Capacitor-referenced temperature sensing

• US 9,523,615 B1
• Filed: 10/30/2015
• Issued: 12/20/2016
• Est. Priority Date: 09/09/2011
• Status: Active Grant

• Current Assignee: SiTime Corporation (Megachips Corporation)
• Original Assignee: SiTime Corporation (Megachips Corporation)
• Inventors: Perrott, Michael H., Lee, Shungneng
• Primary Examiner(s): Verbitsky, Gail Kaplan
• Application Number:
  US14/927,864
• Time in Patent Office: 417 Days
• Field of Search: 374170-172, 374/183, 374/184, 374/185, 374/163, 374/178
• US Class Current: 1/1
• CPC Class Codes: G01K 2219/00 Thermometers with dedicated analog to digital converters
• CPC Class Codes: G01K 7/12 Arrangements with respect to the cold junction, e.g. preventing influence of temperature of surrounding air
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: G01K 7/186 using microstructures
• CPC Class Codes: G01K 7/22 the element being a non-linear resistance, e.g. thermistor G01K7/26 takes precedence
• CPC Class Codes: G01K 7/226 using microstructures, e.g. silicon spreading resistance
• CPC Class Codes: G01K 7/34 using capacitative elements capacitors per se H01G
• CPC Class Codes: H03B 5/04 Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
• CPC Class Codes: H03B 5/30 with frequency-determining element being electromechanical resonator
• CPC Class Codes: H03H 9/02244 of microelectro-mechanical resonators
• CPC Class Codes: H03L 1/02 against variations of temperature only

Abstract

The temperature-dependent resistance of a MEMS structure is compared with an effective resistance of a switched CMOS capacitive element to implement a high performance temperature sensor.

Claims

1. A temperature sensor comprising:

a microelectromechanical-system (MEMS) structure having a resistance that varies with temperature;

a complementary-metal-oxide-semiconductor (CMOS) capacitive element that exhibits an effective resistance to an alternating current;

circuitry to determine a difference, indicative of change in temperature, between the resistance of the MEMS structure and the effective resistance of the CMOS capacitive element.

2. The temperature sensor of claim 1 wherein the CMOS capacitive element comprises a plurality of CMOS capacitors coupled in a capacitive network.

3. The temperature sensor of claim 1 further comprising a signal generating circuit to generate a switching signal that switchably enables the alternating current to flow into and out of the CMOS capacitive element such that a DC voltage develops across the CMOS capacitive element.

4. The temperature sensor of claim 3 wherein the signal generating circuit comprises a MEMS oscillator to generate a reference clock signal and circuitry to cycle the switching signal between first and second amplitudes at a variable switching frequency that is dependent, at least in part, on the reference clock signal.

5. The temperature sensor of claim 3 wherein the signal generating circuit comprises control circuitry to transition the switching signal between first and second states at a variable switching frequency and wherein the DC voltage developed across the CMOS capacitive element, and correspondingly the effective resistance thereof, is dependent upon the switching frequency.

6. The temperature sensor of claim 5 wherein the control circuitry is coupled to receive a feedback signal from the circuitry that determines the difference between the resistance of the MEMS structure and the effective resistance of the CMOS capacitive element.

7. The temperature sensor of claim 6 wherein the feedback signal is dependent, at least in part, on the difference between the resistance of the MEMS structure and the effective resistance of the CMOS capacitive element, and wherein the control circuitry adjusts the switching frequency of the switching signal in response the feedback signal to form a feedback loop.

8. The temperature sensor of claim 7 wherein the control circuitry that adjusts the switching frequency of the switching signal in response the feedback signal to form a feedback loop comprises circuitry to adjust the switching frequency in a direction, higher or lower, that reduces the difference between the resistance of the MEMS structure and the effective resistance of the CMOS capacitive element, effecting a negative feedback loop.

