Light emitting device

• US 9,525,115 B2
• Filed: 10/20/2014
• Issued: 12/20/2016
• Est. Priority Date: 01/30/2009
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Inobe, Mototaka, Yamada, Motokazu, Kamada, Kazuhiro
• Primary Examiner(s): MENZ, LAURA MARY
• Application Number:
  US14/517,965
• Publication Number:
  US 20150034992A1
• Time in Patent Office: 792 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a substrate, metallization, a light emitting element, conducting wire, light reflective resin, and insulating material. The metallization is provided on a surface of the substrate that is made of insulating substance. The light emitting element is mounted on the substrate. The conducting wire electrically connects the metallization and the light emitting element. The light reflective resin is provided on the substrate to reflect light from the light emitting element. The insulating material covers at least part of metallization surfaces. The insulating material is established to come in contact with a side of the light emitting element.

Claims

1. A light emitting device comprising:

a substrate comprising;

a first member that is made of insulating substance; and

a second member which is made of insulating substance, the second member being dimensioned smaller than the first member and laminated on the first member;

metallization provided at least partially on a surface of the substrate;

a light emitting element mounted on the substrate;

conducting wire that electrically connects the metallization and the light emitting element;

light reflective resin provided on the substrate to reflect light from the light emitting element; and

insulating material that covers at least part of metallization surfaces, the insulating material being established to come in contact with a side of the light emitting element.

2. The light emitting device as cited in claim 1,

wherein the substrate has cavities with bottom and side surfaces,

wherein the cavities include

a first cavity where the light emitting element is mounted, and

second cavities provided inside the first cavity and respectively having bottom surfaces positioned lower than the first cavity, and

wherein the light reflective resin is established on the metallization inside the second cavities.

3. The light emitting device as cited in claim 2, wherein the insulating material covers side-walls of the second cavities that connect with the first cavity.

4. The light emitting device as cited in claim 2, wherein the light reflective resin extends upwards from the second cavities to a position above a bottom surface of the first cavity.

8. The light emitting device as cited in claim 1, wherein the insulating material is established to cover surfaces of the conducting wire continuously from an upper surface of the light emitting element.

9. The light emitting device as cited in claim 1, wherein the insulating material covers essentially entirely an upper surface of the substrate.

10. The light emitting device as cited in claim 1, wherein encapsulating material is provided on an upper surface of the substrate to encapsulate the light emitting element, essentially all surfaces of the conducting wire, and at least part of the insulating material.

11. The light emitting device as cited in claim 1, wherein the insulating material has light transparency.

12. The light emitting device as cited in claim 1, wherein the insulating material comprises an inorganic compound.

13. The light emitting device as cited in claim 1, wherein the insulating material comprises SiO2.

14. The light emitting device as cited in claim 1,

wherein the light emitting element is mounted on the metallization, and

wherein the metallization functions as an electrode.

15. The light emitting device as cited in claim 1, wherein the substrate comprises ceramics.

16. The light emitting device as cited in claim 1, wherein the insulating material is formed in particulate or needle form.

17. The light emitting device as cited in claim 1, wherein the light emitting element includes a plurality of light emitting elements, and the plurality of light emitting elements is mounted on the second member of the substrate.

18. The light emitting device as cited in claim 1, wherein the second member is located between the light emitting element and the first member.

19. The light emitting device as cited in claim 1,

wherein the metallization is provided directly on the second member, and

wherein the light emitting element is provided directly on the metallization.

20. The light emitting device as cited in claim 1, wherein the insulating material being established to come in contact with a side of the second member.

5. A light emitting device comprising:

a substrate comprising;

a first member that is made of insulating substance; and

a second member which is made of insulating substance, the second member being dimensioned smaller than the first member and laminated on the first member;

metallization provided at least partially on a surface of the substrate;

a light emitting element mounted on the substrate;

conducting wire that electrically connects the metallization and the light emitting element;

light reflective resin provided on the substrate to reflect light from the light emitting element; and

insulating material that covers at least part of metallization surfaces, the insulating material being established continuously over the metallization surfaces and on an upper surface of the light emitting element.

6. The light emitting device as cited in claim 5,

wherein the insulating material is established intervening between the metallization and the light reflective resin, and

wherein the insulating material extends continuously over the upper surface of the light emitting element.

7. The light emitting device as cited in claim 5,

wherein the insulating material is established on a surface of the light reflective resin, and

wherein the insulating material extends continuously over the upper surface of the light emitting element.