Thermal kinetic inductance detector
First Claim
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1. A thermal kinetic inductance device for x-ray detection, comprising:
- a superconducting inductor with thermally variable inductance thermally isolated from a heat bath;
an x-ray absorber in thermal contact with the inductor via an energy mediating layer;
a capacitor in electrical communication with the superconducting inductor;
wherein the capacitor and the superconducting inductor forming a resonant circuit and the superconducting inductor configured to undergo an inductance change from thermal energy from the x-ray absorber.
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Abstract
A microcalorimeter for radiation detection that uses superconducting kinetic inductance resonators as the thermometers. The detector is frequency-multiplexed which enables detector systems with a large number of pixels.
15 Citations
20 Claims
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1. A thermal kinetic inductance device for x-ray detection, comprising:
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a superconducting inductor with thermally variable inductance thermally isolated from a heat bath; an x-ray absorber in thermal contact with the inductor via an energy mediating layer; a capacitor in electrical communication with the superconducting inductor; wherein the capacitor and the superconducting inductor forming a resonant circuit and the superconducting inductor configured to undergo an inductance change from thermal energy from the x-ray absorber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus for x-ray detection comprising:
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a thermal kinetic inductance device; a cryostat with operating temperature near 0.1 K a microwave synthesizer; a low noise amplifier; a plurality of IQ mixers; a digitizer; and variable attenuators. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for fabricating a thermal kinetic inductance detector comprising:
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fabricating a micrometer SiN membrane on a Silicon wafer; fabricating a resonator by deposition, lithography, then etch; fabricating a resist strip; fabricating an absorber by lithography, followed by deposition and liftoff; creating a SiN bridge via lithography with backside SiN membrane lithography and backside Silicon etch; depositing a protective coating of Al; and etching the SiN bridge.
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Specification