RF switch with inter-domain ESD protection

• US 9,520,251 B2
• Filed: 04/26/2013
• Issued: 12/13/2016
• Est. Priority Date: 04/26/2013
• Status: Expired due to Fees

• Current Assignee: Ferfics Limited
• Original Assignee: Ferfics Limited
• Inventors: O'Sullivan, John, Keane, John, O'Regan, Ian
• Primary Examiner(s): Leja, Ronald W
• Application Number:
  US13/871,630
• Publication Number:
  US 20140321008A1
• Time in Patent Office: 1,327 Days
• Field of Search: 361/56
• US Class Current: 1/1
• CPC Class Codes: H01H 11/00 Apparatus or processes specially adapted for the manufacture of electric switches processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards, H01H13/88
• CPC Class Codes: H02H 9/046 responsive to excess voltage appearing at terminals of integrated circuits protection by specific structural integration design H01L27/0248
• CPC Class Codes: H02M 3/155 using semiconductor devices only
• CPC Class Codes: H03K 17/693 Switching arrangements with several input- or output-terminals, e.g. multiplexers, distributors logic circuits H03K19/00; code converters H03M5/00, H03M7/00

Abstract

An RF switch with inter-domain ESD protection. The RF switch comprises an RF domain section having a plurality of RF switching elements; and a DC domain section having circuitry configured for driving the RF switching elements. At least one primary ESD protection element is operably coupled between the RF domain section and DC domain section.

Claims

1. An RF switch integrated circuit with inter-domain ESD protection;

the RF switch comprising;

an RF domain section having a plurality of RF switching elements;

a DC domain section having circuitry configured for driving the RF switching elements; and

at least one primary ESD protection element formed on a semiconductor die containing the RF domain section and the DC domain section;

wherein the at least one primary ESD protection element is internally coupled on the semiconductor die between a pin of the RF domain section and a pin of the DC domain section and provides a direct discharge path for inter-domain ESD events occuring between pins associated with the DC domain section and pins associated with the RF domain section.

2. An RF switch as claimed in claim 1, wherein the at least one primary ESD protection element is internally coupled on the semiconductor die between a supply voltage pin in the DC domain section and an RF ground reference pin in the RF domain section.

3. An RF switch as claimed in claim 2, wherein the RF domain section includes one or more RF ground reference pins each associated with a corresponding transistor connecting two RF pins.

4. An RF switch as claimed in claim 1, wherein the DC domain section comprises one or more secondary ESD protection elements.

5. An RF switch as claimed in claim 4, wherein the DC domain section comprises two secondary ESD protection elements.

6. An RF switch as claimed in claim 5, wherein one of the secondary ESD protection elements is operably coupled to an output node of a voltage regulator in the DC domain section.

7. An RF switch as claimed in claim 6, wherein the other one of the secondary ESD protection elements is operably coupled to an output node of a negative voltage generator in the DC domain section.

8. An RF switch as claimed in claim 1, further comprising a plurality of RF isolation filters operably coupled between the DC domain section and the RF domain section, the respective RF isolation filters include resistive loads which are scaled relatively to an effective resistive load that occurs between an output node of the RF isolation filter and a terminal of an RF switch element.

9. An RF switch as claimed in claim 1, further comprising at least one RF isolation filter having an ESD protection element, the at least one RF isolation filter being operably coupled between the DC domain section and the RF domain section.

10. An RF switch as claimed in claim 9, wherein the at least one RF isolation filter comprises a pair of capacitors and a resistor operably coupled there between, one of the capacitors is associated with the DC domain section and the other capacitor is associated with the RF domain section, the ESD protection element is operably coupled to the resistor.

11. An RF switch as claimed in claim 1, wherein the RF domain section comprises at least one stack of transistors, and a clamping element is associated with each transistor.

12. An RF switch as claimed in claim 11, wherein the clamping element is operably coupled between a body terminal and a gate terminal of the corresponding transistor.

13. An RF switch as claimed in claim 12, wherein the clamping element comprises a transistor.

14. An RF switch as claimed in claim 13, wherein the clamping element comprises a MOSFET transistor.

15. An RF switch as claimed in claim 12, wherein the clamping element is turned off during normal operation of the RF switch and is turned on in response to experiencing an ESD event.

16. A semiconductor die having an RF switch integrated circuit with inter-domain ESD protection fabricated thereon, wherein the RF switch integrated circuit comprises:

an RF domain section having a plurality of RF switching elements;

a DC domain section having circuitry configured for driving the RF switching elements; and

at least one primary ESD element formed on a semiconductor die containing the RF domain section and the DC domain section;

wherein the at least one primary ESD protection element is internally coupled on the semiconductor die between a pin of the RF domain section and a pin of the DC domain section and provides a direct discharge path for inter-domain ESD events occuring between pins associated with the DC domain section and pins associated with the RF domain section.

17. A semiconductor substrate as claimed in claim 16 comprising a silicon-on-insulator arrangement.

18. A method of fabricating an RF switch integrated circuit having inter-domain ESD protection;

the method comprises;

providing an RF domain section having a plurality of RF switching elements on a semiconductor die;

providing a DC domain section having circuitry configured for driving the RF switching elements on the semiconductor die; and

forming at least one primary ESD protection element on the semiconductor die containing the RF domain section and the DC domain section;

wherein the at least one primary ESD protection element is internally coupled between a pin of the RF domain section and a pin of the DC domain and provides a direct discharge path for inter-domain ESD events occuring between pins associated with the DC domain section and pins associated with the RF domain section.

19. A method as claimed in claim 18, wherein the at least one primary ESD protection element is operably coupled between a supply voltage pin in the DC domain section and an RF ground reference pin in the RF domain section.

20. A method as claimed in claim 18, further comprising:

providing one or more secondary ESD protection elements in the DC domain section.

21. A method as claimed in claim 20, further comprising:

coupling one of the secondary ESD protection elements to an output node of a voltage regulator in the DC domain section.

22. A method as claimed in claim 21, further comprising:

coupling a further secondary ESD protection elements to an output node of a negative voltage generator in the DC domain section.

23. A method as claimed in claim 18, further comprising coupling a plurality of RF isolation filters between the DC domain section and the RF domain section, the respective RF isolation filters include resistive loads which are scaled relatively to an effective resistive load that occurs between an output node of the RF isolation filter and a terminal of an RF switch element.

24. A method as claimed in claim 18, further comprising:

providing at least one RF isolation filter having an ESD protection element between the DC domain section and the RF domain section.

25. A method as claimed in claim 24, wherein the at least one RF isolation filter comprises a pair of capacitors and a resistor operably coupled there between, one of the capacitors is associated with the DC domain section and the other capacitor is associated with the RF domain section, the ESD protection element is operably coupled to the resistor.

26. A method as claimed in claim 18, further comprising:

providing at least one stack of transistors in the RF domain section, and

providing respective clamping elements on the semiconductor substrate which are associated with corresponding transistors.

27. A method as claimed in claim 26, further comprising:

coupling the respective clamping element between a body terminal and a gate terminal of the corresponding transistors.