Electronic module and method of manufacturing the same
First Claim
1. An electronic module comprising,an electronic chip comprising at least one electronic component,a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component;
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wherein the spacing element comprises a lateral surface which is in direct contact with the mold compound and comprises at least one surface structure,wherein the lateral surface is substantially perpendicular to the main surface of the spacing element, andwherein the at least one surface structure constitutes a curved lateral surface.
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Accused Products
Abstract
According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mold compound and comprises surface structures.
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Citations
12 Claims
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1. An electronic module comprising,
an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component; - and
a mold compound at least partially enclosing the electronic chip and the spacing element; wherein the spacing element comprises a lateral surface which is in direct contact with the mold compound and comprises at least one surface structure, wherein the lateral surface is substantially perpendicular to the main surface of the spacing element, and wherein the at least one surface structure constitutes a curved lateral surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An electronic module, the module comprising:
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an electronic arrangement; and a mold compound at least partially enclosing the electronic arrangement, wherein the electronic arrangement comprises a substrate, an electronic chip arranged on the substrate, and a spacing element arranged on the electronic chip, wherein the electronic arrangement further comprises a lateral surface comprising surface structures adapted to increase a surface area of the electronic arrangement, wherein the mold compound is in direct contact with the surface structures, wherein the lateral surface is substantially perpendicular to a main surface of the spacing element, wherein the main surface of the spacing element is arranged on the electronic chip, and wherein the at least one surface structure constitutes a curved lateral surface. - View Dependent Claims (11, 12)
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Specification