Heat-reduction methods and systems related to microfluidic devices
First Claim
1. A method for reducing transfer of heat to selected regions of a microfluidic complex, the method comprising:
- providing a microfluidic complex comprising at least one thermally actuated component and a heating surface;
providing a substrate comprising first side, a second side, a thermally isolating layer between the first side and the second side, a heating element positioned between the first side and the thermally isolating layer, and a conductive lead;
positioning the heating surface of the microfluidic complex adjacent to the first side of the substrate; and
applying a current to the heating element thereby heating the microfluidic complex through the heating surface, wherein the conductive lead passes from the heating element, through the thermally isolating layer, and to a current source, so as to substantially thermally isolate the conductive lead from the microfluidic complex.
1 Assignment
0 Petitions
Accused Products
Abstract
Systems and methods for preventing or reducing unwanted heat in a microfluidic device while generating heat in selected regions of the device are described. Current can be supplied to a heating element through electric leads that are designed so that the current density in the leads is substantially lower than the current density in the heating element. Unwanted heat in the microfluidic complex can be reduced by thermally isolating the electric leads from the microfluidic complex by, for example, running each lead directly away from the microfluidic complex. Unwanted heat can be removed from selected regions of the microfluidic complex using one or more cooling devices.
-
Citations
20 Claims
-
1. A method for reducing transfer of heat to selected regions of a microfluidic complex, the method comprising:
-
providing a microfluidic complex comprising at least one thermally actuated component and a heating surface; providing a substrate comprising first side, a second side, a thermally isolating layer between the first side and the second side, a heating element positioned between the first side and the thermally isolating layer, and a conductive lead; positioning the heating surface of the microfluidic complex adjacent to the first side of the substrate; and applying a current to the heating element thereby heating the microfluidic complex through the heating surface, wherein the conductive lead passes from the heating element, through the thermally isolating layer, and to a current source, so as to substantially thermally isolate the conductive lead from the microfluidic complex. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method for reducing transfer of heat generated by a heating element in a microfluidic processing system, the method comprising:
-
providing a substrate having at least one heating element; providing a microfluidic complex comprising a first heating surface proximate to at least one thermally actuated component of the microfluidic complex; placing the first heating surface of the microfluidic complex in thermal communication with the at least one heating element of the substrate; and supplying electric current to the at least one heating element from a terminal at the edge of the substrate, wherein the at least one heating element is thermally isolated from the edge of the substrate from which electric current is supplied. - View Dependent Claims (10, 11, 12, 13, 14, 15)
-
-
16. A method of manufacturing a microfluidic processing system, the method comprising:
-
providing a substrate comprising a heating element configured to apply heat to a thermally actuated component; providing a microfluidic complex comprising a first heating surface proximate to a thermally actuated component of the microfluidic complex; and thermally isolating a conductive lead from the microfluidic complex. - View Dependent Claims (17, 18, 19, 20)
-
Specification