×

Power semiconductor arrangement and method of producing a power semiconductor arrangement

  • US 9,520,305 B2
  • Filed: 09/30/2014
  • Issued: 12/13/2016
  • Est. Priority Date: 09/30/2013
  • Status: Expired due to Fees
First Claim
Patent Images

1. A power semiconductor device comprising:

  • a power semiconductor module havingelectrically conductive conductor tracks with at least one power semiconductor component arranged thereon;

    a cooling plate, said cooling plate having a main surface facing said at least one power semiconductor component and a lateral first surface which extends circumferentially around said cooling plate and is at an angle (α

    ) of less than about 90°

    with respect to said main surface of said cooling plate; and

    an electrically non-conductive insulation layer arranged between said conductor tracks and said cooling plate; and

    a heat sink through which a liquid can flow, said heat sink having an opening therein and a lateral first surface which delimits said opening and extends circumferentially around said opening;

    wherein said first surface of said heat sink is at an angle (β

    ) of less than about 90°

    with respect to said main surface of said cooling plate;

    wherein said cooling plate is arranged in said opening;

    wherein said lateral first surface of said cooling plate and said lateral first surface of said heat sink are arranged in a manner pressed against one another and extend circumferentially along said lateral first surface of said cooling plate and extend circumferentially along said lateral first surface of said heat sink;

    wherein said heat sink has a lateral second surface which extends circumferentially around said opening;

    wherein said opening is further delimited by said lateral second surface of said heat sink;

    wherein said lateral second surface of said heat sink forms an inner surface of a first groove which extends circumferentially around said opening, and extends radially inwardly towards said cooling plate;

    wherein said cooling plate has an edge region with a protuberance, said edge region extending circumferentially around said cooling plate, and extending outwardly towards said lateral second surface, and said protuberance being disposed in said first groove.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×