Extremely stretchable electronics
First Claim
1. A stretchable integrated circuit (IC) system comprising:
- a flexible substrate;
a first device island mounted to the flexible substrate and comprising a first integrated circuit (IC) device fabricated from a rigid single-crystal semiconductor;
a second device island mounted to the flexible substrate and comprising a second integrated circuit (IC) device fabricated from a rigid single-crystal semiconductor; and
a flexible electrical interconnect electrically coupling the first IC device to the second IC device, wherein the flexible interconnect includes a polymer passivation layer and maintains electrical connectivity under translational and rotational strains.
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Accused Products
Abstract
In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the un-stretched distance.
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Citations
33 Claims
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1. A stretchable integrated circuit (IC) system comprising:
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a flexible substrate; a first device island mounted to the flexible substrate and comprising a first integrated circuit (IC) device fabricated from a rigid single-crystal semiconductor; a second device island mounted to the flexible substrate and comprising a second integrated circuit (IC) device fabricated from a rigid single-crystal semiconductor; and a flexible electrical interconnect electrically coupling the first IC device to the second IC device, wherein the flexible interconnect includes a polymer passivation layer and maintains electrical connectivity under translational and rotational strains. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method of making a stretchable integrated circuit (IC) system, the method comprising:
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mounting a first device island comprising a first integrated circuit (IC) device fabricated from a rigid single-crystal semiconductor to a polymer layer; mounting a second device island comprising a second integrated circuit (IC) device fabricated from a rigid single-crystal semiconductor to the polymer layer; electrically connecting the first device island to the second device island by a flexible electrical interconnect formed on the polymer layer; and adhering the first device island and the second device island to a flexible elastomeric substrate. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33)
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Specification