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Pressure sensor including deformable pressure vessel(s)

  • US 9,541,462 B2
  • Filed: 08/29/2014
  • Issued: 01/10/2017
  • Est. Priority Date: 08/29/2014
  • Status: Active Grant
First Claim
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1. A pressure sensor comprising:

  • a semiconductor substrate that includes a first cavity;

    a pressure vessel made from a dielectric lining that is formed in a trench that has an aspect ratio greater than four, the pressure vessel having a cross section that defines a void, the pressure vessel having at least one curved portion that is configured to structurally deform based on a pressure difference between a cavity pressure in the first cavity and a vessel pressure in the pressure vessel, at least a first portion of the pressure vessel suspended in the first cavity; and

    a first transducer coupled to the first portion of the pressure vessel, the first transducer having an attribute that changes with structural deformation of the pressure vessel.

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