Dual-interface IC card components and method for manufacturing the dual-interface IC card components

• US 9,536,188 B2
• Filed: 04/02/2015
• Issued: 01/03/2017
• Est. Priority Date: 04/01/2014
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Schoengrundner, Patrick, Eiper, Ernst, Zenz, Christian
• Primary Examiner(s): Kim, Ahshik
• Application Number:
  US14/677,836
• Publication Number:
  US 20150278674A1
• Time in Patent Office: 642 Days
• Field of Search: 235/492, 235/451, 235/488, 340/572.7, 340/572.8
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/12042 : LASER

Abstract

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.

Claims

1. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer;

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card; and

attaching an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises only applying the adhesive material to an area of the substrate that is covered by the encapsulation.

2. The method of claim 1, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises:

picking up an antenna contact lead; and

placing the antenna contact lead on the single-sided contact base structure to attach the antenna contact lead to the single-sided contact base structure.

3. The method of claim 1, further comprising electrically connecting the at least one antenna contact lead to an antenna located on the substrate through a bond wire or other electrical connection.

4. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer;

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card; and

attaching an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises applying the adhesive material to an area of the substrate that is covered by the encapsulation and another area that is not covered by the encapsulation to form a break joint between the at least one antenna contact lead and the substrate.

5. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises;

applying the adhesive material to the substrate of the single-sided contact base structure; and

placing an antenna contact lead on the applied adhesive material to attach the antenna contact lead to the single-sided contact base structure.

6. The method of claim 5, wherein applying the adhesive material to the substrate comprises dispensing glue onto the substrate.

7. The method of claim 5, further comprising curing the adhesive material.

8. The method of claim 7, further plating the at least one antenna contact lead after curing the adhesive material.

9. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact lead and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card; and

placing the antenna contact lead with the applied adhesive material on the single-sided contact base structure to attach the antenna contact lead to the single-sided contact base structure.

10. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card,

wherein the contact layer is attached to a first side of the substrate, and wherein the at least one antenna contact lead is attached to a second, opposite, side of the substrate.

11. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card,

wherein the at least one antenna contact lead is obtained by punching, etching or laser cutting a sheet or a reel to reel of a conductive material or a sheet or a reel to reel of a non-conductive material with a conductive plating.

12. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card,

wherein obtaining the single-sided contact base structure comprises obtaining a single-sided contact tape.

13. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer;

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card; and

attaching an IC chip, at least one bond wire or other electrical connection and an encapsulation to the dual-interface contact structure to produce the dual-interface IC chip module.

14. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card,

wherein after the at least one antenna contact lead is attached to the single-sided contact base structure, the at least one antenna contact lead can move in a portion of the overlapping area that is not covered by the adhesive material while maintaining an electrical connection to an antenna of the dual-interface IC card.

15. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card,

wherein the adhesive material comprises one of conductive glue, non-conductive glue, a double sided sticky tape and an anisotropic conductive foil.

16. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a base structure, wherein the base structure comprises a substrate;

attaching at least one antenna contact lead to the base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card;

plating the at least one antenna contact and the base structure with at least one metal material; and

attaching an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module, wherein attaching the at least one antenna contact lead to the base structure comprises only applying the adhesive material to an area of the substrate that is covered by the encapsulation.

17. The method of claim 16, wherein the metal material comprises one of nickel (Ni), gold (Au) or palladium (pd).

18. A dual-interface integrated circuit (IC) card component, the dual-interface IC card component comprising:

a substrate;

an electrical contact layer attached to a first side of the substrate, the electrical contact layer comprising a contact plate and a plurality of grooves;

at least one antenna contact lead glued to a second, opposite, side of the substrate in an area of the at least one antenna contact so that the glue partially covers the overlapping area of the at least one antenna contact and the substrate; and

an encapsulation attached to the dual-interface contact structure to produce a dual-interface IC chip module, wherein the at least one antenna contact lead is attached to the single-sided contact base structure, and wherein the adhesive material is applied to an area of the substrate that is covered by the encapsulation and another area that is not covered by the encapsulation to form a break joint between the at least one antenna contact lead and the substrate.