Downhole electronics with pressure transfer medium

• US 9,523,270 B2
• Filed: 09/24/2008
• Issued: 12/20/2016
• Est. Priority Date: 09/24/2008
• Status: Active Grant

• Current Assignee: Halliburton Energy Services Incorporated (Halliburton Company)
• Original Assignee: Halliburton Energy Services Incorporated (Halliburton Company)
• Inventors: Fripp, Michael L., Kyle, Donald G., Dejesus, Orlando, Schultz, Roger
• Primary Examiner(s): Bemko, Taras P
• Application Number:
  US13/120,796
• Publication Number:
  US 20110168390A1
• Time in Patent Office: 3,009 Days
• Field of Search: 166/66, 166/250.07, 166/264, 166/302, 166/162, 175 40- 42, 175 44- 46, 175 48- 50, 175 57- 59, 175/60, 7315251-15253, 73299-303
• US Class Current: 1/1
• CPC Class Codes: E21B 47/017 Protecting measuring instruments

Abstract

Disclosed embodiments include apparatus and methods for transferring a pressure to downhole electronics with a pressure transfer medium. An embodiment of the apparatus includes a body supporting a moveable pressure transfer member, a pressure transfer medium contained by the body and the moveable pressure transfer member, and an electronic component disposed in the pressure transfer medium, wherein the pressure transfer member is moveable to transfer a pressure to the pressure transfer medium and the electronic component. Another embodiment of the apparatus includes a moveable enclosure and a non-conductive material, wherein the non-conductive material isolates an electronic component from a downhole fluid and the moveable enclosure is operable to transfer a hydrostatic pressure to the non-conductive material and the electronic component. An embodiment of a method includes transferring a downhole hydrostatic pressure to an electronic component via a flexible package and a pressure transfer medium.

Claims

1. A downhole apparatus, comprising:

a body disposed in a downhole fluid with a hydrostatic pressure;

a cavity positioned along the body, wherein a barrier is positioned over the cavity;

a flexible enclosure positioned inside the cavity;

a pressure transfer medium positioned inside the flexible enclosure; and

an electronic component positioned in the pressure transfer medium,

wherein the flexible enclosure;

completely surrounds the pressure transfer medium and the electronic component;

isolates the electronic component from the downhole fluid; and

transfers the hydrostatic pressure to the electronic component via the pressure transfer medium.

2. A downhole apparatus as defined in claim 1, wherein:

the body is a tubular having an inner and outer surface; and

the barrier is positioned adjacent the outer surface.

3. A downhole apparatus as defined in claim 1, wherein:

the body is a tubular having an inner and outer surface; and

the barrier is positioned adjacent the inner surface.

4. A downhole apparatus as defined in claim 1, wherein the pressure transfer medium comprises any one or more of a mineral oil, a silicon oil, a hydraulic fluid, a water-based fluid, an alcohol-based fluid, an oil-based fluid, a polyglycol, a triol and a polyol.

5. A downhole apparatus as defined in claim 1, wherein the electronic component comprises at least one of a digital electronics, signal-conditioning electronics, communication electronics, processing electronics, a circuit board, a capacitor, a resistor, an inductor, a transistor, an oscillator, a resonator, a semiconductor chip, a processor, a memory chip, a power supply, a primary battery or a secondary battery.

6. A downhole apparatus as defined in claim 1, wherein the electronic component is operable for downhole energy production.

7. A downhole apparatus as defined in claim 1, wherein the electronic component is operable at greater than 100°

C.

8. A method for pressurizing an electronic component as defined in any one of claims 1-7, comprising:

deploying the apparatus downhole;

exposing the flexible enclosure to hydrostatic pressure; and

transferring the hydrostatic pressure to the electronic component via the pressure transfer medium.