Electronic package structure
First Claim
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1. An electronic package structure, comprising:
- a first electronic device, comprising a first discrete conductive element and a body, wherein a cavity is formed on a top surface of the body, wherein the body comprises a first unitary portion enclosing the first discrete conductive element therein, wherein the bottom surface of the cavity is entirely formed by a surface of said first unitary portion of the body; and
a second electronic device, disposed in the cavity, wherein the second electronic device is disposed over the bottom surface of the cavity, and the first discrete conductive element and the second electronic device are located at two opposite sides of the bottom surface of the cavity, wherein the electronic package structure is a DC/DC converter or a point-of-load (POL) converter.
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Accused Products
Abstract
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
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Citations
18 Claims
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1. An electronic package structure, comprising:
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a first electronic device, comprising a first discrete conductive element and a body, wherein a cavity is formed on a top surface of the body, wherein the body comprises a first unitary portion enclosing the first discrete conductive element therein, wherein the bottom surface of the cavity is entirely formed by a surface of said first unitary portion of the body; and a second electronic device, disposed in the cavity, wherein the second electronic device is disposed over the bottom surface of the cavity, and the first discrete conductive element and the second electronic device are located at two opposite sides of the bottom surface of the cavity, wherein the electronic package structure is a DC/DC converter or a point-of-load (POL) converter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An electronic package structure, comprising:
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a first electronic device, comprising a first discrete coil and a magnetic body, wherein a cavity is formed on a top surface of the magnetic body, wherein the magnetic body comprises a first unitary portion enclosing the first discrete coil therein, wherein the bottom surface of the cavity is entirely formed by a surface of said first unitary portion of the magnetic body; and a second electronic device, disposed in the cavity, wherein the second electronic device is disposed over the bottom surface of the cavity, and the first discrete coil and the second electronic device are located at two opposite sides of the bottom surface of the cavity.
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18. An electronic package structure, comprising:
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a first electronic device, comprising a first discrete conductive element and a body, wherein a cavity is formed on a top surface of the body, wherein the body comprises a first unitary portion enclosing the first discrete conductive element therein, wherein the bottom surface of the cavity is entirely formed by a surface of said first unitary portion of the body; and a second electronic device, disposed in the cavity, wherein the second electronic device is disposed over the bottom surface of the cavity, and the first discrete conductive element and the second electronic device are located at two opposite sides of the bottom surface of the cavity, wherein the second electronic device is disposed on a lead frame, wherein the lead frame is disposed in the cavity and electrically connected to said first discrete conductive element.
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Specification