Laser welding transparent glass sheets using low melting glass or thin absorbing films
First Claim
Patent Images
1. A method of bonding a workpiece comprising:
- forming an inorganic film over a surface of a first substrate;
arranging a workpiece to be protected between the first substrate and a secondsubstrate wherein the film is in contact with the second substrate;
bonding the workpiece between the first and second substrates by locally heating the film with laser radiation having a predetermined wavelength,wherein the inorganic film, the first substrate, or the second substrate are transmissive at approximately 420 nm to approximately 750 nm, andwherein the step of bonding further comprises bonding the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.
-
Citations
51 Claims
-
1. A method of bonding a workpiece comprising:
-
forming an inorganic film over a surface of a first substrate; arranging a workpiece to be protected between the first substrate and a second substrate wherein the film is in contact with the second substrate; bonding the workpiece between the first and second substrates by locally heating the film with laser radiation having a predetermined wavelength, wherein the inorganic film, the first substrate, or the second substrate are transmissive at approximately 420 nm to approximately 750 nm, and wherein the step of bonding further comprises bonding the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
-
-
26. A bonded device comprising:
-
an inorganic film formed over a surface of a first substrate; and a device protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate, wherein the device includes a bond formed between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film though a local heating of the inorganic film with laser radiation having a predetermined wavelength, and wherein the inorganic film, the first substrate, or the second substrate are transmissive at approximately 420 nm to approximately 750 nm. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
-
-
47. A bonded device comprising:
-
a first substrate; a second substrate; and a device protected between the first substrate and a second substrate, wherein the device includes a bond formed between the first and second substrates as a function of the composition of impurities in the first or second substrates though a local heating of an interface between the first and second substrates with laser radiation having a predetermined wavelength, and wherein the first substrate or the second substrate are transmissive at approximately 420 nm to approximately 750 nm. - View Dependent Claims (48, 49, 50, 51)
-
Specification