Stack package and semiconductor integrated circuit device including a variable voltage
First Claim
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1. A stack package comprising:
- a first chip including a first internal circuit unit driven by an internal voltage;
a second chip including a second internal circuit unit driven by the internal voltage, the second chip stacked over the first chip;
an interconnecting unit electrically coupled between the first chip and the second chip; and
an interface circuit unit arranged in the first chip and the second chip, the interface circuit unit coupled to the interconnecting unit,wherein a portion of the interface circuit unit is configured to receive a variable voltage different from the internal voltage as a driving voltage.
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Abstract
A stack package may include a first chip, a second chip, a through silicon via (TSV) and an interface circuit unit. The first chip may include a first internal circuit unit driven by an internal voltage. The second chip may be stacked over the first chip. The second chip may include a second internal circuit unit driven by the internal voltage. The TSV may be electrically coupled between the first chip and the second chip. The interface circuit unit may be arranged in the first chip and the second chip. The interface circuit unit may be coupled to the TSV. A portion of the interface circuit unit may be received a variable voltage different from the internal voltage as a driving voltage.
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Citations
21 Claims
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1. A stack package comprising:
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a first chip including a first internal circuit unit driven by an internal voltage; a second chip including a second internal circuit unit driven by the internal voltage, the second chip stacked over the first chip; an interconnecting unit electrically coupled between the first chip and the second chip; and an interface circuit unit arranged in the first chip and the second chip, the interface circuit unit coupled to the interconnecting unit, wherein a portion of the interface circuit unit is configured to receive a variable voltage different from the internal voltage as a driving voltage. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor integrated circuit device comprising:
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a first internal circuit unit; a transmitter coupled to the first internal circuit unit; a receiver coupled to the transmitter; and a second internal circuit unit coupled to the receiver, wherein the first internal circuit unit, the receiver and the second internal circuit unit are configured to receive an internal voltage as a driving voltage, and the transmitter is configured to receive a variable voltage greater or less than the internal voltage as the driving voltage. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification