RFID tag and micro chip integration design
First Claim
Patent Images
1. An RFID tag comprising:
- a substrate;
a conductive antenna pattern including an antenna feed line that connects two terminal ends of the antenna pattern, and a line break in the antenna feed line, wherein the line break has a maximum width of 100 μ
m or less; and
a micro RFID chip bonded to the antenna feed line on opposite sides of the line break, wherein the micro RFID chip has a maximum length and width of 100 μ
m or less, and the RFID chip is bonded to the antenna feed line with solder bonds.
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Abstract
An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.
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Citations
16 Claims
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1. An RFID tag comprising:
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a substrate; a conductive antenna pattern including an antenna feed line that connects two terminal ends of the antenna pattern, and a line break in the antenna feed line, wherein the line break has a maximum width of 100 μ
m or less; anda micro RFID chip bonded to the antenna feed line on opposite sides of the line break, wherein the micro RFID chip has a maximum length and width of 100 μ
m or less, and the RFID chip is bonded to the antenna feed line with solder bonds. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of integrating a micro RFID chip comprising:
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cutting an array of conductive patterns on a substrate to form an array of line breaks in the array of conductive patterns; picking up an array of micro RFID chips from a carrier substrate with a corresponding array of electrostatic transfer heads of an electrostatic transfer head assembly, wherein each micro RFID chip has a maximum length and width of 100 μ
m or less; andtransferring thermal energy from the electrostatic transfer head assembly and through the array of micro RFID chips to bond the array of micro RFID chips to the array of conductive patterns on opposite sides of the corresponding line breaks with solder bonds. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification