Please download the dossier by clicking on the dossier button x
×

Monolithic ultrasonic imaging devices, systems and methods

  • US 9,521,991 B2
  • Filed: 03/13/2014
  • Issued: 12/20/2016
  • Est. Priority Date: 03/15/2013
  • Status: Active Grant
First Claim
Patent Images

1. An ultrasound device, comprising:

  • at least first and second ultrasonic transducer elements;

    a first transmit control circuit comprising;

    a first pulser coupled to the first ultrasonic transducer element so as to drive the first ultrasonic transducer element so that the first ultrasonic transducer element emits an ultrasonic pulse;

    a first waveform generator coupled to the first pulser to provide a first waveform to the first pulser in response to receipt, by the first transmit control circuit, of a transmit enable signal generated by a timing and control circuit; and

    at least one first component that impacts a length of a first delay between when the first transmit control circuit receives the transmit enable signal and when the first waveform is applied to the first pulser;

    a second transmit control circuit comprising;

    a second pulser coupled to the second ultrasonic transducer element so as to drive the second ultrasonic transducer element so that the second ultrasonic transducer element emits an ultrasonic pulse;

    a second waveform generator coupled to the second pulser to provide a second waveform to the second pulser in response to receipt, by the second transmit control circuit, of the transmit enable signal generated by the timing and control circuit; and

    at least one second component that impacts a length of a second delay between when the second transmit control circuit receives the transmit enable signal and when the second waveform is applied to the second pulser;

    wherein the at least one first component is configured differently than the at least one second component, so that the length of the second delay is different than the length of the first delay, and wherein the first and second ultrasonic transducer elements, the first transmit control circuit, and the second transmit control circuit are formed on a single solid state semiconductor die.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×