Shaped backplane for receiving electrical components

• US 9,513,677 B2
• Filed: 03/18/2014
• Issued: 12/06/2016
• Est. Priority Date: 03/18/2014
• Status: Active Grant

• Current Assignee: Western Digital Technologies Incorporated (Western Digital Corporation)
• Original Assignee: Western Digital Technologies Incorporated (Western Digital Corporation)
• Inventors: Huang, Lidu, Hirano, Toshiki, Wilke, Jeffrey, Ou-Yang, Jin Hui
• Primary Examiner(s): Thomas, Eric
• Assistant Examiner(s): McFadden, Michael P
• Application Number:
  US14/218,835
• Publication Number:
  US 20150268702A1
• Time in Patent Office: 994 Days
• Field of Search: 361785-789
• US Class Current: 1/1
• CPC Class Codes: G06F 1/187 Mounting of fixed and removable disk drives
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture

Abstract

A backplane configured to receive electrical components is provided. The backplane in one example includes a substantially planar substrate comprising an at least partially flexible material and formed in a non-rectangular shape, a series of alternating connector islands formed along two substantially parallel axes, wherein each connector island is able to move independently of other connector islands, a plurality of backplane traces extending from the series of alternating connector islands to a backplane connector region of the substrate, with a number of backplane traces increasing closer to the backplane connector region, and one or more spring elements bridging between a particular connector island and the substrate, with the one or more spring elements allowing the particular connector island to flex with respect to the substrate and absorb vibrations.

Claims

1. A backplane configured to receive electrical components, comprising:

a substantially planar substrate comprising an at least partially flexible material and formed in a non-rectangular shape;

a series of alternating connector islands formed along two substantially parallel axes extending substantially lengthwise on the substrate and wherein each connector island is able to move independently of other connector islands, with pairs of connector islands of the series of connector islands located in openings in the substrate and configured to receive one or more mating electrical components;

a plurality of backplane traces formed as part of the substrate, with the plurality of backplane traces extending from the series of alternating connector islands to a backplane connector region of the substrate, with a number of backplane traces increasing closer to the backplane connector region; and

one or more spring elements bridging between a particular connector island and the substrate, with traces of the plurality of backplane traces extending over the one or more spring elements to the particular connector island and with the one or more spring elements allowing the particular connector island to flex with respect to the substrate and absorb vibrations.

2. The backplane of claim 1, with the plurality of backplane traces graduated in arrangement, wherein traces extending from a farthest connector island are on an outside of a grouping of traces.

3. The backplane of claim 1, with the plurality of backplane traces staggered in arrangement, with connector island traces closest to the backplane connector region comprising inner traces of a grouping of traces.

4. The backplane of claim 1, with a first connector island of a first axis being laterally spaced from an adjacent second connector island of a second axis.

5. The backplane of claim 1, with the one or more spring elements comprising two spring elements, wherein the two spring elements form a substantially hourglass shape including centrally-extending loop portions, wherein the two centrally-extending loop portions have a substantially common loop axis.

6. The backplane of claim 1, with the one or more spring elements comprising two spring elements, wherein the two spring elements form a substantially hourglass shape including centrally-extending loop portions, wherein the two centrally-extending loop portions have different loop axes.

7. The backplane of claim 1, further comprising a cut-out slot located at a junction of the one or more spring elements and the substrate.

8. The backplane of claim 1, further comprising one or more damper elements positioned underneath the backplane and configured to absorb deflections of the backplane.

9. The backplane of claim 1, further comprising one or more limiter projections positioned underneath the backplane and configured to limit amplitudes of deflections of the backplane.

10. A backplane configured to receive electrical components, comprising:

a substantially planar substrate comprising an at least partially flexible material and formed in a substantially trapezoidal shape;

a series of alternating connector islands formed along two substantially parallel axes extending substantially lengthwise on the substrate and wherein each connector island is able to move independently of other connector islands, with pairs of connector islands of the series of connector islands located in openings in the substrate and configured to receive one or more mating electrical components;

a plurality of backplane traces formed as part of the substrate, with the plurality of backplane traces extending from the series of alternating connector islands to a backplane connector region of the substrate, with a number of backplane traces increasing closer to the backplane connector region; and

one or more spring elements bridging between a particular connector island and the substrate, with traces of the plurality of backplane traces extending over the one or more spring elements to the particular connector island and with the one or more spring elements allowing the particular connector island to flex with respect to the substrate and absorb vibrations.

11. The backplane of claim 10, with the plurality of backplane traces graduated in arrangement, wherein traces extending from a farthest connector island are on an outside of a grouping of traces.

12. The backplane of claim 10, with the plurality of backplane traces staggered in arrangement, with connector island traces closest to the backplane connector region comprising inner traces of a grouping of traces.

13. The backplane of claim 10, with a first connector island of a first axis being laterally spaced from an adjacent second connector island of a second axis.

14. The backplane of claim 10, with the one or more spring elements comprising two spring elements, wherein the two spring elements form a substantially hourglass shape including centrally-extending loop portions, wherein the two centrally-extending loop portions have a substantially common loop axis.

15. The backplane of claim 10, with the one or more spring elements comprising two spring elements, wherein the two spring elements form a substantially hourglass shape including centrally-extending loop portions, wherein the two centrally-extending loop portions have different loop axes.

16. The backplane of claim 10, further comprising a cut-out slot located at a junction of the one or more spring elements and the substrate.

17. The backplane of claim 10, further comprising one or more damper elements positioned underneath the backplane and configured to absorb deflections of the backplane.

18. The backplane of claim 10, further comprising one or more limiter projections positioned underneath the backplane and configured to limit amplitudes of deflections of the backplane.

19. A method of forming a backplane for receiving electrical components, comprising:

providing a substantially planar substrate comprising an at least partially flexible material and formed in a substantially trapezoidal shape;

providing a series of alternating connector islands formed along two substantially parallel axes extending substantially lengthwise on the substrate and wherein each connector island is able to move independently of other connector islands, with pairs of connector islands of the series of connector islands located in openings in the substrate and configured to receive one or more mating electrical components;

providing a plurality of backplane traces formed as part of the substrate, with the plurality of backplane traces extending from the series of alternating connector islands to a backplane connector region of the substrate, with a number of backplane traces increasing closer to the backplane connector region; and

providing one or more spring elements bridging between a particular connector island and the substrate, with traces of the plurality of backplane traces extending over the one or more spring elements to the particular connector island and with the one or more spring elements allowing the particular connector island to flex with respect to the substrate and absorb vibrations.

20. The method of claim 19, with providing the plurality of backplane traces comprising:

staggering the traces, wherein connector islands closest to the backplane connector region comprise inner traces of a grouping of traces; and

angling the grouping of traces to minimize an area of the substrate.