Package mounting structure
First Claim
Patent Images
1. A package mounting structure comprising:
- a first substrate having a first wiring and a power supply unit, the power supply unit being electrically coupled to the first wiring;
a second substrate having a second wiring and an electric component, the electric component being electrically coupled to the second wiring;
a cooling unit arranged between the first substrate and the second substrate and having a first face and a second face different from the first face;
a first column arranged on the first face of the cooling unit to electrically couple the first wiring and the cooling unit; and
a second column arranged on the second face of the cooling unit to electrically couple the second wiring and the cooling unit, whereinthe power supply unit is mounted on the first substrate and comes into contact with the first face of the cooling unit,the electronic component is mounted on the second substrate and comes into contact with the second face of the cooling unit, andthe power supply unit supplies power to the electronic component through the first wiring, the first column, the cooling unit, the second column and the second wiring.
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Abstract
A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.
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Citations
6 Claims
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1. A package mounting structure comprising:
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a first substrate having a first wiring and a power supply unit, the power supply unit being electrically coupled to the first wiring; a second substrate having a second wiring and an electric component, the electric component being electrically coupled to the second wiring; a cooling unit arranged between the first substrate and the second substrate and having a first face and a second face different from the first face; a first column arranged on the first face of the cooling unit to electrically couple the first wiring and the cooling unit; and a second column arranged on the second face of the cooling unit to electrically couple the second wiring and the cooling unit, wherein the power supply unit is mounted on the first substrate and comes into contact with the first face of the cooling unit, the electronic component is mounted on the second substrate and comes into contact with the second face of the cooling unit, and the power supply unit supplies power to the electronic component through the first wiring, the first column, the cooling unit, the second column and the second wiring. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification