Thin biometric detection module

• US 9,536,128 B2
• Filed: 06/10/2014
• Issued: 01/03/2017
• Est. Priority Date: 10/16/2013
• Status: Active Grant

• Current Assignee: PixArt Imaging Incorporated
• Original Assignee: PixArt Imaging Incorporated
• Inventors: Gu, Ren-Hau, Chang, Yen-Min
• Primary Examiner(s): MOYER, ANDREW M
• Application Number:
  US14/300,401
• Publication Number:
  US 20150104083A1
• Time in Patent Office: 938 Days
• Field of Search: 382124-127
• US Class Current: 1/1
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: G06V 40/1341 Sensing with light passing through the finger

Abstract

There is provided a thin biometric detection module, which is advantageous in being able to detect scattered light from body tissue after the light transmitting in the body tissue without additional optical mechanism placed on the semiconductor optical detection pixel of the detection module for biometric detection.

Claims

1. A thin biometric detection module configured to detect at least one biometric characteristic of a part of human body, the thin biometric detection module comprising:

a substrate having a substrate surface;

a chip disposed on the substrate surface and comprising a semiconductor optical detection region;

at least one light source disposed on the substrate surface; and

an abrasion-proof layer formed on a chip surface of the chip without an optical mechanism for image scaling between the substrate surface and the abrasion-proof layer, and a distance from the chip surface to an upper surface of the abrasion-proof layer is smaller than 100 micrometers,

wherein the upper surface of the abrasion-proof layer is configured to be directly in contact with a body surface of the part of human body when detecting the biometric characteristic such that light emitted from the light source directly illuminates the body surface and sequentially passes through the part of human body and the abrasion-proof layer to be detected by the semiconductor optical detection region.

2. The thin biometric detection module as claimed in claim 1, further comprising a planar layer between the abrasion-proof layer and the chip surface.

3. The thin biometric detection module as claimed in claim 1, wherein the thin biometric detection module comprises two light sources respectively configured to emit light of different wavelengths, and the semiconductor optical detection region comprises two types of detection pixels respectively configured to detect the light of different wavelengths.

4. The thin biometric detection module as claimed in claim 1, further comprising a control module integrated in the chip or on the substrate and configured to control the light source and the semiconductor optical detection region.

5. The thin biometric detection module as claimed in claim 4, wherein the control module is configured to detect the biometric characteristic according to optical images captured by the semiconductor optical detection region at different or identical times.

6. The thin biometric detection module as claimed in claim 4, wherein the control module is configured to control the semiconductor optical detection region to capture optical images at a frame rate higher than 300 frames per second.

7. The thin biometric detection module as claimed in claim 1, wherein a distance between the chip and the light source is smaller than 8 millimeters.

8. The thin biometric detection module as claimed in claim 1, wherein the biometric characteristic comprises at least one of a blood oxygenation, a vein texture, a fingerprint, a pulse and a blood pressure.

9. The thin biometric detection module as claimed in claim 1, wherein the semiconductor optical detection region comprising a plurality of detection pixels arranged in an elongated shape or a rectangular shape.

10. The thin biometric detection module as claimed in claim 1, wherein a distance between an emission surface of the light source and the substrate surface is identical to a distance between the upper surface of the abrasion-proof layer and the substrate surface.

11. A thin biometric detection module configured to detect at least one biometric characteristic of a part of human body, the thin biometric detection module comprising:

a plurality of linear semiconductor optical detection regions;

at least one light source;

an abrasion-proof layer overlaid on the linear semiconductor optical detection regions without an optical mechanism for image scaling between the linear semiconductor optical detection regions and the abrasion-proof layer, and a thickness of the abrasion-proof layer is smaller than 100 micrometers; and

a control module electrically coupled to the linear semiconductor optical detection regions and the light source and configured to detect the biometric characteristic according to optical images of a body surface of the part of human body captured by different of the linear semiconductor optical detection regions at different times,

wherein an upper surface of the abrasion-proof layer is configured to be directly in contact with the body surface when detecting the biometric characteristic such that light emitted from the light source directly illuminates the body surface and sequentially passes through the part of human body and the abrasion-proof layer to be detected by the linear semiconductor optical detection regions.

12. The thin biometric detection module as claimed in claim 11, further comprising a planar layer between the abrasion-proof layer and the linear semiconductor optical detection regions, wherein a total thickness of the abrasion-proof layer and the planar layer is smaller than 100 micrometers.

13. The thin biometric detection module as claimed in claim 11, wherein the thin biometric detection module comprises two light sources respectively configured to emit light of different wavelengths, and the linear semiconductor optical detection regions comprise two types of detection pixels respectively configured to detect the light of different wavelengths.

14. The thin biometric detection module as claimed in claim 11, wherein the linear semiconductor optical detection regions are arranged in parallel along a predetermined direction.

15. The thin biometric detection module as claimed in claim 11, wherein the control module is configured to control the linear semiconductor optical detection regions to capture the optical images at a frame rate higher than 300 frames per second.

16. The thin biometric detection module as claimed in claim 11, wherein a distance between the linear semiconductor optical detection regions and the light source is smaller than 8 millimeters.

17. The thin biometric detection module as claimed in claim 11, wherein the biometric characteristic comprises at least one of a fingerprint, a vein texture, a pulse and a blood pressure.

18. The thin biometric detection module as claimed in claim 11, wherein a height of an emission surface of the light source is identical to that of an upper surface of the abrasion-proof layer.

19. The thin biometric detection module as claimed in claim 11, wherein the linear semiconductor optical detection regions are arranged adjacent to each other, or the linear semiconductor optical detection regions and a plurality of light sources are arranged alternatively.

20. A thin biometric detection module configured to detect at least one biometric characteristic of a part of human body, the thin biometric detection module comprising:

a semiconductor optical detection region configured to capture a plurality of optical images of a body surface of the part of human body at a frame rate higher than 300 frames per second;

at least one light source;

an abrasion-proof layer overlaid on the semiconductor optical detection region without an optical mechanism for image scaling between the semiconductor optical detection region and the abrasion-proof layer, and a thickness of the abrasion-proof layer is smaller than 100 micrometers; and

;

a control module electrically coupled to the semiconductor optical detection region and the light source and configured to generate a surface image associated with the body surface according to the optical images captured by the semiconductor optical detection region at different times to accordingly detect the biometric characteristic according to the surface image,

wherein an upper surface of the abrasion-proof layer is configured to be directly in contact with the body surface when detecting the biometric characteristic such that light emitted from the light source directly illuminates the body surface and sequentially passes through the part of human body and the abrasion-proof layer to be detected by the semiconductor optical detection region.