Golf ball with encapsulated RFID chip

• US 9,539,471 B2
• Filed: 04/11/2012
• Issued: 01/10/2017
• Est. Priority Date: 08/18/2010
• Status: Expired due to Fees

• Current Assignee: Edge Technologies, Inc
• Original Assignee: Edge Technologies, Inc
• Inventors: Luciano, Robert Jr., White, Warren, Grieshaber, David
• Primary Examiner(s): BLOUNT, ERIC
• Application Number:
  US13/444,679
• Publication Number:
  US 20120255999A1
• Time in Patent Office: 1,735 Days
• Field of Search: 340/572.8
• US Class Current: 1/1
• CPC Class Codes: A63B 2024/0037 on a target surface or at impact on the ground
• CPC Class Codes: A63B 2220/10 Positions
• CPC Class Codes: A63B 2225/15 with identification means that can be read by electronic means
• CPC Class Codes: A63B 2225/54 Transponders, e.g. RFID
• CPC Class Codes: A63B 37/0003 Golf balls
• CPC Class Codes: A63B 43/00 Balls with special arrangements
• CPC Class Codes: B29C 43/027 having an axis of symmetry B29C43/102 takes precedence
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence

Abstract

A spherical compressible ball having an RFID tag is described. The ball comprises an RFID integrated circuit, an encapsulating material, a first antenna contact, a first conductive wire, a molded compressible core, and a molded shell. The RFID integrated circuit includes a memory that stores a unique identifier. The encapsulating material encapsulates the RFID integrated circuit. The first antenna contact is electrically coupled to the encapsulated RFID integrated circuit. The first conductive wire is electrically coupled to the first antenna contact. The molded compressible core includes a molded impression that receives the encapsulated RFID integrated circuit and the conductive wire. The molded shell further encapsulates the molded compressible core that receives the encapsulated RFID integrated circuit and antenna.

Claims

1. A spherical compressible ball having an RFID tag, the ball comprising,

an RFID integrated circuit that includes a memory configured to store at least one unique identifier;

an encapsulating material that encapsulates the RFID integrated circuit to form an encapsulated RFID integrated circuit;

a plurality of RFID contact pads that are electrically coupled to the encapsulated RFID integrated circuit;

a wire that is electrically coupled to one of the plurality of RFID contact pads;

a plurality of stranded wires that is electrically coupled to the wire, the wire having a thickness that is greater than a thickness of the plurality of stranded wires;

a molded compressible core that includes a molded impression configured to receive the encapsulated RFID integrated circuit and the plurality of stranded wires; and

a molded shell that further encapsulates the molded compressible core.

2. The compressible ball of claim 1 wherein the plurality of stranded wires are braided.

3. The compressible ball of claim 1 further comprising a first antenna contact and a second antenna contact, the first antenna contact and the second antenna contact electrically coupled to the encapsulated RFID integrated circuit, wherein a first plurality of stranded wires is electrically coupled to the first antenna contact and a second plurality of stranded wires is electrically coupled to the second antenna contact.

4. The compressible ball of claim 1 wherein the encapsulating material that encapsulates the RFID integrated circuit comprises a compressible material.

5. The compressible ball of claim 1 wherein the encapsulating material that encapsulates the RFID integrated circuit comprises a rigid material.

6. The compressible ball of claim 1 wherein the molded impression is disposed on the surface of the compressible core and the molded impression receives the RFID integrated circuit.

7. The compressible ball of claim 1 wherein the molded impression is disposed at the center of the compressible core and the molded impression receives the RFID integrated circuit, the compressible ball further comprising,

a first antenna contact and a second antenna contact electrically coupled to the encapsulated RFID integrated circuit;

a first plurality of stranded wires electrically coupled to the first antenna contact and a second plurality of stranded wires electrically coupled to the second antenna contact;

the first plurality of stranded wires configured to extend from the center of the molded compressible core to the surface of the molded compressible core; and

the second plurality of stranded wires configured to extend from the center of the molded compressible core to the surface of the molded compressible core in a direction that is opposite to the first plurality of stranded wires.

8. The compressible ball of claim 1 further comprising a first plurality of stranded wires shaped as a sinusoidal waveform on the surface of the surface of the molded compressible core.

9. The compressible ball of claim 1 further comprising a first plurality of stranded wires that is joined to one of the plurality of RFID contact pads with a conductive material.

10. The compressible ball of claim 1 further comprising a first plurality of stranded wires that is joined to one of the plurality of RFID contact pads with a non-conductive material.

11. An RFID ball reading system, the system comprising,

an RFID reader that includes an antenna;

and

a spherical compressible ball having an RFID tag, the ball including,

an RFID integrated circuit that includes a memory configured to store at least one unique identifier;

an encapsulating material that encapsulates the RFID integrated circuit to form an encapsulated RFID integrated circuit;

a plurality of RFID contact pads that are electrically coupled to the encapsulated RFID integrated circuit;

a wire that is electrically coupled to one of the plurality of RFID contact pads

a plurality of stranded wires that is electrically coupled to the wire, the wire having a thickness that is greater than a thickness of the plurality of stranded wires;

a molded compressible core that includes a molded impression configured to receive the encapsulated RFID integrated circuit and the plurality of stranded wires; and

a molded shell that further encapsulates the molded compressible core.

12. The RFID ball reading system of claim 11, wherein the RFID reader is disposed above ground along a vertical plane.

13. The RFID ball reading system of claim 11, wherein the RFID reader is disposed along a horizontal plane.

14. The RFID ball reading system of claim 11 wherein each RFID reader is communicatively coupled to a plurality of antennas that correspond to a particular golf driving bay.

15. The RFID ball reading system of claim 11 further comprising a plurality of RFID readers that are networked and communicate RFID data to a central database.

16. A method for embedding an RFID integrated circuit into a compressible ball, the method comprising:

placing a compressible compound in a mold that includes a projection;

heating the compressible compound in the mold;

removing the mold;

generating a molded compressible core that includes a molded impression of the projection;

encapsulating the RFID integrated circuit in an encapsulating material to form an encapsulated RFID integrated circuit;

placing the encapsulated RFID integrated circuit into the molded impression such that the encapsulated RFID integrated circuit is disposed within a golf ball core, the RFID integrated circuit including a memory with at least one unique identifier, wherein the encapsulated RFID integrated circuit is electrically coupled to a plurality of RFID contact pads, at least one of the plurality of RFID contact pads electrically coupled to a wire, the wire electrically coupled to a plurality of stranded wires, the wire having a thickness that is greater than the thickness of the plurality of stranded wires; and

further encapsulating the molded compressible core in a molded shell.

17. The method for embedding an RFID integrated circuit into a compressible ball of claim 16, wherein the molded impression configured to receive the encapsulated RFID integrated circuit is on the spherical surface of the molded compressible core.

18. The method for embedding an RFID integrated circuit into a compressible ball of claim 16, wherein the molded impression configured to receive the encapsulated RFID integrated circuit is disposed in the center of the molded compressible core.