mounted on the substrate opposite and proximate to the string of LED sets.

41. The apparatus of claim 37, wherein the substrate comprises a metal core printed circuit board (MCPCB).

42. The apparatus of claim 41 wherein the MCPCB comprises a metal layer separated from the surface of the substrate by a dielectric layer and configured to conduct heat away from the string of LED sets.

43. The apparatus of claim 37, wherein the substrate comprises a flexible printed circuit board.

44. The apparatus of claim 37, wherein at least the plurality of current diversion circuits comprise discrete electronic component packages mounted on the substrate.

45. The apparatus of claim 37 wherein the string of serially-connected LED sets includes at least three sets coupled in series with one another, each of the three sets including at least two chip-on-board high voltage LEDs coupled in parallel with one another.

46. The apparatus of claim 37 wherein the ac voltage source input comprises at least about 110 volts ac.

47. The apparatus of claim 37 wherein the string of serially-connected LED sets includes at least three sets coupled in series with ore another, each of the three sets including at least two high voltage chip-on-board LEDs coupled in series with one another.

48. The apparatus of claim 37 wherein the ac voltage source input comprises at least about 220 volts ac.

49. The apparatus of claim 37 wherein at least one set of the string of serially-connected LED sets comprises at least two high voltage chip-on-board LEDs coupled in parallel or is series with one another and the ac voltage source comprises at least about 110 volts ac or about 220 volts ac.

50. A method of forming a solid state lighting circuit, comprising:

placing a plurality chip-on-board light emitting diodes (LEDs) in a string configuration on a surface of a substrate;

applying an encapsulant material over the plurality of chip-on-board LEDs; and

forming the encapsulant material into a layer covering the plurality of chip-on-board LEDs to provide lenses for the plurality of chip-on-board LEDs.

51. The method according to claim 50 further comprising:

placing a plurality of current diversion circuits, comprising discrete electronic component packages, on the surface of the substrate.

52. The method according to claim 50 wherein applying an encapsulant material comprises applying the encapsulant material to cover the plurality of chip-on-board LEDs and portions of the surface between ones of the plurality of chip-on-board LEDs.

53. The method according to claim 52 wherein forming the encapsulant material into a layer comprises bringing a mold into contact with the encapsulant material to simultaneously form a layer covering the plurality chip-on-board LEDs to provide the lenses for the plurality chip-on-board LEDs, wherein the mold includes chip-on-board LED recesses positioned in a surface of the mold opposite the plurality of chip-on-board LEDs.

54. The method according to claim 53 further comprising:

placing a plurality of current diversion circuits, comprising discrete electronic component packages, on the surface of the substrate before applying the encapsulant material, wherein the mold further includes discrete electronic component package recesses positioned in the surface of the mold opposite the plurality of current diversion circuits on the surface.

55. The method according to claim 50 wherein applying an encapsulant material comprises dispensing the encapsulant material separately onto the plurality of chip-on-board LEDs.

56. The method according to claim 50 wherein applying an encapsulant material comprises dispensing the encapsulant material simultaneously onto the plurality of chip-on-board LEDs.

57. The method according to claim 56 wherein the encapsulant barrier at least partially surrounds the LEDs and is configured to reduce a flow of the encapsulant material away from the LEDs during application of the encapsulant material to promote the formation of the lenses.

58. The method according to claim 50 wherein forming the encapsulant material into a layer covering the plurality chip-on-board LEDs to provide lenses for the plurality chip-on-board LEDs comprises providing respective encapsulant barriers to a flow of the encapsulant material away from each of the plurality chip-on-board LEDs during application of the encapsulant material to provide a respective lens for each of the plurality of chip-on-board LEDs.

59. The method according to claim 58 further comprising:

removing the encapsulant barriers from the lenses.

60. The method of claim 50 wherein the string configuration comprises serially-connected LED sets and wherein the serially-connected LED sets include at least three sets coupled in series with one another, each of the three sets including at least two chip-on-board high voltage LEDs coupled in parallel with one another.

61. The method of claim 50 wherein the string configuration is configured for coupling to an ac voltage source comprising at least about 110 volts ac.

62. The method of claim 50 wherein the string configuration comprises serially-connected LED sets and wherein the serially-connected LED sets include at least three sets coupled in series with one another, each of the three sets including at least two high voltage chip-on-board LEDs coupled in series with one another.

