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Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods

  • US 9,536,840 B2
  • Filed: 02/12/2013
  • Issued: 01/03/2017
  • Est. Priority Date: 02/12/2013
  • Status: Active Grant
First Claim
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1. A monolithic three-dimensional (3-D) integrated circuit (3DIC), comprising:

  • a first semiconductor integrated circuit tier comprising a first one or more active components;

    a second semiconductor integrated circuit tier comprising a second one or more active components vertically positioned relative to the first semiconductor integrated circuit tier; and

    at least one graphene layer disposed between the first and second semiconductor integrated circuit tiers and extending from a first exterior edge of the monolithic 3DIC to a second opposite exterior edge of the monolithic 3DIC, the at least one graphene layer electrically isolated from all active components in the first and second semiconductor integrated circuit tiers, wherein the at least one graphene layer is coupled to ground.

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