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Printed circuit board, design method thereof and mainboard of terminal product

  • US 9,519,308 B2
  • Filed: 03/07/2014
  • Issued: 12/13/2016
  • Est. Priority Date: 03/23/2007
  • Status: Active Grant
First Claim
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1. A printed circuit board, comprising outer surface layers and at least two inner layers between the outer surface layers, wherein:

  • signal lines are arranged on an area basis on the at least two inner layers;

    each of the outer surface layers of the printed circuit board is arranged with a metal sheet, wherein each of the outer surface layers is disposed on an outer surface of the printed circuit board;

    the outer surface layers are interconnected by at least one through via, so that the outer surface layers function as a primary ground;

    the printed circuit board does not include a ground plane at any of the at least two inner layers;

    an interlayer distance between two adjacent inner layers is at least twice a distance from each of the two adjacent inner layers to a corresponding one of the outer surface layers closest to an inner layer;

    the printed circuit board comprises at least three base plates and the outer surface layers and the at least two inner layers are formed on surfaces of the base plates; and

    a number of layers of the at least two inner layers in the printed circuit board is two, and at least one BGA-packaged device is provide on the printed circuit board, a blind via in a BGD area is arranged below a pad of the BGA-packaged device, and a ground copper sheet with a large area in the BGA area is a mesh copper sheet.

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