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Heat-reduction methods and systems related to microfluidic devices

  • US 9,528,142 B2
  • Filed: 06/05/2015
  • Issued: 12/27/2016
  • Est. Priority Date: 02/14/2001
  • Status: Active Grant
First Claim
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1. A method for reducing transfer of heat to selected regions of a microfluidic complex, the method comprising:

  • providing a microfluidic complex comprising at least one thermally actuated component and a heating surface;

    providing a substrate comprising first side, a second side, a thermally isolating layer between the first side and the second side, a heating element positioned between the first side and the thermally isolating layer, and a conductive lead;

    positioning the heating surface of the microfluidic complex adjacent to the first side of the substrate; and

    applying a current to the heating element thereby heating the microfluidic complex through the heating surface, wherein the conductive lead passes from the heating element, through the thermally isolating layer, and to a current source, so as to substantially thermally isolate the conductive lead from the microfluidic complex.

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