Radiating sub-terahertz signal from tapered metallic waveguide into dielectric waveguide
First Claim
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1. A process of operating an electronic device comprising:
- generating a sub-terahertz signal in an integrated circuit within the electronic device;
transporting the sub-terahertz signal to a tapered metallic waveguide located on a multilayer substrate of the electronic device; and
radiating a portion of the sub-terahertz signal from the tapered metallic waveguide into a dielectric waveguide.
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Abstract
A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.
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4 Claims
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1. A process of operating an electronic device comprising:
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generating a sub-terahertz signal in an integrated circuit within the electronic device; transporting the sub-terahertz signal to a tapered metallic waveguide located on a multilayer substrate of the electronic device; and radiating a portion of the sub-terahertz signal from the tapered metallic waveguide into a dielectric waveguide. - View Dependent Claims (2, 3, 4)
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Specification