Method and structure of MEMS WLCSP fabrication

• US 9,540,232 B2
• Filed: 10/06/2014
• Issued: 01/10/2017
• Est. Priority Date: 11/12/2010
• Status: Active Grant

• Current Assignee: Movella Incorporated (Movella Holdings, Inc.)
• Original Assignee: mCube, Inc.
• Inventors: Lee, Chien Chen
• Primary Examiner(s): Ha, Nathan W
• Application Number:
  US14/507,177
• Publication Number:
  US 20150166330A1
• Time in Patent Office: 827 Days
• Field of Search: 257/416
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A method for fabricating a MEMS-IC device structure can include receiving a CMOS substrate comprising a plurality of CMOS circuits and a surface portion. A MEMS substrate having at least one MEMS device can be received and coupled to the CMOS substrate. The MEMS substrate and the surface portion of the CMOS substrate can be encapsulated with a molding material, which forms a top surface. A first plurality of vias can be created in the molding material from the top surface to the surface portion of the CMOS substrate. A conductive material can be disposed within the first plurality of vias such that the conductive material is electrically coupled to a portion of the CMOS substrate. A plurality of interconnects can be formed from the conductive material to the top surface of the molding material and a plurality of solder balls can be formed upon these interconnects.

Claims

1. A method for fabricating a MEMS (Micro Electro Mechanical System) IC (Integrated Circuit) device comprising:

receiving a CMOS substrate comprising a plurality of CMOS circuits and a first plurality of interconnection locations, wherein the first plurality of interconnection locations comprises a first set of locations and a second set of locations, wherein the CMOS substrate includes a surface portion, and wherein the first set of locations is disposed upon the surface portion;

receiving a MEMS substrate comprising at least one MEMS device and a second plurality of interconnection locations comprising a third set of locations;

coupling the MEMS substrate to the CMOS substrate such that the second set of locations are coupled to the third set of locations;

encapsulating the MEMS substrate and the surface portion of the CMOS substrate with a molding material, wherein the molding material forms a top surface;

creating a first plurality of vias in the molding material from the top surface to the surface portion of the CMOS substrate, thereby exposing at least a portion of the first set of locations;

disposing a conductive material in the first plurality of vias such that the conductive material is electrically coupled to the first set of locations; and

forming a plurality of interconnects from the conductive material to the top surface of the molding material.

2. The method of claim 1 further comprising forming a plurality of solder balls upon the plurality of interconnects.

3. The method of claim 1 wherein creating the first plurality of vias in the molding material comprises applying a laser drill to the molding material to thereby create the one or more vias from the top surface to the surface portion of the CMOS substrate.

4. The method of claim 1 wherein forming a plurality of interconnects comprises forming a RDL (Redistribution Layer) overlying top surface of the molding material.

5. The method of claim 1 wherein the encapsulating of the MEMS substrate and the surface portion of the CMOS substrate with a molding material comprises encapsulating the MEMS substrate and the surface portion of the CMOS substrate with a plastic material, a polymer material, or an epoxy resin material.

6. The method of claim 1 wherein the disposing of the conductive material in the first plurality of vias comprises disposing a copper material, a silver material, a polymer material, or an epoxy resin material.

7. The method of claim 1 further comprising

physically coupling an additional MEMS substrate to the MEMS substrate, wherein the additional MEMS substrate comprises an upper surface and a fourth set of locations;

and

wherein encapsulating the MEMS substrate comprises encapsulating the MEMS substrate, the additional MEMS substrate, and the surface portion of the CMOS substrate with a molding material, wherein the molding material forms a top surface.

8. The method of claim 7 further comprising:

creating a second plurality of vias in the molding material from the top surface of the molding material to the upper surface of the additional MEMS substrate, thereby exposing at least a portion of the fourth set of locations; and

disposing the conductive material in the second plurality of vias such that the conductive material is electrically coupled to the fourth set of locations.

9. The method of claim 8 wherein the additional MEMS substrate is selected from a group consisting of:

a magnetic sensor, a gyroscope, a pressure sensor.

10. The method of claim 8 wherein the MEMS substrate comprises a multi-axis accelerometer.

11. A method for fabricating a MEMS (Micro Electro Mechanical System) IC (Integrated Circuit) device comprising:

receiving a CMOS substrate comprising a plurality of CMOS circuits and a first plurality of interconnection locations, wherein the first plurality of interconnection locations comprises a first set of locations and a second set of locations, wherein the CMOS substrate includes a surface portion, and wherein the first set of locations is disposed upon the surface portion;

receiving a MEMS substrate comprising at least one MEMS device and a second plurality of interconnection locations comprising a third set of locations;

coupling the MEMS substrate to the CMOS substrate such that the second set of locations are coupled to the third set of locations, and the first set of locations being exposed outside the MEMS substrate;

encapsulating the MEMS substrate and the surface portion of the CMOS substrate with a molding material, wherein the molding material forms a top surface;

creating a first plurality of vias in the molding material from the top surface to the surface portion of the CMOS substrate, thereby exposing at least a portion of the first set of locations;

disposing a conductive material in the first plurality of vias such that the conductive material is electrically coupled to the first set of locations; and

forming a plurality of interconnects from the conductive material to the top surface of the molding material.

12. The method of claim 11 further comprising forming a plurality of solder balls upon the plurality of interconnects.

13. A method for fabricating a MEMS (Micro Electro Mechanical System) IC (Integrated Circuit) device comprising:

receiving a CMOS substrate comprising a plurality of CMOS circuits and a first plurality of interconnection locations, wherein the first plurality of interconnection locations comprises a first set of locations and a second set of locations, wherein the CMOS substrate includes a surface portion, and wherein the first set of locations is disposed upon the surface portion;

receiving a MEMS substrate comprising at least one MEMS device and a second plurality of interconnection locations comprising a third set of locations;

coupling the MEMS substrate to the CMOS substrate such that the second set of locations are electrically coupled to the third set of locations;

coupling at least one of the first set of locations to a contact point on top of the MEMS substrate using a wire;

encapsulating the MEMS substrate and the surface portion of the CMOS substrate with a molding material, wherein the molding material forms a top surface;

partially removing the molding material to expose the wire; and

forming a plurality of interconnects overlying the molding material, at least one interconnect being coupled to the exposed wire.

14. The claim of 13, further comprising forming a plurality of solder balls upon the plurality of interconnects.