Integrated circuit device
First Claim
Patent Images
1. A packaged optoelectronic chip comprising:
- a die including at least one of a radiation emitter and a radiation receiver, the die including a first surface, a second opposed surface, edge surfaces extending in a direction away from the first surface, and bond pads exposed at the first surface of the die;
a transparent packaging layer overlying one of the first and second surfaces of the die, the transparent packaging layer having an inner surface facing the die, an opposed outer surface, and a plurality of edges, the plurality of edges defining a step and each of the plurality of edges having surfaces facing an exterior of the chip package, at least some of the plurality of edges extending at least partially between the inner and outer surfaces of the transparent packaging layer, the at least some of the plurality of edges including a first edge surface bounding an exterior perimeter of the inner surface and a second edge surface bounding an exterior perimeter of the outer surface; and
an opaque layer covering a portion of the transparent packaging layer adjacent at least one of the plurality of edges of the transparent packaging layer.
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Abstract
An integrally packaged optronic integrated circuit device including an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having a transparent packaging layer overlying a surface of the die, the transparent packaging layer having an opaque coating adjacent to edges of the layer.
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Citations
20 Claims
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1. A packaged optoelectronic chip comprising:
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a die including at least one of a radiation emitter and a radiation receiver, the die including a first surface, a second opposed surface, edge surfaces extending in a direction away from the first surface, and bond pads exposed at the first surface of the die; a transparent packaging layer overlying one of the first and second surfaces of the die, the transparent packaging layer having an inner surface facing the die, an opposed outer surface, and a plurality of edges, the plurality of edges defining a step and each of the plurality of edges having surfaces facing an exterior of the chip package, at least some of the plurality of edges extending at least partially between the inner and outer surfaces of the transparent packaging layer, the at least some of the plurality of edges including a first edge surface bounding an exterior perimeter of the inner surface and a second edge surface bounding an exterior perimeter of the outer surface; and an opaque layer covering a portion of the transparent packaging layer adjacent at least one of the plurality of edges of the transparent packaging layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 19)
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16. A packaged optoelectronic chip comprising:
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a die including an active front surface, a rear surface, and at least one of a radiation emitter and a radiation receiver; a transparent packaging layer overlying the active front surface of the die, the transparent packaging layer having an outer surface facing away from the die, and an edge extending away from the outer surface; an insulating layer having a bottom surface and an opposed top surface facing the rear surface of the die, the insulated layer spaced apart from the transparent packaging layer and having an insulated edge surface extending between the top and bottom surfaces; and a plurality of contacts extending along the insulated edge surface and exposed at an exterior portion of the packaged optoelectronic chip, the plurality of contacts electrically connected with the die and spaced apart from the transparent packaging layer, wherein at least a first portion of the outer surface is exposed at another exterior portion of said packaged optoelectronic chip and an opaque layer covers at least a second portion of the outer surface near the edge. - View Dependent Claims (17, 18, 20)
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Specification