63. The method of claim 50 wherein the string configuration is configured for coupling to an ac voltage source comprising at least about 220 volts ac.

64. The method of claim 50 wherein the string configuration is configured for coupling to an ac voltage source and wherein the string configuration comprises serially-connected LED sets and wherein at least one set of the string of serially-connected LED sets comprises at least two high voltage chip-on-board LEDs coupled in parallel or is series with one another and the ac voltage source comprises at least about 110 volts ac or about 220 volts ac.

65. A printed circuit board (PCB) comprising:

a substrate, configured for inclusion in a solid state lighting apparatus, the substrate having first and second opposing surfaces, at least one of which is configured to mount a plurality of chip-on-board light emitting diodes (LEDs) thereon, and the substrate configured to couple to an ac voltage source input, from outside the solid state lighting apparatus, and configured for mounting a plurality of discrete current diversion circuits devices thereon coupled to respective nodes between ones of the LEDs and configured to be selectively enabled and disabled responsive to bias state transitions of the LED sets as a magnitude of a rectified ac voltage provided to the LEDs varies.

66. The PCB of claim 65 wherein the substrate comprises a metal core PCB.

67. The PCB of claim 66 wherein the first surface comprises a conductive circuit pattern layer and the second surface comprises a base metal layer having a greater thickness than the conductive circuit pattern layer, the PCB further comprising a dielectric layer between the conductive circuit pattern layer and the base metal layer.

68. The PCB of claim 65 wherein the substrate comprises a flexible PCB.

69. The PCB of claim 68 further comprising:

a thermally conductive slug in the substrate at a particular position opposite where the string of chip-on-board LED sets are to be mounted thereon.

70. The PCB of claim 65 further comprising:

an encapsulant barrier, protruding from the surface, at least partially surrounding a position on the surface where at least one of the LEDs is to be mounted, configured to reduce a flow of an encapsulant material away from the LEDs during application of the encapsulant material to promote the formation of a lens on the at least one of the LEDs.

71. A solid state lighting apparatus comprising:

a substrate having first and second opposing surfaces, at least one of which is configured to mount devices thereon, the substrate comprising a substrate area;

a string of light emitting diode (LED) sets, on the first surface of the substrate, coupled in series with one another, and arranged in an LED portion of the substrate comprising an LED area that is about 40% or less of the substrate area, the string of LED sets configured to emit light comprising about 2000 lumens or more; and

an ac voltage source input, from outside the solid state lighting apparatus, coupled to the first or second surface of the substrate.

72. A solid state lighting apparatus comprising:

a substrate having first and second opposing surfaces, at least one of which is configured to mount devices thereon, the substrate comprising a substrate area;

a string of light emitting diode (LED) sets, on the first surface of the substrate, coupled in series with one another, and arranged in an LED portion of the substrate comprising an LED area that is about 30% or less of the substrate area, the string of LED sets configured to emit light comprising about 800 lumens or more; and

an ac voltage source input, from outside the solid state lighting apparatus, coupled to the first or second surface of the substrate.

73. A solid state lighting apparatus comprising:

a substrate having first and second opposing surfaces, at least one of which is configured to mount devices thereon, the substrate comprising a substrate area;

a string of light emitting diode (LED) sets, on the first surface of the substrate, coupled in series with one another, and arranged in an LED portion of the substrate comprising an LED area that is about 38% or less of the substrate area, the string of LED sets configured to emit light comprising about 800 lumens or more; and

an ac voltage source input, from outside the solid state lighting apparatus, coupled to the first or second surface of the substrate.

74. The apparatus of claim 73 wherein the string of LED sets includes at least three sets coupled in series with one another, each of the three sets including at least two high voltage LEDs coupled in parallel with one another.

75. The apparatus of claim 73 wherein the ac voltage source input comprises at least about 110 volts ac.

76. The apparatus of claim 73 wherein the string of LED sets includes at least three sets coupled in series with one another, each of the three sets including at least two high voltage LEDs coupled in series with one another.

77. The apparatus of claim 73 wherein the ac voltage source input comprises at least about 220 volts ac.

78. The apparatus of claim 73, wherein at least one set of the string of LED sets comprises at least two high voltage LEDs coupled in parallel or is series with one another and the ac voltage source comprises at least about 110 volts ac or about 220 volts ac.