9. The temperature sensor of claim 8 wherein the circuitry to adjust the switching frequency in a direction that reduces the difference between the resistance of the MEMS structure and the effective resistance of the CMOS capacitive element to effect the negative feedback loop comprises circuitry to adjust a digital control value and wherein the control circuitry to transition the switching signal between the first and second states at the variable switching frequency comprises circuitry to transition the switching signal between the first and second states at a frequency dependent at least in part on the digital control value.

10. The temperature sensor of claim 9 further comprising output circuitry to generate a digital output value representative of the change in temperature based, at least in part, on the digital control value.

11. The temperature sensor of claim 1 wherein the circuitry to determine the difference between the resistance of the MEMS structure and the effective resistance of the CMOS capacitive element comprises:

a first bias circuit to drive a first bias current through the MEMS structure such that a first voltage develops across the MEMS structure representative of the resistance thereof; and

a second bias circuit that switchably enables the alternating current to charge the CMOS capacitive element to a second voltage representative of the effective resistance thereof; and

comparator circuitry to compare the first and second voltages.

12. A method of operation within a temperature sensor, the method comprising:

generating a first signal representative of a temperature-dependent resistance of a microelectromechanical-system (MEMS) structure;

applying an alternating current to a complementary-metal-oxide-semiconductor (CMOS) capacitive element to generate a second signal representative of an effective resistance of the CMOS capacitive element; and

determining a difference, indicative of change in temperature, between the first and second signals.

13. The method of claim 12 wherein applying an alternating current to a CMOS capacitive element comprises applying an alternating current to a plurality of CMOS capacitors coupled in a capacitive network.

14. The method of claim 12 wherein applying an alternating current to a CMOS capacitive element to generate a second signal representative of an effective resistance of the CMOS capacitive element comprises generating a switching signal that switchably enables current to flow into and out of the CMOS capacitive element such that a DC voltage develops across the CMOS capacitive element.

15. The method of claim 14 wherein the generating the switching signal comprises generating a reference clock signal using a MEMS oscillator, and cycling the switching signal between first and second amplitudes at a variable switching frequency that is dependent, at least in part, on the reference clock signal.

16. The method of claim 14 wherein generating the switching signal comprises transitioning the switching signal between first and second states at a variable switching frequency and wherein the DC voltage developed across the CMOS capacitive element, and correspondingly the effective resistance thereof, is dependent upon the switching frequency.

17. The method of claim 16 further comprising adjusting the switching frequency of the switching signal in response to the difference between the first and second signals, representative of the resistance of the MEMS structure and the effective resistance of the CMOS capacitive element, respectively, to form a feedback loop.

18. The method of claim 17 wherein adjusting the switching frequency of the switching signal in response to the difference between the first and second signals to form a feedback loop comprises adjusting the switching frequency in a direction, higher or lower, that reduces the difference between the first and second signals to effect a negative feedback loop.

19. The method of claim 18 wherein adjusting the switching frequency in a direction that reduces the difference between the first and second signals to effect the negative feedback loop comprises adjusting a digital control value and transitioning the switching signal between the first and second states at a frequency dependent at least in part on the digital control value.

20. The method of claim 19 further comprising generating a digital output value representative of the change in temperature based, at least in part, on the digital control value.

21. The method of claim 12 wherein generating the first signal representative of the temperature-dependent resistance of the MEMS structure comprises conducting a first bias current through the MEMS structure to develop, as the first signal, a voltage across the MEMS structure, and wherein applying the alternating current to the CMOS capacitive element to generate the second signal representative of the effective resistance thereof comprises switchably enabling a second bias current to charge the CMOS capacitive element.

22. A temperature sensor comprising:

a microelectromechanical-system (MEMS) structure having a temperature-dependent resistance;

a complementary-metal-oxide-semiconductor (CMOS) capacitive element;

means for generating a first signal representative of the temperature-dependent resistance of the MEMS structure;

means for applying an alternating current to the CMOS capacitive element to generate a second signal representative of an effective resistance of the CMOS capacitive element; and

means for determining a difference, indicative of change in temperature, between the first and second signals.