Metrology method and apparatus, and device manufacturing method

• US 9,535,342 B2
• Filed: 03/25/2014
• Issued: 01/03/2017
• Est. Priority Date: 11/12/2010
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Smilde, Hendrik Jan Hidde, Warnaar, Patrick
• Primary Examiner(s): NGUYEN, HUNG
• Application Number:
  US14/224,532
• Publication Number:
  US 20140204397A1
• Time in Patent Office: 1,015 Days
• Field of Search: 355/52, 355/53, 355/55, 355 67- 71, 355/77, 356/237.2, 356399-401, 250/548
• US Class Current: 1/1
• CPC Class Codes: G03F 7/70483 Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G03F 9/00 Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically G03F7/22 takes precedence; preparation of photographic masks G03F1/00; within photographic printing apparatus for making copies G03B27/00

Abstract

Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process.

Claims

1. A method comprising:

forming a structure on the substrate;

detecting, via at least two optical paths, an image of the structure through an optical system while the structure is illuminated with a beam of radiation;

determining at least one parameter of the structure based on intensity values derived from the detected image, wherein the image of the structure is smaller than an image field of the optical system;

detecting a position of the image within the image field; and

applying a correction to the detected image to reduce an influence on the at least one parameter caused by a difference between the at least two optical paths.

2. The method of claim 1, further comprising:

substantially simultaneously imaging, within the image field, a plurality of structures that each occupy less than half the area of the field of view;

deriving an intensity value separately for a portion of the image corresponding to each structure; and

the applying a correction comprising applying an intensity value in accordance with a detected position of the corresponding portion in the image field.

3. The method of claim 1, wherein the applying a correction comprises selecting a value for a correction parameter according to at least one of the at least two optical paths and applying the correction parameter to the intensity values derived from the detected image.

4. The method of claim 1, further comprising:

defining at least one correction parameter to compensate for asymmetry between the at least two optical paths.

5. The method of claim 1, wherein the applying comprises applying a correction based at least on a position of the structure within a field of view of the optical system.

6. The method of claim 1, wherein the applying comprises applying correction parameters for correcting an asymmetry in intensity between illumination or imaging modes of the at least two optical paths and for correcting a variation in illumination intensity across a field of view of the optical system.

7. The method of claim 1, wherein the detecting comprises detecting the image of the structure through a dark field metrology apparatus.

8. The method of claim 1, wherein the forming comprises forming a plurality of gratings on the substrate.

9. The method of claim 8, further comprising:

measuring a −

1^st order diffraction image of the plurality of gratings using one of the at least two optical paths; and

measuring a +1 ^st order diffraction image of the plurality of gratings using another of the at least two optical paths.

10. The method of claim 9, wherein applying a correction comprises applying a first correction to the measured −

1^st order diffraction image, and applying a second correction to the measured +1^st order diffraction image.

11. An inspection apparatus comprising:

a detection arrangement configured to form and detect, via at least two optical paths, an image of a structure on a substrate through an optical system while the structure is illuminated with a radiation beam; and

a computational arrangement configured to;

use intensity values derived from the detected image to determine at least one property of the structure,

detect a position of the image within the image field when the image of the structure is smaller than an image field of the optical system, and

in response to the detected position, apply a correction to the detected image to reduce an influence on the at least one property caused by a difference between the at least two optical paths.

12. The inspection apparatus of claim 11, wherein the computational arrangement is further configured to:

derive an intensity value for a portion of the image corresponding to each structure of a plurality of structures, when the plurality of structures are imaged simultaneously within the image field; and

apply the correction to each intensity value in accordance with a detected position of the corresponding portion in the image field.

13. The inspection apparatus of claim 11, wherein the computational arrangement is further configured to:

select a value for the correction parameter according to at least one of the at least two optical paths; and

apply the correction parameter to the intensity values derived from the detected image.

14. The inspection apparatus of claim 11, wherein the computational arrangement is further configured to:

define at least one correction parameter to compensate for asymmetry between the at least two optical paths.

15. The inspection apparatus of claim 11, wherein the computational arrangement is further configured to:

apply a correction based at least on a position of the structure within a field of view of the optical system.

16. The inspection apparatus of claim 11, wherein the computational arrangement is further configured to:

apply correction parameters for correcting an asymmetry in intensity between illumination or imaging modes of the at least two optical paths and for correcting a variation in illumination intensity across a field of view of the optical system.

17. The inspection apparatus of claim 11, wherein the optical system comprises a dark field metrology apparatus.

18. The inspection apparatus of claim 11, wherein the structure comprises a plurality of gratings.

19. The inspection apparatus of claim 18, wherein the computational arrangement is further configured to:

measure a −

1^st order diffraction image of the plurality of gratings using one of the at least two optical paths; and

measure a +1^st order diffraction image of the plurality of gratings using another of the at least two optical paths.

20. The inspection apparatus of claim 19, wherein the correction applied by the computational arrangement includes a first correction to the measured −

1^st order diffraction image, and a second correction to the measured +1^st order diffraction image.