Printed circuit board with integrated thin film battery
First Claim
Patent Images
1. A printed circuit board comprising:
- a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the outer electrically insulating layers;
wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in a layer of epoxy material;
wherein each of said two outer electrically insulating layers of the PCB layer stack has edges that comprise a respective perimeter of each of said two outer electrically insulating layers of the PCB layer stack; and
an electrochemical cell structure inserted in said PCB layer stack between said two outer electrically insulating layers of the PCB layer stack, wherein said electrochemical cell structure is embedded between said two outer electrically insulating layers of said PCB layer stack, and wherein said electrochemical cell structure extends laterally beyond the respective perimeter of at least one of said two outer electrically insulating layers of the PCB layer stack.
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Abstract
The present invention relates to, for example, printed circuit boards having a thin film battery or other electrochemical cell between or within its layer or layers. The present invention also relates to, for example, electrochemical cells within a layer stack of a printed circuit board.
813 Citations
16 Claims
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1. A printed circuit board comprising:
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a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the outer electrically insulating layers; wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in a layer of epoxy material; wherein each of said two outer electrically insulating layers of the PCB layer stack has edges that comprise a respective perimeter of each of said two outer electrically insulating layers of the PCB layer stack; and an electrochemical cell structure inserted in said PCB layer stack between said two outer electrically insulating layers of the PCB layer stack, wherein said electrochemical cell structure is embedded between said two outer electrically insulating layers of said PCB layer stack, and wherein said electrochemical cell structure extends laterally beyond the respective perimeter of at least one of said two outer electrically insulating layers of the PCB layer stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A printed circuit board comprising:
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a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the outer electrically insulating layers; wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in a layer of epoxy material; wherein each of said two outer electrically insulating layers of the PCB layer stack has edges that comprise a respective perimeter of each of said two outer electrically insulating layers of the PCB layer stack; two electrically conducting layers inserted in said layer stack between said two outer electrically insulating layers; and an electrochemical cell inserted in said layer stack wherein said electrochemical cell is embedded between said two electrically conducting layers, and wherein said electrochemical cell extends laterally beyond the respective perimeter of at least one of said two outer electrically insulating layers of the PCB layer stack. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A printed circuit board comprising:
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a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of the two outer electrically insulating layers; wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in a layer of epoxy material; wherein each of said two outer electrically insulating layers of the PCB layer stack has edges that comprise a respective perimeter of each of said two outer electrically insulating layers of the PCB layer stack; and an electrochemical cell structure inserted in said PCB layer stack between said two outer electrically insulating layers of the PCB layer stack, wherein said electrochemical cell structure has a top layer and a bottom layer, wherein each of the top layer and the bottom layer of said electrochemical cell structure extends laterally beyond the respective perimeter of one of said two outer electrically insulating layers of said PCB layer stack, and wherein said PCB layer stack encapsulates an entirety of a top surface of the top layer of the electrochemical cell structure, and an entirety of a bottom surface of the bottom layer of the electrochemical cell structure, except where said electrochemical cell structure extends laterally beyond the respective perimeter of the one of said two outer electrically insulating layers of the PCB layer stack. - View Dependent Claims (16)
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Specification