Cooled electronic system

• US 9,516,791 B2
• Filed: 01/22/2013
• Issued: 12/06/2016
• Est. Priority Date: 05/12/2009
• Status: Active Grant

• Current Assignee: Iceotope Group Limited
• Original Assignee: Iceotope Limited
• Inventors: Chester, Daniel, Hopton, Peter, Bent, Jason, Deakin, Keith
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US13/746,505
• Publication Number:
  US 20130146273A1
• Time in Patent Office: 1,414 Days
• Field of Search: 361/679.46, 361/679.53, 361/688, 361/689, 361/698, 361/699, 361/700, 361/714, 361/715, 165/80.4, 165/80.5, 165/80.2, 165/104.33, 165/75, 165/77, 165/47, 165/53, 257/714, 622/592
• US Class Current: 1/1
• CPC Class Codes: B65B 63/08 for heating or cooling articles or materials to facilitate packaging
• CPC Class Codes: B65B 7/00 Closing containers or receptacles after filling
• CPC Class Codes: F25D 23/12 Arrangements of compartments additional to cooling compartments; Combinations of refrigerators with other equipment, e.g. stove
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating
• CPC Class Codes: H05K 7/20218 using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/20236 by immersion
• CPC Class Codes: H05K 7/20263 Heat dissipaters releasing heat from coolant
• CPC Class Codes: H05K 7/20281 Thermal management, e.g. liquid flow control
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
• CPC Class Codes: H05K 7/20763 Liquid cooling without phase change
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20781 within cabinets for removing heat from server blades
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Claims

1. A cooled electronic system, comprising:

a sealed container comprising;

a housing;

an electronic device; and

a first cooling liquid;

a first heat transfer device defining a first channel for receiving a second cooling liquid,

the first heat transfer device being configured to transfer heat between the first cooling liquid and the first channel through at least a portion of a conduction surface; and

a piping arrangement, configured to transfer the second cooling liquid to and from the first heat transfer device;

wherein the system is configured to set one or both of;

the flow rate of the second cooling liquid through the first channel; and

the portion of the conduction surface through which heat is transferred to the second cooling liquid, such that the temperature of the electronic device is controlled so as not to exceed a predetermined maximum operating temperature and wherein the first cooling liquid remains in a state at least consisting essentially of a liquid state; and

wherein at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic device.

2. The cooled electronic system of claim 1, wherein the conduction surface has at least one projection for receiving heat from the first cooling liquid.

3. The cooled electronic system of claim 2, wherein the at least one projection is arranged in conformity with the shape of the electronic device.

4. The cooled electronic system of claim 3, further comprising a component heat sink coupled to the electronic device and comprising at least one projection arranged to cooperate with the at least one projection of the conduction surface.

5. The cooled electronic system of claim 2, wherein the at least one projection comprises a fin arrangement.

6. The cooled electronic system of claim 2, wherein the at least one projection comprises a pin arrangement.

7. The cooled electronic system of claim 1, further comprising a flow control device, arranged to control the flow rate of the second cooling liquid, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature.

8. The cooled electronic system of claim 1, wherein the sealed container is a first sealed container, and further comprising:

a second sealed container comprising;

a second housing;

a second electronic device;

a fourth cooling liquid for receiving heat from the second electronic component; and

a third heat transfer device comprising a fourth channel for receiving a fifth cooling liquid, the third heat transfer device being configured to transfer heat from the fourth cooling liquid to the fourth channel.

9. The cooled electronic system of claim 8, wherein the first channel and the fourth channel are coupled to combine the second cooling liquid and the fifth cooling liquid.

10. The cooled electronic system of claim 9, further comprising a plenum chamber, arranged to collect the combined second cooling liquid and fifth cooling liquid.

11. The cooled electronic system of claim 9, further comprising a flow control device, arranged to control the flow rate of the combined second cooling liquid and fifth cooling liquid, such that the temperatures of the first electronic device and the second electronic device do not exceed first and second predetermined maximum operating temperatures respectively.

