Extended range RFID tag assemblies and methods of operation

• US 9,515,391 B2
• Filed: 11/04/2013
• Issued: 12/06/2016
• Est. Priority Date: 01/29/2010
• Status: Active Grant

• Current Assignee: Innovative Timing Systems LLC
• Original Assignee: Innovative Timing Systems LLC
• Inventors: Hansen, Kurt S.
• Primary Examiner(s): Purvis, Sue A
• Assistant Examiner(s): Lindgren Baltzell, Andrea
• Application Number:
  US14/071,480
• Publication Number:
  US 20140062825A1
• Time in Patent Office: 1,128 Days
• Field of Search: 343/835
• US Class Current: 1/1
• CPC Class Codes: A63B 2220/62 Time or time measurement used for time reference, time stamp, master time or clock signal
• CPC Class Codes: A63B 24/0062 Monitoring athletic performances, e.g. for determining the work of a user on an exercise apparatus, the completed jogging or cycling distance
• CPC Class Codes: A63B 71/0686 Timers, rhythm indicators or pacing apparatus using electric or electronic means
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: G06K 19/07773 Antenna details antennas for wireless devices, e.g. RFID tags, in general H01Q1/22
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G06K 19/0779 the antenna being foldable or folded
• CPC Class Codes: H01Q 1/2216 used in interrogator/reader equipment
• CPC Class Codes: H01Q 1/246 specially adapted for base stations
• CPC Class Codes: H01Q 19/10 using reflecting surfaces
• CPC Class Codes: H04B 5/77 for interrogation
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

A method of operation and system for a radio frequency identification (RFID) tag assembly having an RFID semiconductor chip with an antenna interface, a mounting surface substrate, the RFID semiconductor having a predetermined operating frequency, a conductor electrically coupling the RFID chip antenna interface to an antenna, the antenna including a first radiating element lying in a first plane and a second radiating element lying in a second plane, the second plane being at an angle relative to the first plane, and a reflector having a substantially planar reflecting plane spaced apart from and substantially parallel to the first plane, the reflector being composed of reflecting material adapted for reflecting the predetermined operating frequency, wherein the reflector is positioned apart from the first radiating element with the reflective plane being a distance of about ¼ of a wavelength of the predetermined operating frequency.

Claims

1. A radio frequency identification (RFID) tag assembly comprising:

an enclosure having a body with at least four walls defining an opening and a cavity with a closed end opposing the opening and defining a depth therebetween;

an RFID chip assembly having a mounting substrate, an RFID semiconductor chip with an antenna assembly interface mounted on a mounting surface of the mounting substrate, the RFID semiconductor chip having a predetermined operating frequency, a conductor electrically coupled to the antenna assembly interface of the RFID semiconductor chip, and an antenna assembly electrically coupled to the conductor, the antenna assembly having one or more antenna elements with each antenna element coupled to the RFID semiconductor chip by the conductor and each antenna element including a first radiating element portion lying in a first plane that substantially lies in or is parallel to the same plane of a plane defined by of the mounting surface and a second radiating element portion conductively coupled to the first radiating element portion and lying in a second plane, the second plane being at an angle relative to the first plane of between 45 degrees and 135 degrees and in the direction away from the plane containing the mounting surface and towards the opening of the cavity, the mounting substrate with the RFID semiconductor chip being positioned within the cavity proximate to the closed end away from the opening; and

a reflector positioned proximate to the opening of the cavity and having a substantially planar reflecting planar surface spaced apart from and substantially parallel to the first plane of the first radiating element, the reflector being composed of reflecting material adapted for reflecting the predetermined operating frequency, wherein the reflector is positioned apart from the first radiating element portion at a distance of between about 0.250 inches and about 0.275 inches.

2. The assembly of claim 1 wherein the first radiating element portion has a length less than about ¼

of a wavelength of the predetermined operating frequency and the second radiating element portion has a length less than about ¼

of a wavelength of the predetermined operating frequency.

3. The assembly of claim 1 wherein the angle of the second plane relative to the first plane is about 90 degrees.

4. The assembly of claim 1 wherein the angle of the second plane relative to the first plane is between about 45 degrees and about 135 degrees.

5. The assembly of claim 1 wherein the predetermined operating frequency is a frequency within a UHF frequency band.

6. The assembly of claim 1 wherein the reflector is positioned within the cavity defined by the walls of the body and apart from the first plane with the reflecting plane positioned towards the first plane on a side of the first plane of the angled second radiating element.

7. The assembly of claim 1, further comprising a spacer positioned between the first plane and the reflector for maintaining the spaced apart position of the reflector from the first radiating element.

8. The assembly of claim 7 wherein the spacer is composed of a material that does not conduct or absorb a substantial amount of energy at the predetermined operating frequency.

9. The assembly of claim 1 wherein the reflector is coupled capacitively to the antenna assembly at the predetermined operating frequency.

10. The assembly of claim 1 wherein the antenna assembly is a bi-planar foil antenna assembly and the first and second radiating element portions of the antenna element are each foil radiating element portions.

11. The assembly of claim 1 wherein the first and second radiating element portions of each of the antenna assembly elements are formed on the mounting surface of the mounting substrate as foil radiating element portions, and wherein the mounting substrate includes an angled deformation between the first and second radiating element portions, the angled deformation defining the angle of the second radiating element portion relative to the second radiating element.

14. The assembly of claim 4, further comprising a spacer positioned between the first plane and the reflector within the cavity for maintaining the spaced apart position of the reflector from the first radiating element, wherein the spacer is composed of a material that does not conduct or absorb a substantial amount of energy at the predetermined operating frequency.

