Optical device structure using GaN substrates for laser applications

• US 9,531,164 B2
• Filed: 04/13/2010
• Issued: 12/27/2016
• Est. Priority Date: 04/13/2009
• Status: Active Grant

• Current Assignee: Kyocera SLD Laser Incorporated (Kyocera Corporation)
• Original Assignee: Soraa Laser Diode, Inc. (Kyocera Corporation)
• Inventors: Raring, James W., Feezell, Daniel F., Pfister, Nicholas J., Sharma, Rajat
• Primary Examiner(s): VAN ROY, TOD THOMAS
• Application Number:
  US12/759,273
• Publication Number:
  US 20100316075A1
• Time in Patent Office: 2,450 Days
• Field of Search: 372/44.011
• US Class Current: 1/1
• CPC Class Codes: H01L 21/02389 Nitrides
• CPC Class Codes: H01L 21/02433 Crystal orientation
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01S 5/0202 Cleaving
• CPC Class Codes: H01S 5/028 Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
• CPC Class Codes: H01S 5/0287 Facet reflectivity
• CPC Class Codes: H01S 5/2009 by using electron barrier layers
• CPC Class Codes: H01S 5/2201 in a specific crystallographic orientation
• CPC Class Codes: H01S 5/32025 non-polar orientation
• CPC Class Codes: H01S 5/32341 blue laser based on GaN or GaP

Abstract

An optical device includes a gallium nitride substrate member having an m-plane nonpolar crystalline surface region characterized by an orientation of about −2 degrees to about 2 degrees towards (000-1) and less than about 0.5 degrees towards (11-20). The device also has a laser stripe region formed overlying a portion of the m-plane nonpolar crystalline orientation surface region. A first cleaved c-face facet is provided on one end of the laser stripe region, and a second cleaved c-face facet is provided on the other end of the laser stripe region.

Claims

1. An optical device comprising:

a gallium and nitrogen containing substrate member having an m-plane nonpolar crystalline surface region characterized by an off-cut orientation of about −

2 degrees to about 2 degrees toward (000-1) and less than about 0.5 degrees toward (11-20), the off-cut orientation not inclusive of zero degrees toward (000-1);

a laser stripe region formed overlying a portion of the m-plane nonpolar crystalline surface region, the laser stripe region being characterized by a cavity orientation substantially parallel to a c-direction, the laser stripe region having a first end and a second end;

a first cleaved c-face facet provided on the first end of the laser stripe region, the first cleaved c-face facet comprising a first mirror surface, the first cleaved c-face facet having first laser scribed regions extending intermittently along a first upper edge of the first cleaved c-face facet to provide a first saw tooth profile, wherein each of the first laser scribed regions forms a tooth of the first saw tooth profile, each of the first laser scribed regions is spaced from adjacent ones of the first laser scribed regions by smooth surfaces of the first cleaved c-face facet, and a depth that the first laser scribed regions extend downward from the first upper edge toward the m-plane nonpolar crystalline surface region varies across the first cleaved c-face facet; and

a second cleaved c-face facet provided on the second end of the laser stripe region, the second cleaved c-face facet comprising a second mirror surface, the second cleaved c-face facet having second laser scribed regions extending intermittently along a second upper edge of the second cleaved c-face facet to provide a second saw tooth profile, wherein each of the second laser scribed regions forms a tooth of the second saw tooth profile, each of the second laser scribed regions is spaced from adjacent ones of the second laser scribed regions by smooth surfaces of the second cleaved c-face facet, and a depth that the second laser scribed regions extend downward from the second upper edge toward the m-plane nonpolar crystalline surface region varies across the second cleaved c-face facet.

2. The device of claim 1 wherein the first cleaved c-face facet is substantially parallel with the second cleaved c-face facet.

3. The device of claim 1 wherein the first mirror surface is provided by a scribing and breaking process from a front side of the gallium and nitrogen containing substrate member.

4. The device of claim 3 wherein the first mirror surface comprises a coating to modify the reflection characteristic.

5. The device of claim 4 wherein the coating is selected from silicon dioxide, hafnia, titania, tantalum pentoxide, and Al₂O₃.

6. The device of claim 1 wherein the second mirror surface is provided by a scribing and breaking process.

7. The device of claim 1 wherein the second mirror surface comprises a coating to modify the reflection characteristic.

8. The device of claim 7 wherein the coating is selected from silicon dioxide, hafnia, titania, tantalum pentoxide, and Al₂O₃.

9. The device of claim 1 wherein the laser stripe region has a length ranging from about 100 microns to about 2000 microns.

10. The device of claim 1 wherein the laser stripe region has a width ranging from about 1 micron to about 15 microns.

11. The device of claim 1 further comprising a spontaneously emitted light polarized perpendicular to the c-direction.

12. The device of claim 1 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 385 to about 420 nanometers.

13. The device of claim 1 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 420 to about 460 nanometers.

14. The device of claim 1 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 460 to about 500 nanometers.

15. The device of claim 1 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 500 to about 550 nanometers.

16. The device of claim 1 wherein the laser stripe is provided by an etching process selected from dry etching and wet etching.

17. The device of claim 1 further comprising an n-type metal region overlying a backside of the gallium and nitrogen containing substrate member and a p-type metal region overlying an upper portion of the laser stripe region.

18. The device of claim 1 wherein the laser stripe region comprises an overlying dielectric layer exposing an upper portion of the laser stripe region.

19. The device of claim 1 further comprising an n-type gallium nitride region overlying the surface region, an active region overlying the n-type gallium nitride region, and the laser stripe region overlying the active region.

20. The device of claim 19 wherein the active region comprises one to twenty quantum well regions, the one to twenty quantum well regions characterized by a thickness of 10 Angstroms to about 40 Angstroms.

