Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum

• US 9,543,180 B2
• Filed: 08/01/2014
• Issued: 01/10/2017
• Est. Priority Date: 08/01/2014
• Status: Active Grant

• Current Assignee: ASM IP Holding B.V. (ASM International NV)
• Original Assignee: ASM IP Holding B.V. (ASM International NV)
• Inventors: Kamiya, Tatsuo
• Primary Examiner(s): MYERS, GLENN F
• Application Number:
  US14/449,838
• Publication Number:
  US 20160035596A1
• Time in Patent Office: 893 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67736 Loading to or unloading from a conveyor
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/67775 Docking arrangements
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers

Abstract

An integrated transport device for a wafer carrier includes: an evacuatable chamber for accommodating therein a wafer carrier having a front opening with a cover; a rotatable platform for placing the wafer carrier thereon in the chamber; and an opening/closing device for opening and closing the cover of the wafer carrier placed on the platform at a first position, wherein the platform rotates to set the wafer carrier at the first position and a second position for transporting a wafer to a wafer-handling chamber.

Claims

1. An integrated transport device for a wafer carrier, comprising:

an evacuatable chamber for accommodating therein the wafer carrier having a front opening with a cover, said evacuatable chamber having a rear opening with a gate valve, said rear opening with the gate valve being adapted to communicate gas-tightly with the interior of a wafer-handling chamber;

a platform for placing the wafer carrier thereon in the evacuatable chamber, said platform being rotatable so as to set the wafer carrier at a first position for opening and closing the cover and at a second position for transporting wafers between the wafer carrier and the wafer-handling chamber; and

an opening/closing device for opening and closing the cover of the wafer carrier placed on the platform at the first position, said opening/closing device being provided in a wall of the evacuatable chamber facing the cover of the wafer carrier, said opening/closing device comprising an internal part provided on an inner side of the wall of the evacuatable chamber and an external part provided on an outer side opposite to the inner side of the wall of the evacuatable chamber, said internal part being extendable and retractable for opening and closing the cover, said external part actuating movement of the internal part,

wherein the platform is movable in a vertical direction,

the evacuatable chamber has a top opening with a lid, for loading and unloading the wafer carrier to and from the evacuatable chamber, and

the evacuatable chamber is provided with an exhaust line for evacuating the interior of the evacuatable chamber.

2. The integrated transport device according to claim 1, wherein the wafer carrier is a FOUP (front opening unified pod).

3. The integrated transport device according to claim 1, wherein the lid is operable to open from a closed position by moving upward and then rotating on a horizontal plane, and to close from an open position by rotating on the horizontal plane and then moving downward.

4. The integrated transport device according to claim 1, wherein the opening/closing device is provided on a wall of the evacuatable chamber opposite to the rear opening.

5. The integrated transport device according to claim 1, wherein the internal part of the opening/closing device comprises a latching mechanism to latch the cover for opening and closing, and to hold the cover.

6. A semiconductor manufacturing apparatus using the integrated transport device of claim 1, comprising:

the wafer-handling chamber provided with a robotic arm for transferring the wafer;

at least one process chamber attached to the wafer-handling chamber wherein the process chamber is accessible by the robotic arm under vacuum; and

the integrated transport device attached to the wafer-handling chamber wherein the integrated transport device is accessible by the robotic arm under vacuum.

7. A load lock chamber constituted by the integrated transport device of claim 1, which is attached to the wafer-handling chamber, wherein said platform is movable in the vertical direction to adjust the height of the wafer carrier relative to the rear opening so that any wafer in the wafer carrier is accessible through the rear opening by a robotic arm installed in the wafer-handling chamber, and so that a wafer of said any wafer can be placed in any empty slot of the wafer carrier by the robotic arm.

8. The load lock chamber according to claim 7, wherein the wafer carrier is a FOUP (front opening unified pod).

9. A method for transporting wafers between a wafer carrier and a process tool, using the integrated transport device of claim 1 attached to a wafer-handling chamber, said method comprising:

loading to the evacuatable chamber a wafer carrier having a front opening with a cover facing in a direction toward the wafer-handling chamber, wherein the wafer carrier is placed on the platform, and the rear opening of the chamber is closed by the gate valve;

then rotating the platform with the wafer carrier to set the wafer carrier at the first position for opening and closing the cover;

then evacuating the chamber and slightly opening the cover using the opening/closing device;

then completely opening the cover using the opening/closing device and rotating the platform with the wafer carrier to set the wafer carrier at the second position for transporting wafers; and

then opening the gate valve and transporting wafers from the wafer carrier to the wafer-handling chamber for wafer-processing.

10. The method according to claim 9, further comprising, after the wafer-processing is complete:

opening the gate valve and transporting wafers from the wafer-handling chamber to the wafer carrier;

then rotating the platform with the wafer carrier to set the wafer carrier at the first position and closing the cover using the opening/closing device;

then breaking the vacuum of the chamber;

then rotating the platform with the wafer carrier to set the wafer carrier at the second position, and

unloading the wafer carrier from the chamber.

11. The method according to claim 9, wherein the wafer carrier is a FOUP (front opening unified pod).

12. The method according to claim 9, wherein the opening/closing device is provided opposite to the rear opening.

13. The method according to claim 9, wherein the chamber has a top opening with a lid, for loading and unloading the wafer carrier to and from the chamber, and the platform is movable in a vertical direction, wherein

the step of loading the wafer carrier comprises:

opening the lid of the chamber, where the platform is at a top position for receiving the wafer carrier; and

placing the wafer carrier on the platform; and

the step of rotating the platform comprises;

lowering and rotating the platform with the wafer carrier; and

closing the lid.

14. The method according to claim 9, wherein the platform is movable in a vertical direction, wherein

the step of transporting wafers comprises:

adjusting the height of the wafer carrier relative to the rear opening so that a wafer in the wafer carrier is accessible by a robotic arm installed in the wafer-handling chamber, and transporting the wafer from the wafer carrier to the wafer-handling chamber using the robotic arm.

15. The method according to claim 9, wherein loading the wafer carrier to the chamber is conducted using an overhead vehicle (OHV).

16. The method according to claim 10, wherein the chamber has a top opening with a lid, for loading and unloading the wafer carrier to and from the chamber, and the platform is movable in a vertical direction, wherein

the step of breaking the vacuum comprises opening the lid of the chamber;

the step of rotating the platform comprises rotating and raising the platform with the wafer carrier; and

the step of unloading the wafer carrier comprises opening the lid, and lifting the wafer carrier.

17. The method according to claim 10, wherein the platform is movable in a vertical direction, wherein

the step of transporting wafers comprises:

adjusting the height of the wafer carrier relative to the rear opening so that a wafer can be placed in an empty slot of the wafer carrier by a robotic arm installed in the wafer-handling chamber, and transporting the wafer from the wafer-handling chamber to the wafer carrier using the robotic arm.