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Dual-interface IC card components and method for manufacturing the dual-interface IC card components

  • US 9,536,188 B2
  • Filed: 04/02/2015
  • Issued: 01/03/2017
  • Est. Priority Date: 04/01/2014
  • Status: Active Grant
First Claim
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1. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

  • obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer;

    attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card; and

    attaching an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises only applying the adhesive material to an area of the substrate that is covered by the encapsulation.

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