MEMS electrical contact systems and methods

• US 9,515,579 B2
• Filed: 12/29/2014
• Issued: 12/06/2016
• Est. Priority Date: 11/15/2010
• Status: Active Grant

• Current Assignee: DigitalOptics Corporation (Adeia Inc.)
• Original Assignee: DigitalOptics Corporation (Adeia Inc.)
• Inventors: Gutierrez, Roman C., Calvet, Robert J., Jain, Ankur
• Primary Examiner(s): Pinkney, Dawayne A
• Application Number:
  US14/585,172
• Publication Number:
  US 20150146312A1
• Time in Patent Office: 708 Days
• Field of Search: 359290-292, 359/245, 359260-261, 359/263, 359/298, 359301-303, 359317-318, 359/223, 359/224, 359/225, 359/262, 359/295, 359/198
• US Class Current: 1/1
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 1/00317 Packaging optical devices
• CPC Class Codes: B81C 1/0038 Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
• CPC Class Codes: G02B 27/646 compensating for small deviations, e.g. due to vibration or shake movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68
• CPC Class Codes: G02B 7/10 by relative axial movement of several lenses, e.g. of varifocal objective lens
• CPC Class Codes: G02B 7/102 controlled by a microcomputer cameras with interchangeable lenses G03B17/14
• CPC Class Codes: G03B 13/36 Autofocus systems
• CPC Class Codes: G03B 2205/0046 Movement of one or more optical elements for zooming for optical zoom lenses in general G02B7/10
• CPC Class Codes: G03B 2205/0053 Driving means for the movement of one or more optical element
• CPC Class Codes: G03B 3/10 Power-operated focusing
• CPC Class Codes: G03B 5/00 Adjustment of optical system relative to image or object surface other than for focusing
• CPC Class Codes: H02N 1/008 Laterally driven motors, e.g. of the comb-drive type
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A microelectromechanical systems (MEMS) device may be provided with one or more sintered electrical contacts. The MEMS device may be a MEMS actuator or a MEMS sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, or a metal powder on a wafer of released MEMS devices and heating the wafer so that the deposited sintering material diffuses into a substrate of the device, thereby making electrical contact with the device. The deposited sintering material may break through an insulating layer on the substrate during the sintering process. The MEMS device may be a multiple degree of freedom actuator having first and second MEMS actuators that facilitate autofocus, zoom, and optical image stabilization for a camera.

Claims

1. A device comprising:

a microelectromechanical systems (MEMS) device; and

a sintered electrical contact comprising a sintered metal conductive portion disposed on an outer frame portion of the MEMS device for conductive attachment to an external device.

2. The device as recited in claim 1, wherein the sintered electrical contact comprises a sintered material selected from the group consisting of a sintered metal paste, a sintered metal powder, a sintered metal ink, and a sintered metal preform.

3. The device as recited in claim 1, wherein the sintered electrical contact comprises a silver-paste-metalized electrical contact.

4. The device as recited in claim 3, wherein the MEMS device comprises:

at least a first MEMS actuator configured to move a platform along a first axis; and

at least a second MEMS actuator configured to move the platform in a direction that is generally perpendicular to the first axis, wherein the device further comprises at least one additional silver-paste-metalized electrical contact.

5. The device as recited in claim 4, wherein the second MEMS actuator comprises three second MEMS actuators that are configured to cooperate to move the platform.

6. The device as recited in claim 5, wherein the first MEMS actuator is nested at least partially within the three second MEMS actuators.

7. The device as recited in claim 3, further comprising:

a lens barrel with an electrical lead; and

a conductive epoxy that connects the electrical lead to the silver-paste-metalized electrical contact.

8. The device as recited in claim 3, wherein the silver-paste-metalized electrical contact comprises a silver paste dot with a width that is between 180 microns and 300 microns and a length that is between 120 microns and 170 microns.

9. The device as recited in claim 3, wherein the device comprises a camera having a lens, wherein the MEMS device comprises a MEMS actuator that is configured to move the lens, and wherein the sintered electrical contact is attached to the MEMS actuator by at least one kinematic mount flexure having a trench.

10. The device as recited in claim 1, wherein the device comprises a portable electronic device.

11. A method, comprising:

providing a MEMS wafer having a plurality of MEMS devices;

releasing at least one movable portion of each of the plurality of MEMS devices;

depositing a metal material on the MEMS wafer; and

forming and metalizing a plurality of sintered electrical contacts on an outer frame portion of the MEMS wafer by sintering the metal material onto the sintered electrical contacts for conductive attachment to an external device.

12. The method as recited in claim 11, wherein the depositing comprises depositing the metal material on the MEMS wafer after the releasing.

13. The method as recited in claim 12, wherein the forming comprises heating the MEMS wafer so that the metal material diffuses through an insulating layer into a substrate of the MEMS wafer.

14. The method as recited in claim 13, wherein the heating comprises heating the MEMS wafer to a temperature that is sufficient to allow oxide growth during the heating.

15. The method as recited in claim 11, wherein the depositing comprises depositing at least one of a metal paste, a metal preform, a metal ink, or a metal powder.

16. The method as recited in claim 11, wherein the depositing comprises depositing silver on the MEMS wafer.

17. A method, comprising:

providing a microelectromechanical systems (MEMS) device having first and second silver-paste-metalized sintered electrical contacts disposed at an outer frame portion of the MEMS device for conductive attachment;

coupling the first silver-paste-metalized sintered electrical contact to a control lead; and

coupling the second silver-paste-metalized sintered electrical contact to a reference lead.

18. The method as recited in claim 17, further comprising:

providing a control voltage to the first silver-paste-metalized sintered electrical contact using the control lead; and

providing a reference voltage to the second silver-paste-metalized sintered electrical contact using the reference lead.

19. The method as recited in claim 17, wherein the MEMS device is coupled to a lens of a camera, the method further comprising:

adjusting a position of the lens using the MEMS device by applying a voltage to the first silver-paste metalized sintered electrical contact.

20. The method as recited in claim 17, wherein the MEMS device is disposed within a lens barrel of a camera in a portable electronic device, wherein the first and second silver-paste-metalized sintered electrical contacts are each attached to an actuator of the MEMS device by at least one kinematic mount flexure having a trench, and wherein the lens barrel comprises the control lead, the method further comprising:

focusing the camera by applying a control voltage to the first silver-paste-metalized sintered electrical contact with the control lead.