Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids

• US 9,512,532 B2
• Filed: 10/29/2013
• Issued: 12/06/2016
• Est. Priority Date: 05/07/2002
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R.
• Primary Examiner(s): RUFO, LOUIS J
• Application Number:
  US14/065,720
• Publication Number:
  US 20140151237A1
• Time in Patent Office: 1,134 Days
• US Class Current: 1/1
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 50/00 Data acquisition or data processing for additive manufacturing
• CPC Class Codes: B33Y 50/02 for controlling or regulating additive manufacturing processes
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 1/0038 Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G06F 30/392 Floor-planning or layout, e.g. partitioning or placement
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: H01P 1/202 Coaxial filters cascaded coaxial cavities H01P1/205
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01P 11/005 Manufacturing coaxial lines
• CPC Class Codes: H01P 3/06 Coaxial lines
• CPC Class Codes: H01P 5/183 at least one of the guides being a coaxial line
• CPC Class Codes: H05K 3/4647 : by applying an insulating layer around previously made via studs

Abstract

Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Claims

1. A batch fabrication process for forming a plurality of multi-layer three-dimensional structures from at least one structural material, comprising:

(a) forming and adhering a given layer rom at least one structural material and at least one sacrificial material to either an at least partially formed previous layer, if the given layer is not a first layer, or to a substrate, if the given layer is the first layer; and

(b) repeating the forming and adhering of (a) a plurality of times to build up the plurality of multi-layer three-dimensional structures from a plurality of adhered layers;

wherein the formation of a plurality of the adhered layers comprises beginning a deposition operation to form a portion of a current layer prior to completing a deposition operation to form a portion of a prior layer, and

wherein after formation of the adhered layers, separating at least a portion of the at least one sacrificial material, located on multiple layers, from the at least one structural material to release multiple layers of the three-dimensional structures.

2. The process of claim 1 wherein the formation of the given layer comprises electrodeposition of a structural material of the at least one structural material or a sacrificial material of the at least one sacrificial material.

3. A batch fabrication process for forming a plurality of multi-layer three-dimensional structures, comprising:

(a) forming and adhering a given layer of one or more materials to a previously formed layer, if the given layer is not a first layer, or to a substrate if the given layer is the first layer;

(b) repeating the forming and adhering of (a) a plurality of times to build up the plurality of three-dimensional structures from a plurality of adhered layers;

wherein the forming of each of a plurality of the adhered layers comprises one or more planarization operations which removes a portion of the one or more materials to set a boundary level for each of the plurality of the adhered layers, and

wherein for a plurality of the adhered layers, forming interlacing elements in association with one or more given layers that extend from the given layer or layers into preceding layers and result in higher levels of interlacing between the one or more materials deposited in association with the given layer or layers and one or more materials deposited in association with the preceding layer or layers than would exist in absence of the interlacing elements.

4. The process of claim 3 wherein the formation of the plurality of the adhered layers comprises electrodeposition of at least one of the one or more materials.

5. The process of claim 3 wherein at least some of the interlacing elements extend from a given layer through an intermediate layer to a preceding layer.

6. The process of claim 5 wherein the interlacing elements are located in a staggered manner such that interconnection of layers occurs via a plurality of the interlacing elements that each connect at least three layers and such that an inter-connected network extending a greater distance than the height of any single interlacing element occurs.

7. The process of claim 6 wherein the staggered manner results in the given layer further comprising at least one additional interlacing element having a configuration selected from the group of:

(1) an interlacing element that originates on a subsequent layer, extends through the given layer and ends on the preceding layer; and

/or

(2) an interlacing element that originates on a subsequent layer that is separated from the given layer by at least one intermediate layer and that ends on the given layer.

8. The process of claim 3 wherein some interlacing elements have different heights.

9. The process of claim 8 wherein the heights of at least some of the interlacing elements are at least in part dictated by the location of the interlacing elements relative to at least one element selected from the group consisting of:

(1) an outward facing-surface of the structure, (2) an outward facing surface associated with a single structural material, (3) a particular group of structural materials, and (4) interference between the interlacing elements and other interlacing elements.

10. The process of claim 3 wherein the given layers comprise at least one structural material and at least one sacrificial material, and wherein after the forming of the plurality of layers, separating the at least one sacrificial material, located on multiple layers, from the at least one structural material to release the three-dimensional structures.

11. The process of claim 3 wherein the forming of a plurality of layers comprises a selective patterning operation selected from the group consisting of (1) selectively etching voids in one of the one or more materials in which an interlacing element is to be formed, and (2) selectively depositing one of the one or more materials.

12. The process of claim 11 wherein the selective patterning comprises use of a mask selected from the group consisting of:

(1) a contact mask, (2) a proximity mask, and (3) an adhered mask.

13. The process of claim 3 wherein at least one of the at least one sacrificial material comprises a metal and at least one of the at least one structural material comprises a metal.