12. The cooled electronic system of claim 11, wherein the flow control device comprises a flow diverting arrangement, the flow diverting arrangement being configured to set the flow rate of the second cooling liquid such that the temperature of the first electronic device does not exceed a first predetermined maximum operating temperature, and to set the flow rate of the fifth cooling liquid such that the temperature of the second electronic device does not exceed a second predetermined maximum operating temperature.

13. The cooled electronic system of claim 8, further comprising a fourth heat transfer device comprising a fifth channel for receiving the fifth cooling liquid from the fourth channel, and a sixth channel for receiving a sixth cooling liquid for coupling to a heat sink, the second heat transfer device being configured to transfer heat between the fifth channel and the sixth channel.

14. A method of cooling an electronic device, comprising:

operating the electronic device within a container, the container also comprising a first cooling liquid, such that heat generated by the electronic device is transferred to the first cooling liquid, the container being sealed to prevent leakage of the first cooling liquid;

transferring heat between the first cooling liquid and a second cooling liquid in a first heat transfer device;

piping the second cooling liquid from the first heat transfer device to a second heat transfer device; and

transferring heat between the second cooling liquid and a third cooling liquid in the second heat transfer device; and

piping the third cooling liquid to a heat sink;

wherein the first cooling liquid remains in a state at least consisting essentially of a liquid state during operation of the electronic device.

15. The method of claim 14, wherein the step of transferring heat between the first cooling liquid and the second cooling liquid is carried out by conduction.

16. The method of claim 14, further comprising:

controlling the flow rate of the second cooling liquid, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature.

17. The method of claim 14, further comprising:

controlling the flow rate of the third cooling liquid, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature.

18. The method of claim 14, wherein the first heat transfer device comprises a conduction surface, further comprising:

setting the portion of the conduction surface through which heat is transferred to the second cooling liquid, such that the temperature of the electronic device is controlled so as not to exceed a predetermined maximum operating temperature.

19. The method of claim 14, further comprising:

controlling at least one of;

the flow rate of the second cooling liquid; and

the flow rate of the third cooling liquid, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature and such that, during a first time period, the heat transfer rate between the second cooling liquid and the third cooling liquid or between the third cooling liquid and the heat sink does not go above a predetermined maximum rate, and such that during a second, later time period, the heat transfer rate between the second cooling liquid and the third cooling liquid or between the third cooling liquid and the heat sink may go above the predetermined maximum rate.

20. A method of cooling an electronic system, comprising:

carrying out the method steps of cooling an electronic device in accordance with claim 14;

operating a second electronic device within a second container, the second container also comprising a fourth cooling liquid, such that heat generated by the second electronic device is transferred to the fourth cooling liquid, the second container being sealed to prevent leakage of the fourth cooling liquid; and

transferring heat between the fourth cooling liquid and a fifth cooling liquid in a third heat transfer device.

21. The method of claim 20, further comprising:

combining the second cooling liquid and the fifth cooling liquid.

22. The method of claim 21, further comprising:

piping the second cooling liquid from the first heat transfer device and the fifth cooling liquid from the third heat transfer device to a plenum chamber.

23. The method of claim 21, further comprising:

controlling the flow rate of the combined second cooling liquid and fifth cooling liquid, such that the temperature of the first electronic device does not exceed a first predetermined maximum operating temperature and such that the temperature of the second electronic device does not exceed a second predetermined maximum operating temperature.

24. The method of claim 20, further comprising:

piping the fifth cooling liquid from the third heat transfer device to a fourth heat transfer device; and

transferring heat between the fifth cooling liquid and the third cooling liquid in the fourth heat transfer device.

