Permittivity shielding

• US 9,538,958 B2
• Filed: 03/14/2013
• Issued: 01/10/2017
• Est. Priority Date: 03/16/2012
• Status: Active Grant

• Current Assignee: Endotronix, Inc.
• Original Assignee: Endotronix, Inc.
• Inventors: Boedecker, Volker, Niemeyer, Axel, Wagner, Bernhard
• Primary Examiner(s): Cheng, Jacqueline
• Assistant Examiner(s): Agahi, Puya
• Application Number:
  US14/385,691
• Publication Number:
  US 20150374295A1
• Time in Patent Office: 1,398 Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/0214 Capacitive electrodes
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 2562/182 Electrical shielding, e.g. using a Faraday cage
• CPC Class Codes: A61B 5/021 Measuring pressure in heart or blood vessels A61B5/0205 takes precedence
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/6876 Blood vessel
• CPC Class Codes: A61M 2205/3331 Pressure; Flow
• CPC Class Codes: G01L 11/025 using a pressure-sensitive optical fibre

Abstract

Techniques for shielding permittivity-sensitive devices are disclosed.

Claims

1. A bioimplantable sensor device shielded against changing permittivity comprising:

a semiconductor device having an exterior surface with a sensor formed thereon;

a first layer of metallic adhesive adhered to a portion of the exterior surface of the semiconductor device;

a layer of permittivity shielding overlying and adhered to the first layer of metallic adhesive;

a second layer of metallic adhesive overlying and adhered to the layer of permittivity shielding; and

a biocompatible, outermost protective layer overlying and adhered to the second layer of metallic adhesive;

wherein the first layer of metallic adhesive, the layer of permittivity shielding, and the second layer of metallic adhesive cover the entire exterior surface of the semiconductor device except a part of the surface on which the sensor is formed.

2. The device of claim 1, wherein the sensor is a microelectromechanical system.

3. The device of claim 1 wherein the semiconductor device is a complementary metal-oxide semiconductor device.

4. The device of claim 3, wherein the sensor is a microelectromechanical system.

5. The device of claim 4, wherein the sensor is a capacitive pressure sensor.

6. The device of claim 5, wherein the first layer of metallic adhesive and the second layer of metallic adhesive are an alloy of tungsten and titanium.

7. The device of claim 6, wherein the layer of permittivity shielding comprises gold.

8. The device of claim 7, wherein the protective layer comprises silicone.

9. The device of claim 1, wherein the first layer of metallic adhesive and the second layer of metallic adhesive are the same material.

10. The device of claim 9, wherein the material of the first and second layers of metallic adhesive comprise tungsten.

11. The device of claim 10, wherein the material of the first and second layers of metallic adhesive is an alloy of tungsten and titanium.

12. The device of claim 1, wherein the layer of permittivity shielding comprises a highly conductive metal or metal alloy.

13. The device of claim 12, wherein the layer of permittivity shielding comprises gold.

14. The device of claim 12, wherein the layer of permittivity shielding is galvanically deposited.

15. The device of claim 12, wherein the layer of permittivity shielding is sputter deposited.

16. The device of claim 1, wherein the protective layer comprises silicone.

17. A bioimplantable sensor device shielded against changing permittivity comprising:

a semiconductor device having an exterior surface with a sensor formed thereon;

a first biocompatible protective layer overlying and adhered to a portion of the exterior surface of the semiconductor device;

a first layer of metallic adhesive overlying and adhered to the first biocompatible protective layer;

a layer of permittivity shielding overlying and adhered to the first layer of metallic adhesive;

a second layer of metallic adhesive overlying and adhered to the layer of permittivity shielding; and

a second, outermost biocompatible protective layer overlying and adhered to the second layer of metallic adhesive;

wherein the first layer of metallic adhesive, the layer of permittivity shielding, and the second layer of metallic adhesive cover the entire exterior surface of the semiconductor device except a part of the surface on which the sensor is formed.

18. The device of claim 17, wherein the first and second biocompatible protective layers both comprise silicone.

19. The device of claim 17, wherein the layer of permittivity shielding comprises gold.

20. The device of claim 17, wherein the first and second layers of metallic adhesive both comprise an alloy of tungsten and titanium.