Nitride semiconductor layer, nitride semiconductor device, and method for manufacturing nitride semiconductor layer
First Claim
1. A nitride semiconductor layer spreading along a first surface, the nitride semiconductor layer comprising:
- a first region, wherein a length of the first region in a first direction parallel to the first surface is longer than a length of the first region in a second direction parallel to the first surface, wherein the second direction is perpendicular to the first direction; and
a second region arranged with the first region in the second direction, wherein a length of the second region in the first direction is longer than a length of the second region in the second direction,wherein the nitride semiconductor has a c-axis that is tilted with respect to the second direction for the first region and the second region,wherein the c-axis intersects a third direction, wherein the third direction is perpendicular to the first direction and the second direction, andwherein the c-axis is tilted with a plane including the second direction and the third direction.
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Abstract
According to one embodiment, a nitride semiconductor layer spreading along a first surface is provided. The nitride semiconductor layer includes a first region and a second region. A length of the first region in a first direction parallel to the first surface is longer than a length of the first region in a second direction parallel to the first surface and perpendicular to the first direction. The second region is arranged with the first region in the second direction. A length of the second region in the first direction is longer than a length of the second region in the second direction. A c-axis being is tilted with respect to the second direction for the first region and the second region. The c-axis intersects a third direction perpendicular to the first surface.
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Citations
20 Claims
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1. A nitride semiconductor layer spreading along a first surface, the nitride semiconductor layer comprising:
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a first region, wherein a length of the first region in a first direction parallel to the first surface is longer than a length of the first region in a second direction parallel to the first surface, wherein the second direction is perpendicular to the first direction; and a second region arranged with the first region in the second direction, wherein a length of the second region in the first direction is longer than a length of the second region in the second direction, wherein the nitride semiconductor has a c-axis that is tilted with respect to the second direction for the first region and the second region, wherein the c-axis intersects a third direction, wherein the third direction is perpendicular to the first direction and the second direction, and wherein the c-axis is tilted with a plane including the second direction and the third direction. - View Dependent Claims (2, 3, 4, 5)
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6. A nitride semiconductor device, comprising:
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a substrate including a major surface having an upper surface and a plurality of oblique surfaces, the oblique surfaces being tilted with respect to the upper surface, wherein each length of the oblique surfaces in a first direction parallel to the upper surface is longer than each length of the oblique surfaces in a second direction parallel to the upper surface, wherein the second direction is perpendicular to the first direction, and the oblique surfaces are arranged in the second direction; and a nitride semiconductor layer grown from the oblique surfaces, wherein the nitride semiconductor has a c-axis that is tilted with respect to the second direction, wherein the c-axis intersects a third direction, wherein the third direction is perpendicular to the first direction and the second direction, and wherein the c-axis is tilted with a plane including the second direction and the third direction. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A nitride semiconductor device, comprising:
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a nitride semiconductor layer, a substrate including a major surface having an upper surface and a plurality of oblique surfaces, wherein the oblique surfaces are tilted with respect to the upper surface, each length of the oblique surfaces in a first direction parallel to the upper surface is longer than each length of the oblique surfaces in a second direction parallel to the upper surface, wherein the second direction is perpendicular to the first direction, wherein the oblique surfaces are arranged in the second direction, and wherein the nitride semiconductor layer is grown from the oblique surfaces of the substrate, wherein the nitride semiconductor layer has a c-axis that is tilted with respect to the second direction, wherein the c-axis intersects a third direction, wherein the third direction is perpendicular to the first direction and the second direction, wherein the c-axis is tilted with a plane including the second direction and the third direction.
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20. A method for manufacturing a nitride semiconductor layer, comprising:
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preparing a substrate including a major surface having an upper surface and a plurality of oblique surfaces, wherein the oblique surfaces are tilted with respect to the upper surface, wherein each length of the oblique surfaces in a first direction parallel to the upper surface is longer than each length of the oblique surfaces in a second direction parallel to the upper surface, wherein the second direction is perpendicular to the first direction, and wherein the oblique surfaces are arranged in the second direction; and growing the nitride semiconductor layer from the oblique surfaces, wherein the nitride semiconductor layer has a c-axis that is tilted with respect to the second direction, wherein the c-axis intersects a third direction, wherein the third direction is perpendicular to the first direction and the second direction, and wherein the c-axis is tilted with a plane inducing the second direction and the third direction.
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Specification