Back-to-back stacked dies

• US 9,524,957 B2
• Filed: 01/26/2012
• Issued: 12/20/2016
• Est. Priority Date: 08/17/2011
• Status: Active Grant

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Hebert, Francois, Rivet, Steven R., Althar, Michael, Oaklander, Peter
• Primary Examiner(s): Vo, Peter DungBa
• Assistant Examiner(s): Parvez, Azm
• Application Number:
  US13/358,718
• Publication Number:
  US 20130043940A1
• Time in Patent Office: 1,790 Days
• Field of Search: 298/27, 298/25, 295/921, 257/778, 257/737, 257/666, 257/E23.068, 257/E23.031, 257/E25.029, 257/E21.499, 257/777, 257/734, 327/564, 438/108, 361/760
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83801 : Soldering or alloying
• CPC Class Codes: H01L 2224/83855 : Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06558 : the devices having passive surfaces facing each other, i.e. in a back-to-back arrangement
• CPC Class Codes: H01L 2225/06589 : Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/367 : Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3732 : Diamonds
• CPC Class Codes: H01L 23/4334 : Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49517 : Additional leads
• CPC Class Codes: H01L 23/49541 : Geometry of the lead-frame
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/645 : Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/10162 : with a square active surface
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13064 : High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1425 : Converter
• CPC Class Codes: H01L 2924/14253 : Digital-to-analog converter [DAC]
• CPC Class Codes: H01L 2924/1426 : Driver
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device

Abstract

Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Claims

1. A method of manufacturing a packaged circuit having a first die mounted on an inverted second die, the method comprising:

mounting the second die to a lead frame such that an active side of the second die is attached to the lead frame, wherein the second die includes a power stage with source, drain, and gate connections on the active side;

mounting the first die to a backside of the second die such that a backside of the first die is attached to the backside of the second die, wherein the first die has a lateral structure with all signal connections on an active side of the first die, said signal connections include source, drain, and gate connections;

electrically coupling the active side of the first die to the lead frame; and

electrically coupling the backside of the second die to the lead frame, wherein electrically coupling the backside includes electrically coupling a substrate of the second die to the lead frame.

2. The method of claim 1, wherein the first die comprises a controller.

3. The method of claim 1, wherein mounting the second die to the lead frame includes electrically coupling the second die to the lead frame using one or more of solder balls on the second die or solder on pads of the lead frame.

4. The method of claim 1, wherein mounting the first die to the backside of the second die includes using one of solder or epoxy to attach the backside of the first die to the backside of the second die.

5. The method of claim 1, wherein electrically coupling the active side of the first die to the lead frame includes wire bonding, using one or more copper clips, or using one or more aluminum ribbons.

6. The method of claim 1, comprising:

mounting a third die to the backside of the second die such that a backside of the third die is attached to the backside of the second die; and

electrically coupling an active side of the third die to the active side of the first die.

7. The method of claim 1, comprising:

depositing molding compound over the second die and the first die; and

curing the molding compound.

8. The method of claim 7, comprising:

attaching a thermal plug to the backside of the second die; and

grinding the molding compound to expose the thermal plug.

9. The method of claim 1, comprising:

electrically coupling the backside of the first die to the lead frame.

10. The method of claim 9, wherein electrically coupling the backside of the first die includes electrically coupling a substrate of the first die to the lead frame.

11. The method of claim 1, wherein the second die has a lateral structure.