21. The assembly of claim 1 wherein the first radiating element portion has a length of about 0.250 inches and the second radiating element portion has a length of about 0.125 inches.

24. The assembly of claim 1 wherein the reflector has a body composed of a composite material with a dielectric constant responsive to the predetermined operating frequency, the composite material including chips of a metal suspended therein.

12. A radio frequency identification (RFID) tag assembly comprising:

an enclosure having a body with at least four walls defining an opening and a cavity with a closed end opposing the opening and defining a depth therebetween;

an RFID semiconductor chip positioned in the cavity having an antenna assembly interface mounted on a mounting surface of a mounting substrate and having a predetermined operating frequency;

a conductor electrically positioned in the cavity coupled to the antenna assembly interface of the RFID semiconductor chip and mounted on the mounting surface;

an antenna assembly positioned in the cavity electrically coupled to the conductor, the antenna assembly having one or more antenna assembly elements with each antenna element coupled to the RFID semiconductor chip by the conductor and each antenna element including a first radiating element portion lying in a first plane and a second radiating element portion lying in a second plane, the second plane being at an angle relative to the first plane of between 45 degrees and 135 degrees outward from the plane containing the mounting substrate and in the direction of the opening of the cavity, wherein the first radiating element portion has length less than about ¼

of a wavelength of the predetermined operating frequency and the second radiating element portion has a length less than of about ¼

of a wavelength of the predetermined operating frequency; and

a reflector positioned within the cavity proximate to the opening and having a substantially planar reflecting plane spaced apart from and substantially parallel to the first plane of the antenna assembly, the reflector being composed of reflecting material adapted for reflecting the predetermined operating frequency, wherein the reflector is positioned apart from the first radiating element portion with the reflective plane being a distance of between about 0.250 inches and about 0.275 inches.

13. The assembly of claim 12 wherein the angle of the second plane relative to the first plane is about 90 degrees and wherein the reflector is positioned apart from the first plane with the reflecting plane positioned towards the first plane on a side of the first plane of the angled second radiating element portion.

15. The assembly of claim 12 wherein the antenna assembly is a bi-planar foil antenna assembly and the first and second radiating element portions of the antenna element are each foil radiating element portions formed on the mounting surface of the mounting substrate, and wherein the mounting substrate includes an angled deformation between the first and second radiating element portions, the angled deformation defining the angle of the second radiating element portion relative to the second radiating element portion.

22. The assembly of claim 12 wherein the first radiating element portion has a length of about 0.250 inches and the second radiating element portion has a length of about 0.125 inches.

23. The assembly of claim 12 wherein the reflector has a body composed of a composite material with a dielectric constant responsive to the predetermined operating frequency, the composite material including chips of a metal suspended therein.

16. A method of operating a radio frequency identification (RFID) tag assembly comprising:

at a first radiating element portion of a single one of a plurality of antenna elements of an antenna assembly having one or more antenna elements with each antenna element coupled to the RFID semiconductor chip by the conductor and each antenna element positioned in an enclosure having a body with at least four walls defining an opening and a cavity with a closed end opposing the opening and defining a depth therebetween,

receiving at the first radiating element portion a first portion of radio frequency energy transmitted from an antenna associated with a base station transceiver positioned remote from the RFID tag assembly, said radio frequency energy being at a predetermined operating frequency;

at a first second radiating element portion of the same antenna element of the plurality of antenna elements wherein the second radiating element portion is in second plane that is at an angle to a first plane containing the first radiating element portion and the angle is between 45 degrees and 135 degrees outward from the plane containing the first radiating element and in the direction of the opening of the cavity, with the second radiating element portion being electrically coupled to said first radiating element portion,

receiving at the second radiating element portion a second portion of the radio frequency energy transmitted from the base station transceiver antenna, and said second portion of the radio frequency energy being received at the predetermined operating frequency;

reflecting at a reflector a third portion of the radio frequency energy at the predetermined operating frequency as transmitted from the base station transceiver antenna, the reflector having a substantially planar reflecting plane spaced apart from and a substantially parallel to the first plane of the antenna assembly at a distance of between about 0.250 inches and about 0.275 inches;

receiving at the first and second radiating element portions the third portion of the radio frequency energy;

processing the received first, second and third portions of the radio frequency energy by the RFID semiconductor chip;

generating a reply radio frequency energy at the RFID semiconductor chip at a predetermined reply operating frequency in response to the processing and in response to the first and second received radio frequency energy portions; and

radiating the reply radio frequency energy by the first and second radiating element portions of the antenna assembly coupled to the RFID semiconductor chip.

17. The method of claim 16 wherein at least one of the first and second portions of the radio frequency energy is received substantially direct from the antenna assembly of the remote base station transceiver.

18. The method of claim 16, further comprising receiving at least a portion of the radiated predetermined reply energy from at least one of the first and second radiation element portions by the antenna assembly associated with the base station transceiver.

19. The method of claim 16 wherein transmitting the reply radio frequency energy includes:

reflecting at a reflector positioned substantially parallel to at least one of the first and second planes at the antenna assembly coupled to the RFID semiconductor chip a reflected reply radio frequency energy, the reflected portion being a portion of the radiated reply radio frequency energy; and

receiving at least a portion of the radiated predetermined reply energy from at least one of the first and second radiation element portions and a portion of the reflected reply radio frequency energy at the antenna associated with the base station transceiver.

20. The method of claim 16 wherein the predetermined reply operating frequency is equivalent to the predetermined operating frequency as received from the antenna associated with a base station transceiver positioned remote from the RFID tag assembly.