Power quad flat no-lead (PQFN) package having control and driver circuits

• US 9,524,928 B2
• Filed: 01/03/2014
• Issued: 12/20/2016
• Est. Priority Date: 12/13/2010
• Status: Active Grant

• Current Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Original Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Inventors: Fernando, Dean, Barbosa, Roel, Takahashi, Toshio
• Primary Examiner(s): Gumedzoe, Peniel M
• Application Number:
  US14/147,464
• Publication Number:
  US 20140117517A1
• Time in Patent Office: 1,082 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 23/4952 : the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49541 : Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 : Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13064 : High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase power inverter, a control circuit, and a driver circuit. The driver circuit is configured to drive the multi-phase power inverter responsive to a control signal from the control circuit. The multi-phase power inverter, the control circuit, and the driver circuit are each situated on a PQFN leadframe of the PQFN package. The control circuit and the driver circuit can be in a common integrated circuit (IC). Furthermore, the control circuit can be configured to reconstruct at least two phase currents of the multi-phase power inverter from a combined phase current.

Claims

1. A power quad flat no-lead (PQFN) package comprising:

a multi-phase power inverter, a control circuit, and a driver circuit;

said driver circuit configured to drive said multi-phase power inverter responsive to a control signal from said control circuit;

said multi-phase power inverter, said control circuit, and said driver circuit each being situated on a PQFN leadframe of said PQFN package;

said driver circuit connected to a phase output strip of said leadframe;

wherein said phase output strip extends from a phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

2. The PQFN package of claim 1, wherein said control circuit and said driver circuit are in a single common integrated circuit (IC).

3. The PQFN package of claim 2, wherein said single common IC is connected to said phase output strip and to another phase output strip of said leadframe.

4. The PQFN package of claim 1, wherein said phase output strip is selected from the group consisting of a U-phase output strip, a V-phase output strip, and a W-phase output strip.

5. The PQFN package of claim 1, wherein said control circuit is configured to reconstruct at least two phase currents of said multi-phase power inverter from a combined phase current.

6. The PQFN package of claim 1, wherein said control circuit comprises a pulse width modulation circuit that is configured to generate said control signal.

7. The PQFN package of claim 1, wherein said control circuit comprises a space vector modulation circuit that is configured to generate said control signal.

8. The PQFN package of claim 1, comprising a voltage regulator for said control circuit and said driver circuit.

9. The PQFN package of claim 8, wherein said voltage regulator is on a common IC with said control circuit and said driver circuit.

10. The PQFN package of claim 1, wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.

11. The PQFN package of claim 1, wherein said PQFN package has a footprint of less than 12 mm by 12 mm.

12. A power quad flat no-lead (PQFN) package comprising:

a multi-phase power inverter and a single common integrated circuit (IC);

said single common IC configured to generate a control signal and to drive said multi-phase power inverter responsive to said control signal;

said multi-phase power inverter and said single common IC each being situated on a PQFN leadframe of said PQFN package;

said single common IC connected to a phase output strip of said leadframe;

wherein said phase output strip extends from a phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

13. The PQFN package of claim 12, wherein said single common IC is connected to said phase output strip and to another phase output strip of said leadframe.

14. The PQFN package of claim 12, wherein said common IC is configured to reconstruct at least two phase currents of said multi-phase power inverter from a combined phase current.

15. The PQFN package of claim 12, wherein said common IC is configured to generate said control signal as a pulse width modulated (PWM) control signal.

16. The PQFN package of claim 12, comprising a voltage regulator configured to power a control circuit and a driver circuit of said common IC.

17. The PQFN package of claim 12, wherein said common IC comprises a voltage regulator configured to power a control circuit and a driver circuit of said common IC.

18. A power quad flat no-lead (PQFN) package comprising:

high side power switches, low side power switches, a control circuit, and a driver circuit;

said high side and low side power switches situated on a PQFN leadframe;

said driver circuit configured to drive said high side and low side power switches responsive to a control signal from said control circuit;

said driver circuit and said control circuit being situated on a same die pad of said PQFN leadframe;

said driver circuit connected to a phase output strip of said leadframe;

wherein said phase output strip extends from a phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

19. The PQFN package of claim 18, wherein said control circuit and said driver circuit are in a single common integrated circuit (IC).

20. The PQFN package of claim 18, further comprising a leadframe island situated on said phase output strip and die exposed on a bottom-side of said PQFN package.

21. The PQFN package of claim 18, wherein said high side power switches comprise group III-V transistors.

22. The PQFN package of claim 18, wherein said low side power switches comprise group III-V transistors.