21. The device of claim 19 wherein the active region comprises one to twenty quantum well regions, the one to twenty quantum well regions characterized by a thickness of 40 Angstroms to about 80 Angstroms.

22. The device of claim 19 further comprising an electron blocking region, wherein the electron blocking region overlies the active region.

23. The device of claim 19 further comprising a separate confinement hetero-structure, wherein the separate confinement hetero-structure overlies the n-type gallium nitride region.

24. A method for forming an optical device comprising:

providing a gallium nitride substrate member having an m-plane nonpolar crystalline surface region characterized by an orientation of about −

2 degrees to about 2 degrees towards (000-1) and less than about 0.5 degrees towards (11-20), the off-cut orientation not inclusive of zero degrees toward (000-1);

forming a laser stripe region overlying a portion of the m-plane nonpolar crystalline surface region, the laser stripe region being characterized by a cavity orientation substantially parallel to a c-direction, the laser stripe region having a first end and a second end and having a top and a bottom, the bottom being closer to the m-plane nonpolar crystalline surface region than the top; and

forming a pair of cleaved facets including a first cleaved c-face facet provided on the first end of the laser stripe region and a second cleaved c-face facet provided on the second end of the laser stripe region, the first cleaved c-face facet comprising a first mirror surface, the first cleaved c-face facet having first laser scribed regions extending intermittently along a first upper edge of the first cleaved c-face facet to provide a first saw tooth profile, wherein each of the first laser scribed regions forms a tooth of the first saw tooth profile, each of the first laser scribed regions is spaced from adjacent ones of the first laser scribed regions by smooth surfaces of the first cleaved c-face facet, and a depth that the first laser scribed regions extend downward from the first upper edge toward the m-plane nonpolar crystalline surface region varies across the first cleaved c-face facet, and the second cleaved c-face facet comprising a second mirror surface, the second cleaved c-face facet having second laser scribed regions extending intermittently along a second upper edge of the second cleaved c-face facet to provide a second saw tooth profile, wherein each of the second laser scribed regions forms a tooth of the second saw tooth profile, each of the second laser scribed regions is spaced from adjacent ones of the second laser scribed regions by smooth surfaces of the second cleaved c-face facet, and a depth that the second laser scribed regions extend downward from the second upper edge toward the m-plane nonpolar crystalline surface region varies across the second cleaved c-face facet.

25. The method of claim 24 wherein the forming of the pair of cleaved facets comprises separately forming of the first cleaved c-face facet and forming the second cleaved c-face facet.

26. The method of claim 24 further comprising coating the first cleaved c-face facet and coating the second c-face facet.

27. The method of claim 24 wherein the pair of cleaved facets is formed before a singulating process.

28. An optical device comprising:

a gallium and nitrogen containing substrate member having a {20-21} crystalline surface region characterized by an off-cut orientation of −

8 degrees to −

2 degrees or 2 degrees to 8 degrees toward a c-plane;

a laser stripe region formed overlying a portion of the crystalline surface region, the laser stripe region having a first end and a second end;

a first cleaved facet provided on the first end of the laser stripe region, the first cleaved facet comprising a first mirror surface, the first cleaved facet having first laser scribed regions extending intermittently along a first upper edge of the first cleaved c-face facet to provide a first saw tooth profile, wherein each of the first laser scribed regions forms a tooth of the first saw tooth profile, each of the first laser scribed regions is spaced from adjacent ones of the first laser scribed regions by smooth surfaces of the first cleaved c-face facet, and a depth that the first laser scribed regions extend downward from the first upper edge toward the m-plane nonpolar crystalline surface region varies across of the first cleaved facet; and

a second cleaved facet provided on the second end of the laser stripe region, the second cleaved facet comprising a second mirror surface, the second cleaved facet having second laser scribed regions extending intermittently along a second upper edge of the second cleaved c-face facet to provide a second saw tooth profile, wherein each of the second laser scribed regions forms a tooth of the second saw tooth profile, each of the second laser scribed regions is spaced from adjacent ones of the second laser scribed regions by smooth surfaces of the second cleaved c-face facet, and a depth that the second laser scribed regions extend downward from the second upper edge toward the m-plane nonpolar crystalline surface region varies across the second cleaved facet.

29. The device of claim 28 wherein the first cleaved facet is substantially parallel with the second cleaved facet.

30. The device of claim 28 wherein the first mirror surface is provided by a scribing and breaking process from of the gallium and nitrogen containing substrate member.

31. The device of claim 28 wherein the first mirror surface comprises a coating to modify the reflection characteristic.

32. The device of claim 31 wherein the coating is selected from silicon dioxide, hafnia, titania, tantalum pentoxide, and Al₂O₃.

33. The device of claim 28 wherein the second mirror surface is provided by a scribing and breaking process.

34. The device of claim 28 wherein the second mirror surface comprises a coating to modify the reflection characteristic.

35. The device of claim 34 wherein the reflective coating is selected from silicon dioxide, hafnia, titania, tantalum pentoxide, and Al₂O₃.

36. The device of claim 28 wherein the laser stripe region has a length ranging from about 100 microns to about 2000 microns.

37. The device of claim 28 wherein the laser stripe region has a width ranging from about 1 micron to about 15 microns.

38. The device of claim 28 further comprising a spontaneously emitted light is polarized perpendicular to the c-direction.

39. The device of claim 28 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 385 to about 420 nanometers.

40. The device of claim 28 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 420 to about 460 nanometers.

41. The device of claim 28 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 460 to about 500 nanometers.

42. The device of claim 28 further comprising a spontaneously emitted light characterized by a wavelength ranging from about 500 to about 550 nanometers.