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Printed circuit board and manufacture method thereof

  • US 9,510,446 B2
  • Filed: 10/03/2014
  • Issued: 11/29/2016
  • Est. Priority Date: 04/05/2012
  • Status: Expired due to Fees
First Claim
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1. A printed circuit board comprising:

  • a substrate havingan insulating layer,aluminum foil layers disposed on both sides of the insulating layer, anda through-hole formed in the insulating layer and aluminum foil layers;

    a metal layer disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole;

    a zinc film positioned on a surface of the aluminum foil;

    a metal film disposed over the zinc film;

    a plating film disposed on a surface of the metal film; and

    a circuit pattern etched through the aluminum foil and the plating film.

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