Encapsulation of light-emitting elements on a display module

• US 9,538,588 B2
• Filed: 09/22/2015
• Issued: 01/03/2017
• Est. Priority Date: 12/10/2012
• Status: Active Grant

• Current Assignee: Daktronics Incorporated
• Original Assignee: Daktronics Incorporated
• Inventors: Mutschelknaus, Shannon Lee, Gab, Jordan, Nearman, Nathan Lane, Nielsen, Ryan J.
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US14/861,403
• Publication Number:
  US 20160014854A1
• Time in Patent Office: 469 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: F21V 19/002 the fastening means engaging the encapsulation or the packaging of the semiconductor device
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 27/008 Sun shades, shades, hoods or louvres on electronic displays to minimise the effect of direct sun light on the display
• CPC Class Codes: G09F 9/3026 Video wall, i.e. stackable semiconductor matrix display modules video wall control systems G06F3/1446, G09G2300/026
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H04N 9/30 using solid-state colour display devices
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1327 Moulding over PCB locally or completely
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A video display module comprises a circuit board having a front face, a plurality of light-emitting elements electrically coupled to the front face of the circuit board, and a polymer encapsulating member adhered to the front face of the circuit board, the polymer encapsulating member substantially covering at least a portion of the circuit board and a portion of the plurality of light-emitting elements, the polymer encapsulating member substantially sealing the portion of the circuit board and the portion of the plurality of light-emitting elements.

Claims

1. A video display module comprising:

a circuit board having a front face;

a plurality of light-emitting elements mounted to the front face of the circuit board;

one or more electronic components mounted to the circuit board; and

a polymer encapsulating member bonded to and substantially covering at least a portion of the circuit board, at least a portion of each of the plurality of light-emitting elements, and at least a portion of each of the one or more electronic components, wherein the polymer encapsulating member substantially seals the portion of the circuit board, the portion of each of the plurality of light-emitting elements, and the portion of each of the one or more electronic components.

2. The video display module of claim 1, wherein the polymer encapsulating member has a profile that substantially corresponds to a mating profile of the portion of the circuit board and the of each of the plurality of light-emitting elements.

3. The video display module of claim 1, wherein at least one of the portion of the circuit board, the portion of each of the plurality of light-emitting elements, or the portion of each of the one or more electronic components is treated to promote bonding between the polymer encapsulating member and the treated portion of the circuit board, the treated portion of the plurality of light-emitting elements, or the treated portion of the one or more electronic components.

4. The video display module of claim 3, wherein at least one of the portion of the circuit board, the portion of each of the plurality of light-emitting elements, or the portion of each of the one or more electronic components is treated by at least one of plasma treating, flame treating, or application of a primer thereto.

5. The video display module of claim 1, wherein the plurality of light-emitting elements comprises surface-mounted light-emitting elements.

6. The video display module of claim 1, wherein at least a portion of the polymer encapsulating member over each of the plurality of light-emitting elements is substantially transparent to visible light.

7. The video display module of claim 1, further comprising a louver mounted over the polymer encapsulating member.

8. The video display module of claim 1, wherein the circuit board comprises a rear face opposing the front face and an edge along one or more sides extending rearward from the front face toward the rear face, wherein the polymer encapsulating member covers and is bonded to substantially all of the front face, substantially all of the edge, and substantially all of the rear face.

9. The video display module of claim 8, wherein the front face, the edge, and the rear face of the circuit board are treated to promote adhesion between the polymer encapsulating member and the front face and the rear face.

10. The video display module of claim 1, wherein the polymer encapsulating member comprises a silicone or polyurethane material.

20. The video display module of claim 1, wherein the polymer encapsulating member is bonded to and covers substantially the entirety of exposed surfaces of each of the plurality of light-emitting elements and of each of the one or more electronic components, and wherein the polymer encapsulating member substantially seals the exposed surfaces of each of the plurality of light-emitting elements and of each of the one or more electronic components.

11. A video display module comprising:

a circuit board having a front face;

a plurality of light-emitting elements electrically coupled to the front face of the circuit board; and

a polymer encapsulating member molded or casted onto the circuit board so that the polymer encapsulating member substantially covering at least a portion of the circuit board and substantially the entirety of exposed surfaces of each of the plurality of light-emitting elements, the polymer encapsulating member substantially sealing the portion of the circuit board and substantially the entirety of the exposed surfaces of each of the plurality of light-emitting elements.

12. The video display module of claim 11, wherein at least one of the portion of the circuit board or substantially the entirety of the exposed surfaces of each of the plurality of light-emitting elements is treated to promote bonding between the polymer encapsulating member and the portion of the circuit board or substantially the entirety of the exposed surfaces of the plurality of light-emitting elements.

13. The video display module of claim 12, wherein at least one of the portion of the circuit board or substantially the entirety of the exposed surfaces of each of the plurality of light-emitting elements is treated by at least one of plasma treating, flame treating, and application of a primer thereto.

14. The video display module of claim 11, wherein the plurality of light-emitting elements comprises surface-mounted light-emitting elements.

15. The video display module of claim 11, wherein at least a portion of the polymer encapsulating member over each of the plurality of light-emitting elements is substantially transparent to visible light.

16. The video display module of claim 11, further comprising a louver mounted over the polymer encapsulating member.

17. The video display module of claim 11, wherein the circuit board comprises a rear face opposing the front face and an edge along one or more sides extending rearward from the front face toward the rear face, wherein the polymer encapsulating member covers and is bonded to substantially all of the front face, substantially all of the edge, and substantially all of the rear face.

18. The video display module of claim 17, wherein the front face, the edge, and the rear face of the circuit board are treated to promote adhesion between the polymer encapsulating member and the front face and the rear face.

19. The video display module of claim 11, wherein the polymer encapsulating member comprises a silicone or polyurethane material.