25. A method of cooling an electronic device, comprising:

operating the electronic device within a container, the container also comprising a first cooling liquid, such that heat generated by the electronic device is transferred to the first cooling liquid, the container being sealed to prevent leakage of the first cooling liquid;

transferring heat between the first cooling liquid and a second cooling liquid in a first heat transfer device;

transferring heat between the second cooling liquid and a heat sink; and

controlling the heat transfer rate between the second cooling liquid and the heat sink, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature and such that, during a first time period, the heat transfer rate does not go above a predetermined maximum rate, and such that during a second, later time period, the heat transfer rate may go above the predetermined maximum rate.

26. A cooled electronic system, comprising:

a sealed container comprising;

a housing;

an electronic device; and

a first cooling liquid;

a first heat transfer device defining a first channel for receiving a second cooling liquid, the first heat transfer device being configured to transfer heat between the first cooling liquid and the first channel; and

a second heat transfer device comprising a second channel for receiving the second cooling liquid from the first channel, and a third channel for receiving a third cooling liquid for coupling to a heat sink, the second heat transfer device being configured to transfer heat between the second channel and the third channel.

27. The cooled electronic system of claim 26, wherein the first heat transfer device comprises a conduction surface, the housing and the conduction surface together defining a volume in which the electronic device and the first cooling liquid are located.

28. The cooled electronic system of claim 27, wherein the conduction surface separates the volume and the first channel to allow conduction of heat between the volume and the channel through the conduction surface.

29. The cooled electronic system of claim 28, wherein at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic device.

30. The cooled electronic system of claim 27, wherein the conduction surface has at least one projection for receiving heat from the first cooling liquid.

31. The cooled electronic system of claim 30, wherein the at least one projection is arranged in conformity with the shape of the electronic device.

32. The cooled electronic system of claim 31, further comprising a component heat sink coupled to the electronic device and comprising at least one projection arranged to cooperate with the at least one projection of the conduction surface.

33. The cooled electronic system of claim 30, wherein the at least one projection comprises a fin arrangement.

34. The cooled electronic system of claim 30, wherein the at least one projection comprises a pin arrangement.

35. The cooled electronic system of claim 26, further comprising a flow control device, arranged to control the flow rate of the second cooling liquid, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature.

36. The cooled electronic system of claim 26, further comprising a flow control device, arranged to control the flow rate of the third cooling liquid, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature.

37. The cooled electronic system of claim 26, wherein the sealed container is a first sealed container, and further comprising:

a second sealed container comprising;

a second housing;

a second electronic device;

a fourth cooling liquid for receiving heat from the second electronic component; and

a third heat transfer device comprising a fourth channel for receiving a fifth cooling liquid, the third heat transfer device being configured to transfer heat from the fourth cooling liquid to the fourth channel.

38. The cooled electronic system of claim 37, wherein the first channel and the fourth channel are coupled to combine the second cooling liquid and the fifth cooling liquid.

39. The cooled electronic system of claim 38, further comprising a plenum chamber, arranged to collect the combined second cooling liquid and fifth cooling liquid.

40. The cooled electronic system of claim 38, further comprising a flow control device, arranged to control the flow rate of the combined second cooling liquid and fifth cooling liquid, such that the temperatures of the first electronic device and the second electronic device do not exceed first and second predetermined maximum operating temperatures respectively.

41. The cooled electronic system of claim 40, wherein the flow control device comprises a flow diverting arrangement, the flow diverting arrangement being configured to set the flow rate of the second cooling liquid such that the temperature of the first electronic device does not exceed a first predetermined maximum operating temperature, and to set the flow rate of the fifth cooling liquid such that the temperature of the second electronic device does not exceed a second predetermined maximum operating temperature.

42. The cooled electronic system of claim 37, further comprising a fourth heat transfer device comprising a fifth channel for receiving the fifth cooling liquid from the fourth channel, and a sixth channel for receiving a sixth cooling liquid for coupling to a heat sink, the second heat transfer device being configured to transfer heat between the fifth channel and the sixth channel.